Die Bonder Equipment Market by End-user, Type and Geography - Forecast and Analysis 2023-2027

Published: Aug 2023

Pages: 157

SKU: IRTNTR70427

Snapshot

Die Bonder Equipment Market Analysis Report 2023-2027:

The die bonder equipment market size is estimated to grow at a CAGR of 4.15% between 2022 and 2027. The market size is forecast to increase by USD 186.52 million. The growth of the market depends on several factors including the increasing complexity of semiconductor IC designs, the rising electronics production across the world, and the rising demand for high-quality semiconductor ICs for wireless devices and IoT applications.

Die bonder equipment is a type of semiconductor packaging and assembly equipment in which wafers are cut into dies, and the functional dies are separated from the defective ones, which are already marked before this step.

This die bonder equipment market report extensively covers market segmentation by end-user (OSATs and IDMs), type (fully automatic die bonder equipment and semi-automatic die bonder equipment), and geography (APAC, North America, Europe, South America, and the Middle East and Africa). It also includes an in-depth analysis of drivers, trends, and challenges. Furthermore, the report includes historic market data from 2017 to 2021.

What will be the size of the Die Bonder Equipment Market During the Forecast Period?

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Die Bonder Equipment Market Overview

Driver

The increasing complexity of semiconductor IC designs is driving market growth. As consumer electronic devices become more advanced, there is a growing need for integrated circuits (ICs) that can perform multiple functions. To meet this demand, semiconductor manufacturers have developed complex IC architecture and designs.

However, the manufacturing process for these ICs is challenging, requiring more advanced packaging and assembly equipment such as die attach equipment. This complexity will moderately impact semiconductor device manufacturers, who must invest significantly in such equipment to ensure the performance of their ICs. The market for die bonder equipment, which helps produce these complicated IC designs, is expected to grow during the forecast period.

Trends

An increase in the number of OSAT vendors is an emerging trend shaping market growth. The quantity of OSATs in the APAC region, particularly in China, is rapidly increasing due to their strong financial backing and liquidity. This allows these companies to have sufficient funds for research and development and to expand their capacity.

Additionally, government support for the semiconductor industry's development from major APAC countries like South Korea, China, and Japan is fueling the growth of these facilities. The easy availability of capital is likely to enhance the development of these companies by acquiring more scale and technical competence. The rise in the number of OSATs indicates that most semiconductor market players are adopting the fabless model to increase orders for packaging from these OSATs, which must improve their production capacities. This is predicted to create a significant demand for die bonder equipment, driving the market's growth during the forecast period.

Restrain

High demand for polymer adhesive wafer bonding equipment is a significant challenge hindering market growth. The use of semiconductor packaging and assembly equipment, such as polymer adhesive wafer bonding equipment, is increasing due to the growing popularity of advanced packaging applications, including TSV, 2.5D and 3D IC, stacked die packaging, and micro-electro-mechanical system (MEMS) packaging.

However, manufacturers are opting for polymer adhesive wafer bonding equipment for these packaging techniques as it allows for reliable thinning and backside processing of the stacked dies, while also reducing the cost of TSV integration. As a result, the demand for polymer adhesive wafer bonding equipment is expected to moderately affect the growth of the die bonder equipment market during the forecast period.

Die Bonder Equipment Market Segmentation By End-user

The market share growth by the OSATs segment will be significant during the forecast period. OSATs are dedicated packaging, assembly, and testing players, and their growth is driven by two major factors such as the overall growth in the semiconductor industry and rising costs of packaging, assembly, and testing equipment.

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The OSATs segment was valued at USD 415.00 million in 2017 and continued to grow by 2021. The semiconductor packaging and assembly industry has seen advancements in new technologies like FOWLP, 2.5D, 3D, and TSV, which have led to an increase in outsourcing of back-end processes. Although these technologies may result in high costs currently because they are not fully mature, there is ongoing research and development (R&D) to make them suitable for large-scale applications. Amkor Technology, a major OSAT, has announced expansion plans through strategic collaborations to streamline semiconductor package verification. The adoption of these new technologies in the packaging sector of the semiconductor industry creates a demand for new die bonder equipment, driving market growth during the forecast period.

