0

Fan-out Wafer Level Packaging Market by Technology, Type, and Geography - Forecast and Analysis 2023-2027

  • Published: Jan 2023
  • Pages: 162
  • SKU: IRTNTR41471
Technavio

Enjoy complimentary customisation on priority with our Enterprise License!

Safe and Secure SSL Encrypted

info
close
  • Single:

    One user only.
    Quick & easy download option

  • Enterprise:

    Unlimited user access (Within your organization)
    Complimentary Customization Included

2500 USD

The fan-out wafer level packaging market is estimated to grow at a CAGR of 17.5% between 2022 and 2027. The size of the market is forecast to increase by USD 3,064.31 million. The growth of the market depends on serval factors, including the increased demand for compactly designed electronics, the growing use of semiconductor ICs in IoT, and the rapid adoption of FinFET technology.

This report extensively covers market segmentation by technology (high density and standard density), type (200 mm, 300 mm, and panel), and geography (APAC, North America, Europe, South America, and Middle East and Africa. It also includes an in-depth analysis of drivers, trends, and challenges. Furthermore, the report includes historic market data from 2017 to 2021.

What will be the size of the Fan-out Wafer Level Packaging Market During the Forecast Period?

Fan-out Wafer Level Packaging Market Size

To learn more about this report, Download Report Sample

Parent Market Analysis

Technavio categorizes the global fan-out wafer level packaging (FOWLP) market as a part of the global electronic components market within the electronics market. The parent global electronics market includes manufacturers of communications equipment, technology hardware storage and peripherals, electronic equipment and instruments, electronic components, consumer electronics, and industrial electronics products, as well as electronic manufacturing services. Our research report has extensively covered external factors influencing the parent market growth during the forecast period.

Fan-out Wafer Level Packaging Market: Key Drivers, Trends, Challenges, and Customer Landscape

The growing use of semiconductor ICs in IoT is notably driving the market growth, although factors such as the increased production costs because of warpage may impede the market growth. Our researchers analyzed the data with 2022 as the base year, along with the key drivers, trends, and challenges. A holistic analysis of drivers will help companies refine their marketing strategies to gain a competitive advantage.

Key Fan-out Wafer Level Packaging Market Driver

The growing use of semiconductor ICs in IoT is the key factor driving the global fan-out wafer level packaging market growth. The demand for these IoT devices is primarily driven by the developments in wired and wireless communication technologies, telecommunication standards such as 3G/4G/5G, and government initiatives on implementing energy-efficient systems and solutions. The increasing applications of IoT will give rise to the demand for IoT chipsets that are integrated into IoT devices. The chipsets used in these IoT devices include Wi-Fi modules, RF modules, FOWLP units (MCUs), and sensor modules.

Due to the rapid proliferation of mobile and IoT devices, the semiconductor packaging industry is facing strong demand for thin-profile semiconductor ICs and modules with a smaller footprint. This will accelerate the demand for FOWLP technology to package IoT chipsets on a smaller footprint. Thus, the rising adoption of IoT devices will boost the growth of the global market during the forecast period.

Significant Fan-out Wafer Level Packaging Market Trend

The rising panel-level packaging is the primary trend in the global fan-out wafer level packaging market growth. The increasing demand for low-cost, high-performance products has led to many innovations in the semiconductor industry. One of the innovative technologies that have helped in reducing the overall cost of wafer level packaging is the introduction of fan-out panel-level packaging. In this, the whole packaging process is shifted to a large-size panel format, which allows more components on the substrate to be simultaneously packaged and lowers the overall cost of packaging. This technology is highly preferred by OSAT companies, IDMs, substrate manufacturers, and fabless companies as it allows them to reduce manufacturing costs significantly. Further, panel-level packaging enables vendors to achieve high-volume manufacturing, as this is a current market demand owing to the increased demand for electronics across different industries.

Further, the trend toward the integration of a substantial number of functionalities on a single IC gives rise to the need for a packaging technology that can simultaneously provide higher I/O pins and ensure low manufacturing and packaging costs. Therefore, in this market scenario, many market vendors have started developing fan-out panel-level packaging technology, which is expected to drive the global FOWLP market during the forecast period. Therefore, the increasing demand for low-cost, high-performance products will accelerate the growth of the global FOWLP market during the forecast period.

