Global Substrate-like PCB Market 2018-2022

Below are some of the key findings from the substrate-like PCB market research report

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Global substrate-like PCB industry overview

The need for miniaturization and efficient interconnect solutions is one of the most crucial factors triggering the global substrate-like PCB market growth. Industry experts have identified an increasing amount of focus on reducing the size of electronic packages, to reduce power consumption and boost functionality. All the miniaturized components need to be arranged within a limited dimension, which is not feasible in conventional printed circuit boards (PCBs). This constraint is driving the need for substrate-like PCB technology. Substrate-like PCB utilize thin conductors/interconnectors which efficiently transfers signal and power to all connected components and reduces power consumption. Moreover, substrate-like PCB are also more effective in circuit protection and heat dissipation, which is further aiding the substrate-like PCB market growth.

 The development of an advanced system in package (SiP) modules is one of the key substrate-like PCB market trends, which is anticipated to further drive the market. The application of SiP modules is growing due to benefits like bundling of communication units like modem, Wi-Fi, and Bluetooth in one package. SiP modules offer better performance at a lower cost and are significantly smaller in size when compared to a set of individual modules. As a result, there will be a continuous increase in the utilization of SiP modules by OEMs. Moreover, the demand for the miniaturization of packages and the growth of IoT will drive the need for SiP modules across the globe. The substrate-like PCB market forecast report predicts that fueled by these factors, the market will grow at a CAGR of over 7% during the forecast period.

Top substrate-like PCB companies covered in this market research report

The substrate-like PCB market is highly concentrated. The market has recently entered the growth stage and offers several opportunities to the few specialized vendors of substrate-like PCB. By offering a complete analysis of the market’s competitive landscape and with information on the products offered by the companies, this substrate-like PCB industry analysis report will aid clients to identify new growth opportunities and design new growth strategies.

The report offers a complete analysis of various companies including:

• AT&S
• IBIDEN
• Kinsus
• Samsung Electro-Mechanics
• Unimicron

Substrate-like PCB market segmentation based on geographic regions

• Americas
• APAC
• EMEA

Global substrate-like PCB market analysis reveals that the APAC region dominates the substrate-like PCB market share until 2022. APAC will also register the highest substrate-like PCB market growth throughout the forecast period.

Substrate-like PCB market segmentation based on application

• Communication
• IoT
• Others

The communications application segment will continue to lead the substrate-like PCB market share during the forecast period. Communication will also account for the highest substrate-like PCB market growth. Additionally, the report also provides an accurate prediction of the contribution of the various application segments to the growth of the substrate-like PCB market size.

Key highlights of the global substrate-like PCB market for the forecast years 2018-2022:

• CAGR of the market during the forecast period 2018-2022
• Detailed information on factors that will accelerate the growth of the substrate-like PCB market during the next five years
• Precise estimation of the global substrate-like PCB market size and its contribution to the parent market
• Accurate predictions on upcoming trends and changes in consumer behavior
• Growth of the substrate-like PCB industry across the Americas, APAC, and EMEA
• A thorough analysis of the market’s competitive landscape and detailed information on several vendors
• Comprehensive details on the factors that will challenge the growth of substrate-like PCB companies

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