Die Bonder Equipment Market Segmentation By Type

Fully-automated die bonder equipment is generally utilized in large-scale, mass-production industries. These bonder machines are highly precise devices that are computer-controlled and equipped with digital camera vision sensors. They are primarily used in optoelectronic and semiconductor packaging industries. The increasing use of automation in large-scale industries and the shortage of skilled labor are the primary factors driving the growth of the fully automatic die bonder equipment segment. Additionally, vendors are introducing new products to the market. For example, in September 2022, MRSI Systems (Mycronic Group) launched MRSI-HVM1 and MRSI-H1 die bonders, which boast a 1um machine accuracy. This launch is expected to further fuel the growth of the fully automatic die bonder equipment segment in the die bonder equipment market during the forecast period.

Regional Overview

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APAC is estimated to contribute 79% to the growth of the global market during the forecast period. Technavio’s analysts have elaborately explained the regional trends and drivers that shape the market during the forecast period. The market in APAC is experiencing growth due to government initiatives, the strong regional manufacturing sector, and increasing demand for locally manufactured automobiles. Despite challenges like a slowdown of industrial production in China, the market is expected to continue growing at a significant pace. Rising middle-class populations are spending more on consumer durables, leading to pressure on semiconductor manufacturers to improve capacity utilization and adopt advanced equipment like die bonders.

Moreover, the market will be dominated by countries like Japan, China, Taiwan, South Korea, Singapore, Thailand, Vietnam, and the Philippines. These countries are investing in processes that ensure efficiency in terms of cleanliness and environmental control. Additionally, a drop in the prices of consumer electronic products has increased sales, and heavy investments in the electronics and semiconductor industry are expected to foster growth in the global die bonder equipment market in APAC during the forecast period

The COVID-19 outbreak had a negative impact on various industries in APAC, including electronics, in 2020. The supply chain was disrupted, there was a shortage of workers, and economies weakened, all leading to a halt in electronic manufacturing. Unfortunately, this resulted in a negative effect on the growth of the die bonder equipment market in APAC during 2020. However, the good news is that the lockdown restrictions started to be lifted in the first half of 2021 due to the vaccination drives, which allowed end-user industries to resume operations. While the regional semiconductor industry experienced a downturn due to the pandemic in 2020, there are positive developments in the industry, such as the establishment of new fabs, which are expected to drive the growth of the die bonder equipment market in APAC during the forecast period.

Die Bonder Equipment Market Customer Landscape

The Die Bonder Equipment Market report includes the adoption lifecycle of the market, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. Furthermore, the report also includes key purchase criteria and drivers of price sensitivity to help companies evaluate and develop their growth strategies.

Global Die Bonder Equipment Market Customer Landscape

Who are the Major Die Bonder Equipment Market Companies?

Companies are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.

ASMPT Ltd. - The company offers die bonder equipment such as ad211 plus, ad280 plus, and ad50 lite.

The research report also includes detailed analyses of the competitive landscape of the market and information about 15 market companies, including:

Qualitative and quantitative analysis of companies has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize companies as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize companies as dominant, leading, strong, tentative, and weak.

Segment Overview

The die bonder equipment market report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2017 to 2027.

End-user Outlook (USD Million, 2017 - 2027)
- OSATs
- IDMs

Type Outlook (USD Million, 2017 - 2027)
- Fully automatic die bonder equipment
- Semi-automatic die bonder equipment

Region Outlook (USD Million, 2017 - 2027)
- North America
  - The U.S.
  - Canada
- South America
  - Chile
  - Brazil
- Europe
  - The U.K.
  - Germany
  - France
  - Rest of Europe
- APAC
  - China
  - India
- Middle East & Africa
  - Saudi Arabia
  - South Africa
  - Rest of the Middle East & Africa

Die Bonder Equipment Market Scope
Report Coverage	Details
Page number	157
Base year	2022
Historic period	2017-2021
Forecast period	2023-2027
Growth momentum & CAGR	Accelerate at a CAGR of 4.15%
Market growth 2023-2027	USD 186.52 million
Market structure	Fragmented
YoY growth 2022-2023(%)	3.74
Regional analysis	APAC, North America, Europe, South America, and Middle East and Africa
Performing market contribution	APAC at 79%
Key countries	US, Canada, Taiwan, China, and South Korea
Competitive landscape	Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks
Key companies profiled	ASMPT Ltd., BE Semiconductor Industries NV, DIAS Automation HK Ltd., Dr. Tresky AG, ficonTEC Service GmbH, Finetech GmbH and Co. KG, Four Technos Co. Ltd., HYBOND Inc., Indubond, Kulicke and Soffa Industries Inc., MicroAssembly Technologies Ltd., Mycronic AB, Palomar Technologies Inc., Panasonic Holdings Corp., Paroteq GmbH, SHIBUYA Corp., UniTemp GmbH, WestBond Inc., Yamaha Motor Co. Ltd., and SHIBAURA MECHATRONICS CORP.
Market dynamics	Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for forecast period
Customization purview	If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.