Major Fan-out Wafer Level Packaging Market Challenge

The increased production costs because of warpage is a major challenge for the growth of the global fan-out wafer level packaging market. The non-availability of a specific solution to the problem of warping increases the production costs for players in the global FOWLP market and has impeded the growth of the market. Warpage is defined as the distortion when the surface of the molded part does not follow the intended shape of the design. This leads to a deformation of the wafer surface, thus making it unusable. One of the prominent factors responsible for this effect is the differential shrinkage of the material in the molded part; hence, rather than achieving a uniform, compact shape, it becomes deformed and warped.

The issue of warping occurs several times during FOWLP, which could result in the wastage of wafers and result in high costs for the manufacturer. Thus, warpage issues during the FOWLP process result in a high number of wafers becoming unusable, thus leading to an increase in the overall cost of manufacturing and packaging ICs. Thus, all these may hinder the growth of the global FOWLP market during the forecast period.

Key Fan-out Wafer Level Packaging Market Customer Landscape

The report includes the adoption lifecycle of the market, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. Furthermore, the report also includes key purchase criteria and drivers of price sensitivity to help companies evaluate and develop their growth strategies.

Fan-out Wafer Level Packaging Market Share by Geography

Global Fan-out Wafer Level Packaging Market Customer Landscape

Who are the Major Fan-out Wafer Level Packaging Market Vendors?

Vendors are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.

thinkdeca.com - The company offers to Fan out Wafer Level Packaging for M series semiconductor industries. Also, the company offers semiconductor solutions such as M series, adaptive patterning, and patent portfolios.

The report also includes detailed analyses of the competitive landscape of the market and information about 15 market vendors, including:

  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • Jiangsu Changdian Technology Co. Ltd.
  • nepes Corp.
  • Nordson Corp.
  • NXP Semiconductors NV
  • Onto Innovation Inc.
  • Panasonic Holdings Corp.
  • Powertech Technology Inc.
  • Renesas Electronics Corp.
  • Singapore Semiconductor Industry Association
  • SUSS MICROTEC SE
  • Taiwan Semiconductor Manufacturing Co. Ltd.
  • Unisem M Berhad
  • UTAC Holdings Ltd.

Qualitative and quantitative analysis of vendors has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize vendors as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize vendors as dominant, leading, strong, tentative, and weak.

What is the Fastest-Growing Segments in the Fan-out Wafer Level Packaging Market?

The market share growth by the high-density segment will be significant during the forecast period. The market has witnessed a growth momentum owing to the increased investments in the development of high-density FOWLP. Multiple vendors in the market have partnered and invested in the development of this technology to ensure that it can be used in various other segments. Thus, increased investment in the development of high-density FOWLP will boost the growth of the global FOWLP market during the forecast period.

Fan-out Wafer Level Packaging Market Size

Get a glance at the market contribution of various segments Request a PDF Sample

The high density segment was valued at USD 1,300.62 million in 2017 and continue to grow by 2021Generally, smartphone manufacturers choose package-on-package (PoP) technology as the application processor, where the memory package is placed on the top, and the application processor package is at the bottom. But with the increased demand for compact designs in the market, more smartphone vendors are shifting from PoP technology to high-density FOWLP. This shift is led by major smartphone vendors such as Apple Inc. Furthermore, in 2020, Apple launched its A14 bionic and M1 chips for the new Apple devices such as Mac, Mac book, iPad, and iPhone. The A14 bionic chip has a 5 nm fabrication process. It is the most advanced chip in the world. With this innovation, it is expected that multiple new players will soon adopt this technology, which will drive the growth of the market segment during the forecast period.

Which are the Key Regions for the Fan-out Wafer Level Packaging Market?

Fan-out Wafer Level Packaging Market Share by Geography

For more insights on the market share of various regions Request PDF Sample now!

