Global ESD Packaging Market 2017-2021

Overview of the global ESD packaging market

Technavio’s market research analyst predicts the global electrostatic discharge (ESD) packaging market to grow steadily at a CAGR of above 8% by 2021. One of the primary drivers for this market is the rapid increase in the miniaturization of electronic devices. There has been an increase in the demand for mobility in electronic devices across the world. To be portable and cost-effective, devices need to be lightweight and small. As a result, the increased demand for mobility has translated into a trend toward the adoption of smaller devices. Also, the popularity of smaller devices in multiple sectors such as telecommunications and automotive has led to the miniaturization of semiconductor ICs. This implies that smaller and densely-built semiconductors, ICs, and PCBs have more chances of tribocharging, which can be neutralized by the use of ESD packaging. This advantage of ESD packaging over other packaging materials is expected to propel growth in the global ESD packaging market during the forecast period.

One of the latest trends gaining traction in this market is the emergence of the internet of things (IoT) and smart cities. Governments around the globe want to develop smart cities with the integration of multiple information and technology solutions. Factors such as the use of public physical infrastructure through artificial intelligence and data analytics to support strong and healthy economic, social, and cultural development, the capability to learn, adapt and innovate by responding effectively and promptly to changing circumstances by improving the intelligence of the city. Consequently, major global companies have announced the development of solutions to help in the growth of these smart cities. For instance, Cisco has introduced the Global Intelligent Urbanization initiative to support cities around the world by making the network the fourth utility along with water, electricity, and natural gas, for integrated city management. This, in turn, is expected to augment growth in the global ESD packaging market in the coming years.

Competitive landscape and key vendors

The global ESD packaging market is a highly fragmented and unorganized market. This is mainly because most of the vendors produce ESD packaging as part of a larger product line due to similarities with other products such as bubble bags and polybags. Moreover, the highly-fragmented nature of the market has given rise to intense competition, forcing vendors to engage in M&A. To gain a competitive advantage, an increasing number of vendors are expected to extend their geographical reach not only to developed countries but also to developing countries.

Leading vendors in the market are –

• BASF
• Desco Industries
• Dow Chemical Company
• PPG Industries

Other prominent vendors in the ESD packaging market include AkzoNobel, DaklaPack Group, Dou Yee, GWP Group, Kao-Chia Plastics, Miller Supply, Polyplus Packaging, TIP Corporation, and Uline.

Segmentation by product type and analysis of the ESD packaging market

• Communication network infrastructure
• Consumer electronics
• Computer peripherals
• Aerospace and defense
• Healthcare and instrumentation
• Automotive

During 2016, the communication network infrastructure dominated the ESD packaging market and accounted for a major part of the overall market share. This dominance can be attributed to the growth in the communication network infrastructure industry, especially in developing countries, such as India and Brazil. Also, the high deployment of next-generation wireless networks such as Wi-Fi, WiMAX, 3G/4G, and ultra-wideband will further support the growth of this segment in the global market.

Geographical segmentation and analysis of the ESD packaging market

• Americas
• APAC
• EMEA

In this market study, analysts have estimated APAC to dominate the ESD packaging market during the forecast period. The high concentration of electronic manufacturers in countries like China, Taiwan, South Korea, and Japan is the major contributor to the growth of the ESD packaging market in APAC. Also, the market is driven by the growing demand for smartphones and IT infrastructure in the region.

Key questions answered in the report include

• What will the market size and the growth rate be in 2021?
• What are the key factors driving the global ESD packaging market?
• What are the key market trends impacting the growth of the global ESD packaging market?
• What are the challenges to market growth?
• Who are the key vendors in the global ESD packaging market?
• What are the market opportunities and threats faced by the vendors in the global ESD packaging market?
• Trending factors influencing the market shares of the Americas, APAC, and EMEA.
• What are the key outcomes of the five forces analysis of the global ESD packaging market?

Technavio also offers customization on reports based on specific client requirement.

By identifying short- and long-term trends, marketing and research strategies, competitors, growth potential, and challenges, Technavio brings a comprehensive collection of market research reports on the various aspects of the packaging sector, which is an integral part of Technavio’s transportation and logistics industry. While analyzing the market space for the packaging sector, the research analysts have noted that this industry is observing massive market developments and structural transformations in the transportation of electronic devices, which has created countless business opportunities for the vendors. Our actionable market intelligence reports also provide information on some of the leading players in the transportation and logistics industry, who focus on offering protective and sustainable packaging solutions.

Technavio’s research analysts have focused on several market insights to offer an all-inclusive picture of the growth prospects and latest trends for packaging services like ESD packaging. The upcoming report on ESD packaging also presents a tailored and objective approach to meet research objectives through the judicious use of appropriate analytical tools and evaluates the existing marketing trends, sales, and products. ESD packaging controls electrostatic discharge using special chemical coatings and antistatic materials. It protects electronics from getting exposed to physical damage and shock during transportation. Our report expertise includes calculating new market opportunities, market sizing, categorizing key growth drivers and restraints, and operational business strategies.

Our upcoming market intelligence report on ESD packaging also considers the growth of other progressive packaging markets like composite packaging market and sterilized packaging market, which are expected to grow at CAGRs of around 5% and 6%, respectively by 2020.  Technavio also provides a detailed analysis of the various packaging services required by different end-users, the scope of the market across geographical locations, the leading vendors in the markets, and the services provided by the players. Technavio’s diverse packaging portfolio includes in-depth and knowledgeable reports on antimicrobial packaging, thermoformed packaging, blister packaging, aluminum foil packaging, insulated packaging, vacuum packaging, and modified atmosphere packaging.

The market report for ESD packaging also identifies the key drivers, emerging trends, as well as the challenges that the packaging industry is currently experiencing. It also presents insights into the changing competitive landscape to give businesses a realistic picture of the future direction of the transportation and logistics sector.