High-end Semiconductor Packaging Market Analysis APAC, North America, Europe, South America, Middle East and Africa - US, Canada, China, Japan, Germany - Size and Forecast 2024-2028

Published: Mar 2024 Pages: 170 SKU: IRTNTR77666

High-end Semiconductor Packaging Market Forecast 2024-2028 

The High-end Semiconductor Packaging Market size is forecast to increase by USD 30.92 billion, at a CAGR of 14% between 2023 and 2028.  The market's growth is influenced by various factors, such as the increasing demand for smaller electronic devices, a rise in high-end semiconductor packaging product launches, and the growing adoption of semiconductor ICs in the automotive sector.

The market growth and forecasting report includes key player's detailed analyses of the competitive landscape of the market and information about 10 market companies, including Amkor Technology Inc., Analog Devices Inc., Arm Ltd., Chipbond Technology Corp., ChipMOS TECHNOLOGIES INC., Fujitsu Ltd., Intel Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., Kyocera Corp., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., PTI Inspection Systems, Renesas Electronics Corp., Taiwan Semiconductor Manufacturing Co. Ltd., Texas Instruments Inc., Tongfu Microelectronics Co. Ltd., and Samsung Electronics Co. Ltd. Additionally, Advanced Micro Devices Inc offers high-end semiconductor packaging through a metal, plastic, glass, or ceramic casing containing one or more discrete Ics.

What will be the Size of the Market During the Forecast Period?

For More Highlights About this Report, Download Free Sample in a Minute 

Market Dynamics 

The market is propelled by the escalating demand for compact electronic devices, driving technological innovations in advanced packaging, through-silicon vias, and interposers. Key players like TSMC, Intel, and Samsung contribute to the market's dynamism. The convergence of technologies, including high-performance computing, artificial intelligence, 5G, and IoT, accentuates the demand. However, challenges arise in sustaining advancements aligned with Moore's Law, ensuring Ultra High-density Fan-Out Advanced Packaging, and addressing complexities in HPC applications and vehicle electrification. Navigating these dynamics shapes the trends and challenges in the market landscape. Our researchers analyzed the market research and growth data with 2023 as the base year, along with the key market growth analysis, trends, and challenges. A holistic analysis of drivers, trends, and challenges will help companies refine their marketing strategies to gain a competitive advantage. 

Key Market  Driver

Growing demand for compact electronic devices is notably driving the market. The escalating demand for compact electronic devices like smartphones, tablets, wearables, and automotive applications has become pervasive across various sectors. This surge prompts semiconductor IC manufacturers to intensify research and development (R&D) efforts to enhance IC performance and reduce size.

Moreover, the evolution of micro-electromechanical systems (MEMS) and 3D IC chips has become prominent due to this demand. High-end semiconductor packaging, incorporating technologies like advanced packaging, through-silicon vias, and interposers, is on the rise. This packaging approach integrates multiple ICs and components, yielding highly compact solutions with superior performance, aligned with the trend in compact electronic devices. Hence, such factors are driving the market during the forecast period.

Significant Market Trends

An increase in 5G investments is an emerging trend in the market. 5G is the next generation of communication technology, following 4G, and on commercialization, 5G will be able to support data download speeds of 10,000 Mbps.  In addition, there have been numerous investments in 5G across the globe. 5G networks are designed to support significantly higher data rates compared to the previous generation.  Furthermore, this means that the semiconductor devices used in 5G infrastructure must be capable of processing and transmitting data at much faster speeds.

Moreover, it helps in achieving these high data rates by reducing signal losses and improving signal integrity. In addition, the increasing investments in 5G are creating demand for 5G network infrastructure. Furthermore, this is expected to accelerate the developments in electronic components and modules such as 5G mm-wave antenna modules, 5G multimode modems, 5G base stations, and several 5G RF products. Hence, such factors are driving the market during the forecast period.

Major Market Restrain

The high manufacturing cost of high-end semiconductor packaging due to warping is a major challenge hindering the market. One of the main factors increasing the production cost of high-end semiconductor packaging is warping. In addition, warpage is defined as a distortion where the surface of the molded part does not follow the intended shape of the design. Furthermore, this leads to the formation of a wafer surface, thus making it unusable.