APAC is estimated to contribute 77% to the growth of the global market during the forecast period. Technavio’s analysts have elaborately explained the regional trends and drivers that shape the market during the forecast period. In 2022, APAC accounted for the highest market share and was expected to dominate during the forecast period as well. This is due to the presence of many foundries and OSAT companies in the region, which are the major customers of integrated device manufacturers (IDMs) and fabless companies. Another major reason for the growth of the market is the increasing government initiatives for the expansion of the semiconductor packaging industry in APAC countries. One of the most prominent examples is the increasing government support for the semiconductor packaging industry in China. Although China is a major consumer electronics manufacturing hub, the country primarily imports semiconductor ICs and does not have a strong domestic semiconductor manufacturing capability of its own. Therefore, with the aim of changing this, the government has framed numerous policies to advance the growth of the semiconductor industry in the country.

In 2020, the COVID-19 pandemic adversely impacted manufacturing and industrial activities in APAC. However, industries such as automobile and manufacturing started recovering owing to the introduction of COVID-19 vaccines in 2021. This has led to the lifting of lockdown restrictions and the resumption of operations in the automotive industry, which has increased the demand for FOWLP in the region. Therefore, the recommencing of manufacturing and industrial activities will positively impact the growth of the regional FOWLP market during the forecast period.

Segment Overview

The report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2017 to 2027. 

  • Technology Outlook (USD Million, 2017 - 2027)
    • High density
    • Standard density
  • Type Outlook (USD Million, 2017 - 2027)
    • 200 mm
    • 300 mm
    • Panel
  • Region Outlook (USD Million, 2017 - 2027)
    • North America
      • The U.S.
      • Canada
    • Europe
      • The U.K.
      • Germany
      • France
      • Rest of Europe
    • APAC
      • China
      • India
    • South America
      • Chile
      • Argentina
      • Brazil
    • Middle East & Africa
      • Saudi Arabia
      • South Africa
      • Rest of the Middle East & Africa

Fan-out Wafer Level Packaging Market Scope

Report Coverage

Details

Page number

162

Base year

2022

Historic period

2017-2021

Forecast period

2023-2027

Growth momentum & CAGR

Accelerate at a CAGR of 17.5%

Market growth 2023-2027

USD 3,064.31 million

Market structure

Fragmented

YoY growth 2022-2023(%)

17.25

Regional analysis

APAC, North America, Europe, South America, and Middle East and Africa

Performing market contribution

APAC at 77%

Key countries

US, Taiwan, South Korea, China, and Japan

Competitive landscape

Leading Vendors, Market Positioning of Vendors, Competitive Strategies, and Industry Risks

Key companies profiled

Amkor Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies Inc., Jiangsu Changdian Technology Co. Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc., Panasonic Holdings Corp., Powertech Technology Inc., Renesas Electronics Corp., Singapore Semiconductor Industry Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp., Yield Engineering Systems, Yole Group, and Infineon Technologies AG

Market dynamics

Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for forecast period.

Customization purview

If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.

Request PDF sample

What are the Key Data Covered in this Fan-out Wafer Level Packaging Market Report?

  • CAGR of the market during the forecast period
  • Detailed information on factors that will drive the growth of the fan-out wafer level packaging market between 2023 and 2027
  • Precise estimation of the size of the fan-out wafer level packaging market size and its contribution to the parent market
  • Accurate predictions about upcoming trends and changes in consumer behavior
  • Growth of the market industry across APAC, North America, Europe, South America, and Middle East and Africa
  • Thorough analysis of the market’s competitive landscape and detailed information about vendors
  • Comprehensive analysis of factors that will challenge the growth of fan-out wafer level packaging market vendors

We can help! Our analysts can customize this report to meet your requirements. Get in touch

1 Executive Summary

  • 1.1 Market overview
    • Exhibit 01: Executive Summary – Chart on Market Overview
    • Exhibit 02: Executive Summary – Data Table on Market Overview
    • Exhibit 03: Executive Summary – Chart on Global Market Characteristics
    • Exhibit 04: Executive Summary – Chart on Market by Geography
    • Exhibit 05: Executive Summary – Chart on Market Segmentation by Technology
    • Exhibit 06: Executive Summary – Chart on Market Segmentation by Type
    • Exhibit 07: Executive Summary – Chart on Incremental Growth
    • Exhibit 08: Executive Summary – Data Table on Incremental Growth
    • Exhibit 09: Executive Summary – Chart on Vendor Market Positioning

