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The semiconductor deposition market is envisaged to witness staggering growth and will post an impressive CAGR of more than 16% over the forecast period.Due to the increasing emphasis on the miniaturization of semiconductor devices, the market for semiconductor deposition will have a positive outlook in the coming years. Optimization in semiconductor device manufacturing technology along with the emergence of compact devices such as smartphones, tablets, notebooks, and slim and curved TVs has created a huge demand for small-sized ICs. Moreover, various sectors including telecommunication, automotive, industrial manufacturing, and healthcare are also looking to utilize compact electronic devices in their processes. The advent of new technologies such as 3D ICs and micro-electro-mechanical systems have resulted in significant changes in IC designing, such as the requirement for finer patterning and etching in microfabrication. Moreover, the increasing number of interconnects and transistors within the same has made ICs denser; thus, increasing the need for finer semiconductor deposition during the predicted period.
The augmented adoption of wearable technology is one of the important trends spurring the growth prospects for this market during the forecast period. Wearable technology is a mobile form of communication technology that is worn on the body and can be used to monitor daily activities and access smartphone facilities. It includes handy devices such as smart watches, smart fabrics, and heart rate monitors. With IC manufacturers like Toshiba starting to develop specialized ICs to support such devices, the market for smart wearables is anticipated to gain traction over the next four years. This is expected to propel the growth prospects for the semiconductor deposition market until the end of 2020.
During 2015, the foundries segment dominated the market and accounted for a market share of close to 63% in terms of revenue. The increasing demand for electronic devices, especially from developing APAC countries, is likely to bolster the demand for semiconductor devices such as logic, analog, memory, discrete, and sensor devices over the forecast period. To meet the rising demand, foundries need to upgrade equipment manufacturing units and ensure high throughput; thus, fuelling the demand for deposition equipment over the next four years.
In terms of geography, the APAC region will continue to dominate the global semiconductor deposition market and is expected to reach more than USD 13 billion by 2020. The growth of this market in APAC is attributed the presence of major semiconductor foundries such as TSMC, Samsung, and SMIC in the region. Also, major chip vendors in the region are investing in infrastructure development such as the construction of new fabs to increase throughput. These factors will fuel the growth of the semiconductor deposition market in the APAC region.
The global semiconductor deposition market is highly competitive owing to the presence of a few, well-established vendors. The new vendors in this market find it extremely difficult to compete with the major vendors because of the high initial investments required, constant technological advances in the industry, and the cyclical nature of the industry. Players in the market are constantly looking for ways to enhance their market presence by focusing on the implementation of various new technology and M&A activities.
Key vendors in this market are -
Other prominent vendors in the market are Aixtron SE, Canon Anelva Corporation, IHI, IQE, Plasma-Therm, and Veeco.
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During the process of semiconductor device fabrication, the different processing steps fall into four broad categories, namely deposition, patterning, removal, and modification of electrical characteristics. The process that grows, coats, or transfers a material onto the wafer is known as deposition. The various deposition techniques include chemical vapor deposition (CVD), physical vapor deposition (PVD), molecular beam epitaxy (MBE), electrochemical deposition (ECD), and atomic layer deposition (ALD).
The report, global semiconductor deposition market, is part of Technavio’s hardware and semiconductor research portfolio. This portfolio provides a comprehensive market analysis along with the market share, market sizing, and market segmentations covering areas such as computing devices, displays, embedded systems, human machine interface, lighting, semiconductor equipment, and sensors. These market research reports provide a perspective on the various market opportunities and market threats along with the key trends that would influence the market growth during the forecast period. It presents insights into the changing competitive landscape and a detailed profiling and market analysis of the vendors. Also covered in the research are the key regions or countries that would have an impact on the market during the assessment years.
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
PART 05: Market landscape
PART 06: Market segmentation by end-user
PART 07: Market segmentation by technology
PART 08: Geographical segmentation
PART 09: Key leading countries
PART 10: Market drivers
PART 11: Impact of drivers
PART 12: Market challenges
PART 13: Impact of drivers and challenges
PART 14: Market trends
PART 15: Vendor landscape
PART 16: Appendix
PART 17: Explore Technavio
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