Moreover, the issue of warping occurs several times during semiconductor advanced packaging, which could result in the wastage of wafers and result in high costs for the manufacturer. For example, the issue of warping can occur following the post-mold cure of the reconstituted wafer. In addition, it can also occur after the back grinding of the epoxy mold compound to expose the copper contact pad. Hence, such factors are driving the market during the forecast period.

Market Segmentation 

By End-user

The consumer electronics segment is estimated to witness significant growth during the forecast period. One of the main end-user sectors for semiconductors is consumer electronics. In addition, a few of the key factors influencing the segment's growth include the expansion of the smartphone market, rising wearable and smart device adoption, and rising consumer IoT device penetration in applications such as smart homes.

Get a glance at the market contribution of various segments Download the PDF Sample

The consumer electronics segment was the largest segment and was valued at USD 7.86 billion in 2018. Moreover, many semiconductor manufacturers predict that 5G smartphones with higher silicon content will be widely used around the world during the forecast period. In addition, due to the need for 5G smartphones to have higher power efficiency, faster speeds, and more complex functionalities, the number of semiconductor components used per device will increase. Therefore, it is anticipated that the demand for these solutions in the consumer electronics sector will rise significantly in the coming years  Furthermore, with the increased affordability of electronic equipment and rising living standards, the growth of the industry in the coming years is anticipated to be aided by the increasing adoption of consumer electronics such as laptops, tablets, fitness bands, smartwatches, and other electronic devices that require intricate semiconductor integration. Hence, such factors are fuelling the growth of this segment which in turn drives the market during the forecast period.

Market Segmentation By Technology

The growing adoption of the 3D SoCs segment will increase market growth during the forecast period. The 3D System on Chip (SoC) segment refers to a packaging technology that integrates multiple layers of semiconductor devices (chips) into a single package, creating a three-dimensional (3D) structure. In addition, 3D SoCs offer many benefits over traditional multi-chip systems. Moreover, a few of these benefits include much less power consumption and miniaturization of an electronic system. Therefore, several electronic products, including laptops and desktops, have been using 3D SoCs for more than two decades. Hence, such factors are fuelling the growth of this segment which in turn drives the market during the forecast period.

Regional Overview

For more insights on the market share of various regions Download PDF Sample now!

APAC is estimated to contribute 31% to the growth of the global market during the forecast period. Technavio's analysts have provided extensive insight into the market forecast, detailing the regional trends and drivers influencing the market's trajectory throughout the forecast period. The presence of several prominent semiconductor foundries, including TSMC, United Microelectronics, Samsung Semiconductor, and Semiconductor Manufacturing International (SMIC), as well as numerous outsourced semiconductor assembly and test (OSAT) vendors, is driving the market in APAC. In addition, these manufacturers are investing heavily in building new fabs in the region. For example, in December 2023, Semiconductor Manufacturing International, a major semiconductor foundry in China,  announced the opening of its largest 300mm wafer manufacturing facility in Shanghai by the first half of 2024. Hence, such factors are driving the market in APAC during the forecast period.

Market Customer Landscape

The market forecasting report includes the adoption lifecycle of the market research and growth, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. Furthermore, the report also includes key purchase criteria and drivers of price sensitivity to help companies evaluate and develop their market growth and trends strategies.

Global Market Customer Landscape

Market Companies

Companies are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.

ASE Technology Holding Co. Ltd: The company offers high-end semiconductor packaging, such as systems in package, It provides automation, and heterogeneous integration in machine and production systems.

Market analysis and report of qualitative and quantitative analysis of companies has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize companies as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize companies as dominant, leading, strong, tentative, and weak.

Segment Overview

The market research report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2018 to 2028.

  • End-user Outlook
    • Consumer electronics
    • Telecom and datacom
    • Automotive
    • Others
  • Technology Outlook
    • 3D SoC
    • 3D stacked memory
    • 2.5D interposers
    • UHD FO
    • Embedded Si bridge
  • Region Outlook
    • North America
      • The U.S.
      • Canada
    • Europe
      • The U.K.
      • Germany
      • France
      • Rest of Europe
    • APAC
      • China
      • India
    • South America
      • Chile
      • Argentina
      • Brazil
    • Middle East & Africa
      • Saudi Arabia
      • South Africa
      • Rest of the Middle East & Africa

Market Analyst Overview

The Market is witnessing substantial growth, driven by factors such as the demand for compact electronic devices, advancements in semiconductor packaging, and the integration of semiconductor ICs in automotive applications. Key technologies like Through-Silicon Vias (TSV), 2.5D IC packages, and Ultra High-density Fan-Out Advanced Packaging play pivotal roles. The influence of Moore's Law, essential for high-performance computing (HPC) and artificial intelligence (AI) industries, shapes the market.