2 Market Landscape

  • 2.1 Market ecosystem
    • Exhibit 10: Parent market
    • Exhibit 11: Market Characteristics

3 Market Sizing

  • 3.1 Market definition
    • Exhibit 12: Offerings of vendors included in the market definition
  • 3.2 Market segment analysis
    • Exhibit 13: Market segments
  • 3.3 Market size 2022
    • 3.4 Market outlook: Forecast for 2022-2027
      • Exhibit 14: Chart on Global - Market size and forecast 2022-2027 ($ million)
      • Exhibit 15: Data Table on Global - Market size and forecast 2022-2027 ($ million)
      • Exhibit 16: Chart on Global Market: Year-over-year growth 2022-2027 (%)
      • Exhibit 17: Data Table on Global Market: Year-over-year growth 2022-2027 (%)

    4 Historic Market Size

    • 4.1 Global fan-out wafer level packaging market 2017 - 2021
      • Exhibit 18: Historic Market Size – Data Table on Global fan-out wafer level packaging market 2017 - 2021 ($ million)
    • 4.2 Technology Segment Analysis 2017 - 2021
      • Exhibit 19: Historic Market Size – Technology Segment 2017 - 2021 ($ million)
    • 4.3 Type Segment Analysis 2017 - 2021
      • Exhibit 20: Historic Market Size – Type Segment 2017 - 2021 ($ million)
    • 4.4 Geography Segment Analysis 2017 - 2021
      • Exhibit 21: Historic Market Size – Geography Segment 2017 - 2021 ($ million)
    • 4.5 Country Segment Analysis 2017 - 2021
      • Exhibit 22: Historic Market Size – Country Segment 2017 - 2021 ($ million)

    5 Five Forces Analysis

    • 5.1 Five forces summary
      • Exhibit 23: Five forces analysis - Comparison between 2022 and 2027
    • 5.2 Bargaining power of buyers
      • Exhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2022 and 2027
    • 5.3 Bargaining power of suppliers
      • Exhibit 25: Bargaining power of suppliers – Impact of key factors in 2022 and 2027
    • 5.4 Threat of new entrants
      • Exhibit 26: Threat of new entrants – Impact of key factors in 2022 and 2027
    • 5.5 Threat of substitutes
      • Exhibit 27: Threat of substitutes – Impact of key factors in 2022 and 2027
    • 5.6 Threat of rivalry
      • Exhibit 28: Threat of rivalry – Impact of key factors in 2022 and 2027
    • 5.7 Market condition
      • Exhibit 29: Chart on Market condition - Five forces 2022 and 2027

    6 Market Segmentation by Technology

    • 6.1 Market segments
      • Exhibit 30: Chart on Technology - Market share 2022-2027 (%)
      • Exhibit 31: Data Table on Technology - Market share 2022-2027 (%)
    • 6.2 Comparison by Technology
      • Exhibit 32: Chart on Comparison by Technology
      • Exhibit 33: Data Table on Comparison by Technology
    • 6.3 High density - Market size and forecast 2022-2027
      • Exhibit 34: Chart on High density - Market size and forecast 2022-2027 ($ million)
      • Exhibit 35: Data Table on High density - Market size and forecast 2022-2027 ($ million)
      • Exhibit 36: Chart on High density - Year-over-year growth 2022-2027 (%)
      • Exhibit 37: Data Table on High density - Year-over-year growth 2022-2027 (%)
    • 6.4 Standard density - Market size and forecast 2022-2027
      • Exhibit 38: Chart on Standard density - Market size and forecast 2022-2027 ($ million)
      • Exhibit 39: Data Table on Standard density - Market size and forecast 2022-2027 ($ million)
      • Exhibit 40: Chart on Standard density - Year-over-year growth 2022-2027 (%)
      • Exhibit 41: Data Table on Standard density - Year-over-year growth 2022-2027 (%)
    • 6.5 Market opportunity by Technology
      • Exhibit 42: Market opportunity by Technology ($ million)

