Global Fan-in Wafer Level Packaging Market 2016-2020

Global outlook of the fan-in wafer level packaging (WLP) market

Technavio’s market research analysts predict the global fan-in WLP market to grow steadily during the forecast period and post a CAGR of almost 10% by 2020. This industry research report identifies the increasing complexity of semiconductor IC designs to be one of the key factors that will have a positive impact on the growth of this market in the coming years. The addition of advanced functionalities in consumer electronic devices will lead to the increased demand for multifunctional ICs. This, in turn, will induce semiconductor manufacturers to develop new and more complex architecture and design for semiconductor ICs. As a result, there will be a significant increase in the adoption of WLP solutions as they ensure the robust performance of semiconductor ICs.

One of the major trends that will gain traction in this market is the increased adoption of semiconductor ICs in automobiles. Several automotive manufacturers have started focusing on the electrification and automation of automobiles. This will increase the need for semiconductors ICs in various products such as GPS, airbag control, anti-lock braking system (ABS), power doors and windows, car navigation and display, infotainment, collision detection technology, and automated driving and will consecutively increase the demand for packaging solutions such as fan-in wafer level packaging.

Competitive landscape and key vendors

The market consists of a few semiconductor packaging vendors and is dominated by major players such as STATS ChipPAC, STMicroelectronics, TSMC, and Texas Instruments. Vendors mainly compete on the basis of factors such as capital expenditure, pace of innovation, and new partnerships. Technological advancements in the consumer electronics sector and the Internet of Things (IoT), increase the demand for advanced packaging technologies such as fan-in and fan-out packaging, which will, in turn, intensify the level of competition among market players. Due to the demand for fan-in WLP packaging from smartphone manufacturers to develop better chip-scale packages, several vendors in the advanced packaging industry are entering the market, leading to intense competition among existing players.

The leading vendors in the market are -

• STATS ChipPAC
• STMicroelectronics
• TSMC
• Texas Instruments

The other prominent vendors in the market are Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, and FlipChip International.

Segmentation by application and analysis of the fan-in WLP market

• CMOS image sensor
• Wireless connectivity
• Logic and memory IC
• MEMS and sensor
• Analog and mixed IC

During 2015, the analog and mixed IC segment accounted for the major shares and dominated the market. The demand for analog ICs from different segments such as consumer electronics, communications, and automotive and the increasing adoption of smartphones, phablets, and tablets, will fuel the growth of the market segment in the coming years. Additionally, technological advancements in the semiconductor industry that demand the need to ensure the robust performance of advanced ICs will also drive the demand for fan-in WLP packaging.

Geographical segmentation and analysis of the fan-in WLP market

• APAC
• Europe
• North America

This market study predicts that in terms of geographical regions, APAC will be the major revenue contributor to the market throughout the next four years. This is mainly due to the presence of a number of semiconductor foundries in this region. Moreover, the rise in demand for semiconductor devices due to the presence of prominent consumer electronics manufacturers, such as Samsung, Sony, LG, Toshiba, and Panasonic, will also bolster this market’s growth prospects.

Key questions answered in the report include

• What will the market size and the growth rate be in 2020?
• What are the key factors driving the global fan-in WLP market?
• What are the key market trends impacting the growth of the global fan-in WLP market?
• What are the challenges to market growth?
• Who are the key vendors in the global fan-in WLP market?
• What are the market opportunities and threats faced by the vendors in the global fan-in WLP market?
• Trending factors influencing the market shares of APAC, Europe, and North America.
• What are the key outcomes of the five forces analysis of the global fan-in WLP market?

Technavio also offers customization on reports based on specific client requirement.

Related reports

• Global Semiconductor Packaging Equipment Market 2016-2020
• Global 3D Semiconductor Packaging Market 2016-2020
• Global System-in-package Market 2016-2020