Moreover, the COVID-19 pandemic has accelerated trends in vehicle electrification, emphasizing semiconductor use in automotive electronics, Advanced Driver Assistance Systems (ADAS), and infotainment systems. With a focus on 5G services, the semiconductor industry addresses connectivity demands in smart devices and wearable technologies. The market emphasizes advanced packaging techniques, addressing challenges like power densities and thermal management. System-in-Package (SiP) technologies, 2.5D/3D packaging, and the integration of processors, memory units, and accelerators are optimizing latency and enhancing performance. Mechanical stress, heat sinks, thermal pads, and considerations for electromagnetic interference and compatibility are crucial in this landscape. Silicon interposers and the use of plastic materials like Polyethylene (PE) and Polypropylene (PP) are notable trends. As wearable devices become more prevalent, the market is positioned for sustained growth and innovation.

Similarly, the market's future hinges on innovative packaging techniques, efficient thermal management, and advanced chip designs, such as FinFET transistors and 3D stacked chips. As the industry evolves, Si Interposers, Logic chips, and high-speed memory chips continue to redefine the Market. The Market is experiencing significant growth driven by various factors. Bridges between innovation and demand are being built in this landscape, with the Semiconductor Industry Association playing a pivotal role. The Ultra High-density Fan-Out Advanced Packaging Segment, focusing on advanced technologies like Through Silicon Via (TSV) and the Internet of Things (IoT), is at the forefront. In this dynamic sector, Artificial Intelligence (AI) industry developments, GPU advancements, and the deployment of 5G services through Future Market Insights are shaping the market. Autonomous driving, security monitoring, and the increasing adoption of Advanced Driver Assistance Systems (ADAS) in automotive electronics are key drivers.

Market Scope

Report Coverage

Details

Page number

170

Base year

2023

Historic period

2018-2022

Forecast period

2024-2028

Growth momentum & CAGR

Accelerate at a CAGR of 14%

Market Growth 2024-2028

USD 30.92 billion

Market structure

Fragmented

YoY growth 2023-2024(%)

13.35

Regional analysis

APAC, North America, Europe, South America, and the Middle East and Africa

Performing market contribution

APAC at 31%

Key countries

US, Canada, China, Japan, and Germany

Competitive landscape

 Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks

Key companies profiled

Advanced Micro Devices Inc., ASE Technology Holding Co. Ltd., Amkor Technology Inc., Analog Devices Inc., Arm Ltd., Chipbond Technology Corp., ChipMOS TECHNOLOGIES INC., Fujitsu Ltd., Intel Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., Kyocera Corp., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., PTI Inspection Systems, Renesas Electronics Corp., Taiwan Semiconductor Manufacturing Co. Ltd., Texas Instruments Inc., Tongfu Microelectronics Co. Ltd., and Samsung Electronics Co. Ltd.

Market dynamics

Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, and Market condition analysis for the forecast period.

Customization purview

If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.

Download PDF Sample

What are the Key Data Covered in this Market Research Report?

  • CAGR of the market report forecast during the forecast period
  • Detailed information on factors that will drive the growth of the semiconductor packaging market between 2023 and 2028
  • Precise estimation of the market  size and its contribution to the market in focus on the parent market
  • Accurate predictions about upcoming trends and changes in consumer behavior
  • Growth of the market across APAC, North America, Europe, South America, and the Middle East and Africa
  • Thorough market analysis and report of the market’s competitive landscape and detailed information about companies
  • Comprehensive analysis of factors that will challenge the growth of semiconductor packaging market players

We can help! Our analysts can customize this market research report to meet your requirements. Get in touch

 

1 Executive Summary

  • 1.1 Market overview
    • Exhibit 01: Executive Summary – Chart on Market Overview
    • Exhibit 02: Executive Summary – Data Table on Market Overview
    • Exhibit 03: Executive Summary – Chart on Global Market Characteristics
    • Exhibit 04: Executive Summary – Chart on Market by Geography
    • Exhibit 05: Executive Summary – Chart on Market Segmentation by End-user
    • Exhibit 06: Executive Summary – Chart on Market Segmentation by Technology
    • Exhibit 07: Executive Summary – Chart on Incremental Growth
    • Exhibit 08: Executive Summary – Data Table on Incremental Growth
    • Exhibit 09: Executive Summary – Chart on Vendor Market Positioning