    7 Market Segmentation by Type

    • 7.1 Market segments
      • Exhibit 43: Chart on Type - Market share 2022-2027 (%)
      • Exhibit 44: Data Table on Type - Market share 2022-2027 (%)
    • 7.2 Comparison by Type
      • Exhibit 45: Chart on Comparison by Type
      • Exhibit 46: Data Table on Comparison by Type
    • 7.3 200 mm - Market size and forecast 2022-2027
      • Exhibit 47: Chart on 200 mm - Market size and forecast 2022-2027 ($ million)
      • Exhibit 48: Data Table on 200 mm - Market size and forecast 2022-2027 ($ million)
      • Exhibit 49: Chart on 200 mm - Year-over-year growth 2022-2027 (%)
      • Exhibit 50: Data Table on 200 mm - Year-over-year growth 2022-2027 (%)
    • 7.4 300 mm - Market size and forecast 2022-2027
      • Exhibit 51: Chart on 300 mm - Market size and forecast 2022-2027 ($ million)
      • Exhibit 52: Data Table on 300 mm - Market size and forecast 2022-2027 ($ million)
      • Exhibit 53: Chart on 300 mm - Year-over-year growth 2022-2027 (%)
      • Exhibit 54: Data Table on 300 mm - Year-over-year growth 2022-2027 (%)
    • 7.5 Panel - Market size and forecast 2022-2027
      • Exhibit 55: Chart on Panel - Market size and forecast 2022-2027 ($ million)
      • Exhibit 56: Data Table on Panel - Market size and forecast 2022-2027 ($ million)
      • Exhibit 57: Chart on Panel - Year-over-year growth 2022-2027 (%)
      • Exhibit 58: Data Table on Panel - Year-over-year growth 2022-2027 (%)
    • 7.6 Market opportunity by Type
      • Exhibit 59: Market opportunity by Type ($ million)

    8 Customer Landscape

    • 8.1 Customer landscape overview
      • Exhibit 60: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

    9 Geographic Landscape

    • 9.1 Geographic segmentation
      • Exhibit 61: Chart on Market share by geography 2022-2027 (%)
      • Exhibit 62: Data Table on Market share by geography 2022-2027 (%)
    • 9.2 Geographic comparison
      • Exhibit 63: Chart on Geographic comparison
      • Exhibit 64: Data Table on Geographic comparison
    • 9.3 APAC - Market size and forecast 2022-2027
      • Exhibit 65: Chart on APAC - Market size and forecast 2022-2027 ($ million)
      • Exhibit 66: Data Table on APAC - Market size and forecast 2022-2027 ($ million)
      • Exhibit 67: Chart on APAC - Year-over-year growth 2022-2027 (%)
      • Exhibit 68: Data Table on APAC - Year-over-year growth 2022-2027 (%)
    • 9.4 North America - Market size and forecast 2022-2027
      • Exhibit 69: Chart on North America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 70: Data Table on North America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 71: Chart on North America - Year-over-year growth 2022-2027 (%)
      • Exhibit 72: Data Table on North America - Year-over-year growth 2022-2027 (%)
    • 9.5 Europe - Market size and forecast 2022-2027
      • Exhibit 73: Chart on Europe - Market size and forecast 2022-2027 ($ million)