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What are the Key Data Covered in this Die Bonder Equipment Market Research Report?

CAGR of the market during the forecast period
Detailed information on factors that will drive the growth of the market between 2023 and 2027
Precise estimation of the market size and its contribution to the market in focus on the parent market
Accurate predictions about upcoming trends and changes in consumer behavior
Growth of the market industry across APAC, North America, Europe, South America, and the Middle East and Africa
A thorough analysis of the market’s competitive landscape and detailed information about companies
Comprehensive analysis of factors that will challenge the growth of market companies

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Table of Contents

1 Executive Summary

1.1 Market overview
- Exhibit 01: Executive Summary – Chart on Market Overview
- Exhibit 02: Executive Summary – Data Table on Market Overview
- Exhibit 03: Executive Summary – Chart on Global Market Characteristics
- Exhibit 04: Executive Summary – Chart on Market by Geography
- Exhibit 05: Executive Summary – Chart on Market Segmentation by End-user
- Exhibit 06: Executive Summary – Chart on Market Segmentation by Type
- Exhibit 07: Executive Summary – Chart on Incremental Growth
- Exhibit 08: Executive Summary – Data Table on Incremental Growth
- Exhibit 09: Executive Summary – Chart on Vendor Market Positioning

2 Market Landscape

2.1 Market ecosystem
- Exhibit 10: Parent market
- Exhibit 11: Market Characteristics

3 Market Sizing

3.1 Market definition
- Exhibit 12: Offerings of vendors included in the market definition

3.2 Market segment analysis
- Exhibit 13: Market segments

3.3 Market size 2022

3.4 Market outlook: Forecast for 2022-2027
- Exhibit 14: Chart on Global - Market size and forecast 2022-2027 ($ million)
- Exhibit 15: Data Table on Global - Market size and forecast 2022-2027 ($ million)
- Exhibit 16: Chart on Global Market: Year-over-year growth 2022-2027 (%)
- Exhibit 17: Data Table on Global Market: Year-over-year growth 2022-2027 (%)

4 Historic Market Size

4.1 Global die bonder equipment market 2017 - 2021
- Exhibit 18: Historic Market Size – Data Table on global die bonder equipment market 2017 - 2021 ($ million)

4.2 End-user Segment Analysis 2017 - 2021
- Exhibit 19: Historic Market Size – End-user Segment 2017 - 2021 ($ million)

4.3 Type Segment Analysis 2017 - 2021
- Exhibit 20: Historic Market Size – Type Segment 2017 - 2021 ($ million)

4.4 Geography Segment Analysis 2017 - 2021
- Exhibit 21: Historic Market Size – Geography Segment 2017 - 2021 ($ million)

4.5 Country Segment Analysis 2017 - 2021
- Exhibit 22: Historic Market Size – Country Segment 2017 - 2021 ($ million)

5 Five Forces Analysis

5.1 Five forces summary
- Exhibit 23: Five forces analysis - Comparison between 2022 and 2027

5.2 Bargaining power of buyers
- Exhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2022 and 2027

5.3 Bargaining power of suppliers
- Exhibit 25: Bargaining power of suppliers – Impact of key factors in 2022 and 2027

5.4 Threat of new entrants
- Exhibit 26: Threat of new entrants – Impact of key factors in 2022 and 2027

5.5 Threat of substitutes
- Exhibit 27: Threat of substitutes – Impact of key factors in 2022 and 2027

5.6 Threat of rivalry
- Exhibit 28: Threat of rivalry – Impact of key factors in 2022 and 2027

5.7 Market condition
- Exhibit 29: Chart on Market condition - Five forces 2022 and 2027

6 Market Segmentation by End-user

6.1 Market segments
- Exhibit 30: Chart on End-user - Market share 2022-2027 (%)
- Exhibit 31: Data Table on End-user - Market share 2022-2027 (%)

6.2 Comparison by End-user
- Exhibit 32: Chart on Comparison by End-user
- Exhibit 33: Data Table on Comparison by End-user

6.3 OSATs - Market size and forecast 2022-2027
- Exhibit 34: Chart on OSATs - Market size and forecast 2022-2027 ($ million)
- Exhibit 35: Data Table on OSATs - Market size and forecast 2022-2027 ($ million)
- Exhibit 36: Chart on OSATs - Year-over-year growth 2022-2027 (%)
- Exhibit 37: Data Table on OSATs - Year-over-year growth 2022-2027 (%)