2 Market Landscape

  • 2.1 Market ecosystem
    • Exhibit 10: Parent market
    • Exhibit 11: Market Characteristics

3 Market Sizing

  • 3.1 Market definition
    • Exhibit 12: Offerings of vendors included in the market definition
  • 3.2 Market segment analysis
    • Exhibit 13: Market segments
  • 3.3 Market size 2023
    • 3.4 Market outlook: Forecast for 2023-2028
      • Exhibit 14: Chart on Global - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 15: Data Table on Global - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 16: Chart on Global Market: Year-over-year growth 2023-2028 (%)
      • Exhibit 17: Data Table on Global Market: Year-over-year growth 2023-2028 (%)

    4 Historic Market Size

    • 4.1 Global high end semiconductor packaging market 2018 - 2022
      • Exhibit 18: Historic Market Size – Data Table on global high end semiconductor packaging market 2018 - 2022 ($ billion)
    • 4.2 End-user Segment Analysis 2018 - 2022
      • Exhibit 19: Historic Market Size – End-user Segment 2018 - 2022 ($ billion)
    • 4.3 Technology Segment Analysis 2018 - 2022
      • Exhibit 20: Historic Market Size – Technology Segment 2018 - 2022 ($ billion)
    • 4.4 Geography Segment Analysis 2018 - 2022
      • Exhibit 21: Historic Market Size – Geography Segment 2018 - 2022 ($ billion)
    • 4.5 Country Segment Analysis 2018 - 2022
      • Exhibit 22: Historic Market Size – Country Segment 2018 - 2022 ($ billion)

    5 Five Forces Analysis

    • 5.1 Five forces summary
      • Exhibit 23: Five forces analysis - Comparison between 2023 and 2028
    • 5.2 Bargaining power of buyers
      • Exhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2023 and 2028
    • 5.3 Bargaining power of suppliers
      • Exhibit 25: Bargaining power of suppliers – Impact of key factors in 2023 and 2028
    • 5.4 Threat of new entrants
      • Exhibit 26: Threat of new entrants – Impact of key factors in 2023 and 2028
    • 5.5 Threat of substitutes
      • Exhibit 27: Threat of substitutes – Impact of key factors in 2023 and 2028
    • 5.6 Threat of rivalry
      • Exhibit 28: Threat of rivalry – Impact of key factors in 2023 and 2028
    • 5.7 Market condition
      • Exhibit 29: Chart on Market condition - Five forces 2023 and 2028

    6 Market Segmentation by End-user

    • 6.1 Market segments
      • Exhibit 30: Chart on End-user - Market share 2023-2028 (%)
      • Exhibit 31: Data Table on End-user - Market share 2023-2028 (%)
    • 6.2 Comparison by End-user
      • Exhibit 32: Chart on Comparison by End-user
      • Exhibit 33: Data Table on Comparison by End-user
    • 6.3 Consumer electronics - Market size and forecast 2023-2028
      • Exhibit 34: Chart on Consumer electronics - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 35: Data Table on Consumer electronics - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 36: Chart on Consumer electronics - Year-over-year growth 2023-2028 (%)
      • Exhibit 37: Data Table on Consumer electronics - Year-over-year growth 2023-2028 (%)
    • 6.4 Telecom and datacom - Market size and forecast 2023-2028
      • Exhibit 38: Chart on Telecom and datacom - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 39: Data Table on Telecom and datacom - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 40: Chart on Telecom and datacom - Year-over-year growth 2023-2028 (%)
      • Exhibit 41: Data Table on Telecom and datacom - Year-over-year growth 2023-2028 (%)
    • 6.5 Automotive - Market size and forecast 2023-2028
      • Exhibit 42: Chart on Automotive - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 43: Data Table on Automotive - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 44: Chart on Automotive - Year-over-year growth 2023-2028 (%)
      • Exhibit 45: Data Table on Automotive - Year-over-year growth 2023-2028 (%)
    • 6.6 Others - Market size and forecast 2023-2028
      • Exhibit 46: Chart on Others - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 47: Data Table on Others - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 48: Chart on Others - Year-over-year growth 2023-2028 (%)
      • Exhibit 49: Data Table on Others - Year-over-year growth 2023-2028 (%)
    • 6.7 Market opportunity by End-user
      • Exhibit 50: Market opportunity by End-user ($ billion)
      • Exhibit 51: Data Table on Market opportunity by End-user ($ billion)