      • Exhibit 74: Data Table on Europe - Market size and forecast 2022-2027 ($ million)
      • Exhibit 75: Chart on Europe - Year-over-year growth 2022-2027 (%)
      • Exhibit 76: Data Table on Europe - Year-over-year growth 2022-2027 (%)
    • 9.6 South America - Market size and forecast 2022-2027
      • Exhibit 77: Chart on South America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 78: Data Table on South America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 79: Chart on South America - Year-over-year growth 2022-2027 (%)
      • Exhibit 80: Data Table on South America - Year-over-year growth 2022-2027 (%)
    • 9.7 Middle East and Africa - Market size and forecast 2022-2027
      • Exhibit 81: Chart on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
      • Exhibit 82: Data Table on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
      • Exhibit 83: Chart on Middle East and Africa - Year-over-year growth 2022-2027 (%)
      • Exhibit 84: Data Table on Middle East and Africa - Year-over-year growth 2022-2027 (%)
    • 9.8 Taiwan - Market size and forecast 2022-2027
      • Exhibit 85: Chart on Taiwan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 86: Data Table on Taiwan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 87: Chart on Taiwan - Year-over-year growth 2022-2027 (%)
      • Exhibit 88: Data Table on Taiwan - Year-over-year growth 2022-2027 (%)
    • 9.9 South Korea - Market size and forecast 2022-2027
      • Exhibit 89: Chart on South Korea - Market size and forecast 2022-2027 ($ million)
      • Exhibit 90: Data Table on South Korea - Market size and forecast 2022-2027 ($ million)
      • Exhibit 91: Chart on South Korea - Year-over-year growth 2022-2027 (%)
      • Exhibit 92: Data Table on South Korea - Year-over-year growth 2022-2027 (%)
    • 9.10 China - Market size and forecast 2022-2027
      • Exhibit 93: Chart on China - Market size and forecast 2022-2027 ($ million)
      • Exhibit 94: Data Table on China - Market size and forecast 2022-2027 ($ million)
      • Exhibit 95: Chart on China - Year-over-year growth 2022-2027 (%)
      • Exhibit 96: Data Table on China - Year-over-year growth 2022-2027 (%)
    • 9.11 Japan - Market size and forecast 2022-2027
      • Exhibit 97: Chart on Japan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 98: Data Table on Japan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 99: Chart on Japan - Year-over-year growth 2022-2027 (%)
      • Exhibit 100: Data Table on Japan - Year-over-year growth 2022-2027 (%)
    • 9.12 US - Market size and forecast 2022-2027
      • Exhibit 101: Chart on US - Market size and forecast 2022-2027 ($ million)
      • Exhibit 102: Data Table on US - Market size and forecast 2022-2027 ($ million)
      • Exhibit 103: Chart on US - Year-over-year growth 2022-2027 (%)
      • Exhibit 104: Data Table on US - Year-over-year growth 2022-2027 (%)
    • 9.13 Market opportunity by geography
      • Exhibit 105: Market opportunity by geography ($ million)