6.4 IDMs - Market size and forecast 2022-2027
- Exhibit 38: Chart on IDMs - Market size and forecast 2022-2027 ($ million)
- Exhibit 39: Data Table on IDMs - Market size and forecast 2022-2027 ($ million)
- Exhibit 40: Chart on IDMs - Year-over-year growth 2022-2027 (%)
- Exhibit 41: Data Table on IDMs - Year-over-year growth 2022-2027 (%)

6.5 Market opportunity by End-user
- Exhibit 42: Market opportunity by End-user ($ million)
- Exhibit 43: Data Table on Market opportunity by End-user ($ million)

7 Market Segmentation by Type

7.1 Market segments
- Exhibit 44: Chart on Type - Market share 2022-2027 (%)
- Exhibit 45: Data Table on Type - Market share 2022-2027 (%)

7.2 Comparison by Type
- Exhibit 46: Chart on Comparison by Type
- Exhibit 47: Data Table on Comparison by Type

7.3 Fully automatic die bonder equipment - Market size and forecast 2022-2027
- Exhibit 48: Chart on Fully automatic die bonder equipment - Market size and forecast 2022-2027 ($ million)
- Exhibit 49: Data Table on Fully automatic die bonder equipment - Market size and forecast 2022-2027 ($ million)
- Exhibit 50: Chart on Fully automatic die bonder equipment - Year-over-year growth 2022-2027 (%)
- Exhibit 51: Data Table on Fully automatic die bonder equipment - Year-over-year growth 2022-2027 (%)

7.4 Semi-automatic die bonder equipment - Market size and forecast 2022-2027
- Exhibit 52: Chart on Semi-automatic die bonder equipment - Market size and forecast 2022-2027 ($ million)
- Exhibit 53: Data Table on Semi-automatic die bonder equipment - Market size and forecast 2022-2027 ($ million)
- Exhibit 54: Chart on Semi-automatic die bonder equipment - Year-over-year growth 2022-2027 (%)
- Exhibit 55: Data Table on Semi-automatic die bonder equipment - Year-over-year growth 2022-2027 (%)

7.5 Market opportunity by Type
- Exhibit 56: Market opportunity by Type ($ million)
- Exhibit 57: Data Table on Market opportunity by Type ($ million)

8 Customer Landscape

8.1 Customer landscape overview
- Exhibit 58: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

9 Geographic Landscape

9.1 Geographic segmentation
- Exhibit 59: Chart on Market share by geography 2022-2027 (%)
- Exhibit 60: Data Table on Market share by geography 2022-2027 (%)

9.2 Geographic comparison
- Exhibit 61: Chart on Geographic comparison
- Exhibit 62: Data Table on Geographic comparison

9.3 APAC - Market size and forecast 2022-2027
- Exhibit 63: Chart on APAC - Market size and forecast 2022-2027 ($ million)
- Exhibit 64: Data Table on APAC - Market size and forecast 2022-2027 ($ million)
- Exhibit 65: Chart on APAC - Year-over-year growth 2022-2027 (%)
- Exhibit 66: Data Table on APAC - Year-over-year growth 2022-2027 (%)

9.4 North America - Market size and forecast 2022-2027
- Exhibit 67: Chart on North America - Market size and forecast 2022-2027 ($ million)
- Exhibit 68: Data Table on North America - Market size and forecast 2022-2027 ($ million)
- Exhibit 69: Chart on North America - Year-over-year growth 2022-2027 (%)
- Exhibit 70: Data Table on North America - Year-over-year growth 2022-2027 (%)

9.5 Europe - Market size and forecast 2022-2027
- Exhibit 71: Chart on Europe - Market size and forecast 2022-2027 ($ million)
- Exhibit 72: Data Table on Europe - Market size and forecast 2022-2027 ($ million)
- Exhibit 73: Chart on Europe - Year-over-year growth 2022-2027 (%)
- Exhibit 74: Data Table on Europe - Year-over-year growth 2022-2027 (%)

9.6 South America - Market size and forecast 2022-2027
- Exhibit 75: Chart on South America - Market size and forecast 2022-2027 ($ million)
- Exhibit 76: Data Table on South America - Market size and forecast 2022-2027 ($ million)
- Exhibit 77: Chart on South America - Year-over-year growth 2022-2027 (%)
- Exhibit 78: Data Table on South America - Year-over-year growth 2022-2027 (%)