    7 Market Segmentation by Technology

    • 7.1 Market segments
      • Exhibit 52: Chart on Technology - Market share 2023-2028 (%)
      • Exhibit 53: Data Table on Technology - Market share 2023-2028 (%)
    • 7.2 Comparison by Technology
      • Exhibit 54: Chart on Comparison by Technology
      • Exhibit 55: Data Table on Comparison by Technology
    • 7.3 3D SoC - Market size and forecast 2023-2028
      • Exhibit 56: Chart on 3D SoC - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 57: Data Table on 3D SoC - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 58: Chart on 3D SoC - Year-over-year growth 2023-2028 (%)
      • Exhibit 59: Data Table on 3D SoC - Year-over-year growth 2023-2028 (%)
    • 7.4 3D stacked memory - Market size and forecast 2023-2028
      • Exhibit 60: Chart on 3D stacked memory - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 61: Data Table on 3D stacked memory - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 62: Chart on 3D stacked memory - Year-over-year growth 2023-2028 (%)
      • Exhibit 63: Data Table on 3D stacked memory - Year-over-year growth 2023-2028 (%)
    • 7.5 2.5D interposers - Market size and forecast 2023-2028
      • Exhibit 64: Chart on 2.5D interposers - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 65: Data Table on 2.5D interposers - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 66: Chart on 2.5D interposers - Year-over-year growth 2023-2028 (%)
      • Exhibit 67: Data Table on 2.5D interposers - Year-over-year growth 2023-2028 (%)
    • 7.6 UHD FO - Market size and forecast 2023-2028
      • Exhibit 68: Chart on UHD FO - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 69: Data Table on UHD FO - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 70: Chart on UHD FO - Year-over-year growth 2023-2028 (%)
      • Exhibit 71: Data Table on UHD FO - Year-over-year growth 2023-2028 (%)
    • 7.7 Embedded Si bridge - Market size and forecast 2023-2028
      • Exhibit 72: Chart on Embedded Si bridge - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 73: Data Table on Embedded Si bridge - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 74: Chart on Embedded Si bridge - Year-over-year growth 2023-2028 (%)
      • Exhibit 75: Data Table on Embedded Si bridge - Year-over-year growth 2023-2028 (%)
    • 7.8 Market opportunity by Technology
      • Exhibit 76: Market opportunity by Technology ($ billion)
      • Exhibit 77: Data Table on Market opportunity by Technology ($ billion)

    8 Customer Landscape

    • 8.1 Customer landscape overview
      • Exhibit 78: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