    10 Drivers, Challenges, and Trends

    • 10.1 Market drivers
      • 10.2 Market challenges
        • 10.3 Impact of drivers and challenges
          • Exhibit 106: Impact of drivers and challenges in 2022 and 2027
        • 10.4 Market trends

          11 Vendor Landscape

          • 11.1 Overview
            • 11.2 Vendor landscape
              • Exhibit 107: Overview on Criticality of inputs and Factors of differentiation
            • 11.3 Landscape disruption
              • Exhibit 108: Overview on factors of disruption
            • 11.4 Industry risks
              • Exhibit 109: Impact of key risks on business

            12 Vendor Analysis

            • 12.1 Vendors covered
              • Exhibit 110: Vendors covered
            • 12.2 Market positioning of vendors
              • Exhibit 111: Matrix on vendor position and classification
            • 12.3 Amkor Technology Inc.
              • Exhibit 112: Amkor Technology Inc. - Overview
              • Exhibit 113: Amkor Technology Inc. - Business segments
              • Exhibit 114: Amkor Technology Inc. - Key offerings
              • Exhibit 115: Amkor Technology Inc. - Segment focus
            • 12.4 ASE Technology Holding Co. Ltd.
              • Exhibit 116: ASE Technology Holding Co. Ltd. - Overview
              • Exhibit 117: ASE Technology Holding Co. Ltd. - Business segments
              • Exhibit 118: ASE Technology Holding Co. Ltd. - Key offerings
              • Exhibit 119: ASE Technology Holding Co. Ltd. - Segment focus
            • 12.5 Deca Technologies Inc.
              • Exhibit 120: Deca Technologies Inc. - Overview
              • Exhibit 121: Deca Technologies Inc. - Product / Service
              • Exhibit 122: Deca Technologies Inc. - Key offerings
            • 12.6 Infineon Technologies AG
              • Exhibit 123: Infineon Technologies AG - Overview
              • Exhibit 124: Infineon Technologies AG - Business segments
              • Exhibit 125: Infineon Technologies AG - Key news
              • Exhibit 126: Infineon Technologies AG - Key offerings
              • Exhibit 127: Infineon Technologies AG - Segment focus
            • 12.7 Jiangsu Changdian Technology Co. Ltd.
              • Exhibit 128: Jiangsu Changdian Technology Co. Ltd. - Overview
              • Exhibit 129: Jiangsu Changdian Technology Co. Ltd. - Product / Service
              • Exhibit 130: Jiangsu Changdian Technology Co. Ltd. - Key offerings
            • 12.8 Nordson Corp.
              • Exhibit 131: Nordson Corp. - Overview
              • Exhibit 132: Nordson Corp. - Business segments
              • Exhibit 133: Nordson Corp. - Key news
              • Exhibit 134: Nordson Corp. - Key offerings
              • Exhibit 135: Nordson Corp. - Segment focus
            • 12.9 NXP Semiconductors NV
              • Exhibit 136: NXP Semiconductors NV - Overview
              • Exhibit 137: NXP Semiconductors NV - Product / Service
              • Exhibit 138: NXP Semiconductors NV - Key news
              • Exhibit 139: NXP Semiconductors NV - Key offerings
            • 12.10 Renesas Electronics Corp.
              • Exhibit 140: Renesas Electronics Corp. - Overview
              • Exhibit 141: Renesas Electronics Corp. - Business segments
              • Exhibit 142: Renesas Electronics Corp. - Key offerings
              • Exhibit 143: Renesas Electronics Corp. - Segment focus
            • 12.11 Singapore Semiconductor Industry Association
              • Exhibit 144: Singapore Semiconductor Industry Association - Overview
              • Exhibit 145: Singapore Semiconductor Industry Association - Product / Service
              • Exhibit 146: Singapore Semiconductor Industry Association - Key offerings
            • 12.12 SUSS MICROTEC SE
              • Exhibit 147: SUSS MICROTEC SE - Overview
              • Exhibit 148: SUSS MICROTEC SE - Business segments
              • Exhibit 149: SUSS MICROTEC SE - Key news
              • Exhibit 150: SUSS MICROTEC SE - Key offerings
              • Exhibit 151: SUSS MICROTEC SE - Segment focus
            • 12.13 Taiwan Semiconductor Manufacturing Co. Ltd.
              • Exhibit 152: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
              • Exhibit 153: Taiwan Semiconductor Manufacturing Co. Ltd. - Product / Service
              • Exhibit 154: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
            • 12.14 Unisem M Berhad
              • Exhibit 155: Unisem M Berhad - Overview
              • Exhibit 156: Unisem M Berhad - Product / Service
              • Exhibit 157: Unisem M Berhad - Key offerings
            • 12.15 Winbond Electronics Corp.
              • Exhibit 158: Winbond Electronics Corp. - Overview
              • Exhibit 159: Winbond Electronics Corp. - Business segments
              • Exhibit 160: Winbond Electronics Corp. - Key offerings
              • Exhibit 161: Winbond Electronics Corp. - Segment focus
            • 12.16 Yield Engineering Systems
              • Exhibit 162: Yield Engineering Systems - Overview
              • Exhibit 163: Yield Engineering Systems - Product / Service
              • Exhibit 164: Yield Engineering Systems - Key offerings
            • 12.17 Yole Group
              • Exhibit 165: Yole Group - Overview
              • Exhibit 166: Yole Group - Product / Service
              • Exhibit 167: Yole Group - Key offerings

            13 Appendix

            • 13.1 Scope of the report
              • 13.2 Inclusions and exclusions checklist
                • Exhibit 168: Inclusions checklist
                • Exhibit 169: Exclusions checklist
              • 13.3 Currency conversion rates for US$
                • Exhibit 170: Currency conversion rates for US$
              • 13.4 Research methodology
                • Exhibit 171: Research methodology
                • Exhibit 172: Validation techniques employed for market sizing
                • Exhibit 173: Information sources
              • 13.5 List of abbreviations
                • Exhibit 174: List of abbreviations

              Research Framework

              Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

              TechnavioINFORMATION SOURCES

              Primary sources

              • Manufacturers and suppliers
              • Channel partners
              • Industry experts
              • Strategic decision makers

