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The organic substrate packaging material market size is forecast to increase by USD 3.51 billion between 2022 and 2027, accelerating at a CAGR of 4.7%. In 2017, China held the largest market share, projecting an annual revenue of USD 3.83 billion. The report covers the Organic Substrate Packaging Material Market industry forecast and is segmented into Application including consumer electronics, automotive, manufacturing, healthcare, and others, Technology including SO packages, GA packages, flat no-leads packages, and others), and Geography including APAC, North America, Europe, Middle East and Africa, and South America). The market size, historical market size (2017-2021), and forecasts are provided on the basis of value (USD billion) for all the above segments.
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The surge in global demand for consumer and smart electronic devices is a key factor boosting the market growth. The global smartphone market experienced remarkable growth, increasing from over USD 730 billion in 2019 to more than USD 940 billion in 2020, leading to an increased demand for organic substrate packaging materials for ICs used in smartphones. China, as the largest global smartphone market, is expected to continue witnessing high smartphone sales, mainly from domestic players like OPPO and VIVO, who benefit from a significant cost advantage over multinational competitors. The rising global demand for consumer electronics and smart devices is projected to drive growth in the global organic substrate packaging material market during the forecast period.
Consumer Electronics Segment Holds the Largest Market share
The consumer electronic segment was the largest segment and was valued at USD 4.12 billion in 2017. Consumer electronics are one of semiconductors' most important end-user markets. Some of the trending factors that have been driving this segment's growth include the expansion of the smartphone market, an increasing adoption of wearable and smart products, and a growing presence of consumer IoT devices for applications like home monitoring. According to numerous chip manufacturers, high-silicon 5G smartphones will be extremely popular worldwide during the forecast period.
Organic Substrate Packaging Material Market - Revenue Share by Consumer Electronics Segment, 2017-2027
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APAC Holds a Prominent Position in the Organic Substrate Packaging Material Market
APAC is estimated to contribute 67% to the growth of the global market during the forecast period. In the APAC region, technology powerhouses like Taiwan, China, Japan, and South Korea dominate the organic substrate packaging material market. These countries house both domestic and international firms continually innovating in this field. The recent reduction in tensions between China and Taiwan has led to greater integration in their semiconductor industries. The rising popularity of smart mobile devices and consumer electronics is driving the demand for these packaging materials.
Organic Substrate Packaging Material Market Size, By Region, Global, 2017-2027
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The Organic Substrate Packaging Material Market is fragmented in nature. Some significant players include Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT and S Austria Technologie and Systemtechnik Aktiengesellschaft, Compass Technology Co. Ltd., DuPont de Nemours Inc.
The research report also includes detailed analyses of the competitive landscape of the market and information about 15 market companies, including:
Fujikura Co. Ltd., Kyocera Corp., Micro Systems Technologies Management GmbH, Mitsubishi Electric Corp., Niterra Co. Ltd., Resonac Holdings Corp., Rogers Corp., Samsung Electronics Co. Ltd., Shinko Electric Industries Co. Ltd., Sumitomo Bakelite Co. Ltd., TAIYO YUDEN Co. Ltd., TDK Corp., TONG HSING Electronics Industries Ltd., TTM Technologies Inc., and Zhen Ding Technology Holding Ltd.
The organic substrate packaging material market report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2017 - 2027.
Organic Substrate Packaging Material Market Scope |
|
Report Coverage |
Details |
Page number |
171 |
Base year |
2022 |
Historic period |
2017 - 2021 |
Forecast period |
2023-2027 |
Growth momentum & CAGR |
Accelerate at a CAGR of 4.7% |
Market growth 2023-2027 |
USD 3.51 billion |
Market structure |
Fragmented |
YoY growth 2022-2023(%) |
4.1 |
Regional analysis |
APAC, North America, Europe, Middle East and Africa, and South America |
Performing market contribution |
APAC at 67% |
Key countries |
US, China, Taiwan, Japan, and South Korea |
Competitive landscape |
Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks |
Key companies profiled |
Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT and S Austria Technologie and Systemtechnik Aktiengesellschaft, Compass Technology Co. Ltd., DuPont de Nemours Inc., Fujikura Co. Ltd., Kyocera Corp., Micro Systems Technologies Management GmbH, Mitsubishi Electric Corp., Niterra Co. Ltd., Resonac Holdings Corp., Rogers Corp., Samsung Electronics Co. Ltd., Shinko Electric Industries Co. Ltd., Sumitomo Bakelite Co. Ltd., TAIYO YUDEN Co. Ltd., TDK Corp., TONG HSING Electronics Industries Ltd., TTM Technologies Inc., and Zhen Ding Technology Holding Ltd. |
Market dynamics |
Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID 19 impact and recovery analysis and future consumer dynamics, Market condition analysis for forecast period |
Customization purview |
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