9.7 Middle East and Africa - Market size and forecast 2022-2027
- Exhibit 79: Chart on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
- Exhibit 80: Data Table on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
- Exhibit 81: Chart on Middle East and Africa - Year-over-year growth 2022-2027 (%)
- Exhibit 82: Data Table on Middle East and Africa - Year-over-year growth 2022-2027 (%)

9.8 Taiwan - Market size and forecast 2022-2027
- Exhibit 83: Chart on Taiwan - Market size and forecast 2022-2027 ($ million)
- Exhibit 84: Data Table on Taiwan - Market size and forecast 2022-2027 ($ million)
- Exhibit 85: Chart on Taiwan - Year-over-year growth 2022-2027 (%)
- Exhibit 86: Data Table on Taiwan - Year-over-year growth 2022-2027 (%)

9.9 China - Market size and forecast 2022-2027
- Exhibit 87: Chart on China - Market size and forecast 2022-2027 ($ million)
- Exhibit 88: Data Table on China - Market size and forecast 2022-2027 ($ million)
- Exhibit 89: Chart on China - Year-over-year growth 2022-2027 (%)
- Exhibit 90: Data Table on China - Year-over-year growth 2022-2027 (%)

9.10 South Korea - Market size and forecast 2022-2027
- Exhibit 91: Chart on South Korea - Market size and forecast 2022-2027 ($ million)
- Exhibit 92: Data Table on South Korea - Market size and forecast 2022-2027 ($ million)
- Exhibit 93: Chart on South Korea - Year-over-year growth 2022-2027 (%)
- Exhibit 94: Data Table on South Korea - Year-over-year growth 2022-2027 (%)

9.11 US - Market size and forecast 2022-2027
- Exhibit 95: Chart on US - Market size and forecast 2022-2027 ($ million)
- Exhibit 96: Data Table on US - Market size and forecast 2022-2027 ($ million)
- Exhibit 97: Chart on US - Year-over-year growth 2022-2027 (%)
- Exhibit 98: Data Table on US - Year-over-year growth 2022-2027 (%)

9.12 Canada - Market size and forecast 2022-2027
- Exhibit 99: Chart on Canada - Market size and forecast 2022-2027 ($ million)
- Exhibit 100: Data Table on Canada - Market size and forecast 2022-2027 ($ million)
- Exhibit 101: Chart on Canada - Year-over-year growth 2022-2027 (%)
- Exhibit 102: Data Table on Canada - Year-over-year growth 2022-2027 (%)

9.13 Market opportunity by geography
- Exhibit 103: Market opportunity by geography ($ million)
- Exhibit 104: Data Tables on Market opportunity by geography ($ million)

10 Drivers, Challenges, and Trends

10.1 Market drivers

10.2 Market challenges

10.3 Impact of drivers and challenges
- Exhibit 105: Impact of drivers and challenges in 2022 and 2027

10.4 Market trends

11 Vendor Landscape

11.1 Overview

11.2 Vendor landscape
- Exhibit 106: Overview on Criticality of inputs and Factors of differentiation

11.3 Landscape disruption
- Exhibit 107: Overview on factors of disruption

11.4 Industry risks
- Exhibit 108: Impact of key risks on business

12 Vendor Analysis

12.1 Vendors covered
- Exhibit 109: Vendors covered

12.2 Market positioning of vendors
- Exhibit 110: Matrix on vendor position and classification

12.3 ASMPT Ltd.
- Exhibit 111: ASMPT Ltd. - Overview
- Exhibit 112: ASMPT Ltd. - Business segments
- Exhibit 113: ASMPT Ltd. - Key offerings
- Exhibit 114: ASMPT Ltd. - Segment focus

12.4 BE Semiconductor Industries NV
- Exhibit 115: BE Semiconductor Industries NV - Overview
- Exhibit 116: BE Semiconductor Industries NV - Business segments
- Exhibit 117: BE Semiconductor Industries NV - Key offerings
- Exhibit 118: BE Semiconductor Industries NV - Segment focus

12.5 DIAS Automation HK Ltd.
- Exhibit 119: DIAS Automation HK Ltd. - Overview
- Exhibit 120: DIAS Automation HK Ltd. - Product / Service
- Exhibit 121: DIAS Automation HK Ltd. - Key offerings

12.6 Dr. Tresky AG
- Exhibit 122: Dr. Tresky AG - Overview
- Exhibit 123: Dr. Tresky AG - Product / Service
- Exhibit 124: Dr. Tresky AG - Key offerings