              Secondary sources

              • Industry journals and periodicals
              • Government data
              • Financial reports of key industry players
              • Historical data
              • Press releases
              Technavio

              TechnavioDATA ANALYSIS

              Data Synthesis

              • Collation of data
              • Estimation of key figures
              • Analysis of derived insights

              Data Validation

              • Triangulation with data models
              • Reference against proprietary databases
              • Corroboration with industry experts
              Technavio

              TechnavioREPORT WRITING

              Qualitative

              • Market drivers
              • Market challenges
              • Market trends
              • Five forces analysis

              Quantitative

              • Market size and forecast
              • Market segmentation
              • Geographical insights
              • Competitive landscape
              Interested in this report?
              Get your sample now!
              Fan-out Wafer Level Packaging market growth will increase by $3064.31 million during 2023-2027.
              The fan-out wafer level packaging market is expected to grow at a CAGR of 17.5% during 2023-2027.
              Technavio has segmented the fan-out wafer level packaging market by technology (High density and Standard density) ,type (200 mm, 300 mm, Panel, South America, and MEA) , and geography (APAC, North America, Europe, South America, and Middle East and Africa).
              Amkor Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies Inc., Jiangsu Changdian Technology Co. Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc., Panasonic Holdings Corp., Powertech Technology Inc., Renesas Electronics Corp., Singapore Semiconductor Industry Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp., Yield Engineering Systems, Yole Group, Infineon Technologies AG are a few of the key vendors in the fan-out wafer level packaging market.
              APAC will register the highest growth rate of 76.84% among the other regions. Therefore, the fan-out wafer level packaging market in APAC is expected to garner significant business opportunities for the vendors during the forecast period.
              The key factors driving the fan-out wafer level packaging market growth are:
              • Increased demand for compactly designed electronics
              • Increasing adoption of semiconductor ICs in automobiles
              The fan-out wafer level packaging market vendors should focus on grabbing business opportunities from the high density segment as it accounted for the largest market share in the base year.
              • What are the key global market and the regional market share?
              • What are the revenue-generating key market segments?
              • What are the key factors driving and challenging this market’s growth?
              • Who are the key market vendors and their growth strategies?
              • What are the latest trends influencing the growth of this market?
              • What are the variables influencing the market growth in the primary regions?
              • What are the factors influencing the growth of the parent market?
              • Off-the-shelf research reports
              • Reports can be tailored to meet the customer's needs
              • Trusted by more than 100 fortune 500 organizations
              • Information about the market's key drivers, trends, and challenges
              • Parent market analysis
              • Every week, 50,000 people visit our subscription platform
              • Detailed vendors report with competitive landscape
              • Covid-19 impact and recovery analysis
              • Data on revenue-generating market segments
              • Details on the market shares of various regions
              • Five-force market analysis

              Certified ISO 9001 : 2015

              We are ISO recognized

              We are ISO 9001:2015 recognized that ensures quality services and product delivery to our clients.

              We are GDPR and CCPA compliant

              We are GDPR and CCPA compliant! Your transaction & personal information is protected from unauthorized use.

              Safe and Secure SSL Encrypted
              Technavio

              info
              close
              • Single:

                One user only.
                Quick & easy download option

              • Enterprise:

                Unlimited user access (Within your organization)
                Complimentary Customization Included

              2500 USD

              Technavio Get the report (PDF) sent to your email within minutes.

              Subscribe & Save

              Get lifetime access to our
              Technavio Insights

              Customized Report as per your Business Needs

              • Our analysts will work directly with you and understand your needs
              • Get data on specified regions or segments, competitor and Vendors
              • Data will be formatted and presented as per your requirements
              • We offer $1000 worth of FREE customization at the time of purchase

              Let us help you make report more suited to your requirements.

              • Get a competitive breakdown as per your niche industry
              • Customize the data with various metrics that meet your business prerequisite
              • Understand Revenue Sources, Customers and many more
              • Details on Market Share
              • These customizations are done in a short amount of time by our analysts and industry experts
              Technavio
              Enquire Before Buying
              17,000 reports available | Plans starting from just 5,000 USD | Get FREE trial>>