12.7 ficonTEC Service GmbH
- Exhibit 125: ficonTEC Service GmbH - Overview
- Exhibit 126: ficonTEC Service GmbH - Product / Service
- Exhibit 127: ficonTEC Service GmbH - Key offerings

12.8 Finetech GmbH and Co. KG
- Exhibit 128: Finetech GmbH and Co. KG - Overview
- Exhibit 129: Finetech GmbH and Co. KG - Product / Service
- Exhibit 130: Finetech GmbH and Co. KG - Key offerings

12.9 Four Technos Co. Ltd.
- Exhibit 131: Four Technos Co. Ltd. - Overview
- Exhibit 132: Four Technos Co. Ltd. - Product / Service
- Exhibit 133: Four Technos Co. Ltd. - Key offerings

12.10 HYBOND Inc.
- Exhibit 134: HYBOND Inc. - Overview
- Exhibit 135: HYBOND Inc. - Product / Service
- Exhibit 136: HYBOND Inc. - Key offerings

12.11 Indubond
- Exhibit 137: Indubond - Overview
- Exhibit 138: Indubond - Product / Service
- Exhibit 139: Indubond - Key offerings

12.12 Kulicke and Soffa Industries Inc.
- Exhibit 140: Kulicke and Soffa Industries Inc. - Overview
- Exhibit 141: Kulicke and Soffa Industries Inc. - Business segments
- Exhibit 142: Kulicke and Soffa Industries Inc. - Key offerings
- Exhibit 143: Kulicke and Soffa Industries Inc. - Segment focus

12.13 Mycronic AB
- Exhibit 144: Mycronic AB - Overview
- Exhibit 145: Mycronic AB - Business segments
- Exhibit 146: Mycronic AB - Key offerings
- Exhibit 147: Mycronic AB - Segment focus

12.14 Palomar Technologies Inc.
- Exhibit 148: Palomar Technologies Inc. - Overview
- Exhibit 149: Palomar Technologies Inc. - Product / Service
- Exhibit 150: Palomar Technologies Inc. - Key offerings

12.15 SHIBAURA MECHATRONICS CORP.
- Exhibit 151: SHIBAURA MECHATRONICS CORP. - Overview
- Exhibit 152: SHIBAURA MECHATRONICS CORP. - Product / Service
- Exhibit 153: SHIBAURA MECHATRONICS CORP. - Key offerings

12.16 WestBond Inc.
- Exhibit 154: WestBond Inc. - Overview
- Exhibit 155: WestBond Inc. - Product / Service
- Exhibit 156: WestBond Inc. - Key offerings

12.17 Yamaha Motor Co. Ltd.
- Exhibit 157: Yamaha Motor Co. Ltd. - Overview
- Exhibit 158: Yamaha Motor Co. Ltd. - Business segments
- Exhibit 159: Yamaha Motor Co. Ltd. - Key news
- Exhibit 160: Yamaha Motor Co. Ltd. - Key offerings
- Exhibit 161: Yamaha Motor Co. Ltd. - Segment focus

13 Appendix

13.1 Scope of the report

13.2 Inclusions and exclusions checklist
- Exhibit 162: Inclusions checklist
- Exhibit 163: Exclusions checklist

13.3 Currency conversion rates for US$
- Exhibit 164: Currency conversion rates for US$

13.4 Research methodology
- Exhibit 165: Research methodology
- Exhibit 166: Validation techniques employed for market sizing
- Exhibit 167: Information sources

13.5 List of abbreviations
- Exhibit 168: List of abbreviations

Methodology

Research Framework

Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

INFORMATION SOURCES

Primary sources

Manufacturers and suppliers
Channel partners
Industry experts
Strategic decision makers

Secondary sources

Industry journals and periodicals
Government data
Financial reports of key industry players
Historical data
Press releases

DATA ANALYSIS

Data Synthesis

Collation of data
Estimation of key figures
Analysis of derived insights

Data Validation

Triangulation with data models
Reference against proprietary databases
Corroboration with industry experts

REPORT WRITING

Qualitative

Market drivers
Market challenges
Market trends
Five forces analysis

Quantitative

Market size and forecast
Market segmentation
Geographical insights
Competitive landscape

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Key Questions Answered

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What are the revenue-generating key market segments?
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What are the latest trends influencing the growth of this market?
What are the variables influencing the market growth in the primary regions?
What are the factors influencing the growth of the parent market?

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