    9 Geographic Landscape

    • 9.1 Geographic segmentation
      • Exhibit 79: Chart on Market share by geography 2023-2028 (%)
      • Exhibit 80: Data Table on Market share by geography 2023-2028 (%)
    • 9.2 Geographic comparison
      • Exhibit 81: Chart on Geographic comparison
      • Exhibit 82: Data Table on Geographic comparison
    • 9.3 APAC - Market size and forecast 2023-2028
      • Exhibit 83: Chart on APAC - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 84: Data Table on APAC - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 85: Chart on APAC - Year-over-year growth 2023-2028 (%)
      • Exhibit 86: Data Table on APAC - Year-over-year growth 2023-2028 (%)
    • 9.4 North America - Market size and forecast 2023-2028
      • Exhibit 87: Chart on North America - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 88: Data Table on North America - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 89: Chart on North America - Year-over-year growth 2023-2028 (%)
      • Exhibit 90: Data Table on North America - Year-over-year growth 2023-2028 (%)
    • 9.5 Europe - Market size and forecast 2023-2028
      • Exhibit 91: Chart on Europe - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 92: Data Table on Europe - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 93: Chart on Europe - Year-over-year growth 2023-2028 (%)
      • Exhibit 94: Data Table on Europe - Year-over-year growth 2023-2028 (%)
    • 9.6 South America - Market size and forecast 2023-2028
      • Exhibit 95: Chart on South America - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 96: Data Table on South America - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 97: Chart on South America - Year-over-year growth 2023-2028 (%)
      • Exhibit 98: Data Table on South America - Year-over-year growth 2023-2028 (%)
    • 9.7 Middle East and Africa - Market size and forecast 2023-2028
      • Exhibit 99: Chart on Middle East and Africa - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 100: Data Table on Middle East and Africa - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 101: Chart on Middle East and Africa - Year-over-year growth 2023-2028 (%)
      • Exhibit 102: Data Table on Middle East and Africa - Year-over-year growth 2023-2028 (%)
    • 9.8 China - Market size and forecast 2023-2028
      • Exhibit 103: Chart on China - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 104: Data Table on China - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 105: Chart on China - Year-over-year growth 2023-2028 (%)
      • Exhibit 106: Data Table on China - Year-over-year growth 2023-2028 (%)
    • 9.9 US - Market size and forecast 2023-2028
      • Exhibit 107: Chart on US - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 108: Data Table on US - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 109: Chart on US - Year-over-year growth 2023-2028 (%)
      • Exhibit 110: Data Table on US - Year-over-year growth 2023-2028 (%)
    • 9.10 Germany - Market size and forecast 2023-2028
      • Exhibit 111: Chart on Germany - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 112: Data Table on Germany - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 113: Chart on Germany - Year-over-year growth 2023-2028 (%)
      • Exhibit 114: Data Table on Germany - Year-over-year growth 2023-2028 (%)
    • 9.11 Japan - Market size and forecast 2023-2028
      • Exhibit 115: Chart on Japan - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 116: Data Table on Japan - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 117: Chart on Japan - Year-over-year growth 2023-2028 (%)
      • Exhibit 118: Data Table on Japan - Year-over-year growth 2023-2028 (%)
    • 9.12 Canada - Market size and forecast 2023-2028
      • Exhibit 119: Chart on Canada - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 120: Data Table on Canada - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 121: Chart on Canada - Year-over-year growth 2023-2028 (%)
      • Exhibit 122: Data Table on Canada - Year-over-year growth 2023-2028 (%)
    • 9.13 Market opportunity by geography
      • Exhibit 123: Market opportunity by geography ($ billion)
      • Exhibit 124: Data Tables on Market opportunity by geography ($ billion)

    10 Drivers, Challenges, and Trends

    • 10.1 Market drivers
      • 10.2 Market challenges
        • 10.3 Impact of drivers and challenges
          • Exhibit 125: Impact of drivers and challenges in 2023 and 2028
        • 10.4 Market trends

          11 Vendor Landscape

          • 11.1 Overview
            • 11.2 Vendor landscape
              • Exhibit 126: Overview on Criticality of inputs and Factors of differentiation
            • 11.3 Landscape disruption
              • Exhibit 127: Overview on factors of disruption
            • 11.4 Industry risks
              • Exhibit 128: Impact of key risks on business

            12 Vendor Analysis

            • 12.1 Vendors covered
              • Exhibit 129: Vendors covered
            • 12.2 Market positioning of vendors
              • Exhibit 130: Matrix on vendor position and classification
            • 12.3 Advanced Micro Devices Inc.
              • Exhibit 131: Advanced Micro Devices Inc. - Overview
              • Exhibit 132: Advanced Micro Devices Inc. - Business segments
              • Exhibit 133: Advanced Micro Devices Inc. - Key news
              • Exhibit 134: Advanced Micro Devices Inc. - Key offerings
              • Exhibit 135: Advanced Micro Devices Inc. - Segment focus
            • 12.4 ASE Technology Holding Co. Ltd.
              • Exhibit 136: ASE Technology Holding Co. Ltd. - Overview
              • Exhibit 137: ASE Technology Holding Co. Ltd. - Business segments
              • Exhibit 138: ASE Technology Holding Co. Ltd. - Key offerings
              • Exhibit 139: ASE Technology Holding Co. Ltd. - Segment focus
            • 12.5 Amkor Technology Inc.
              • Exhibit 140: Amkor Technology Inc. - Overview
              • Exhibit 141: Amkor Technology Inc. - Business segments
              • Exhibit 142: Amkor Technology Inc. - Key offerings
              • Exhibit 143: Amkor Technology Inc. - Segment focus
            • 12.6 Analog Devices Inc.
              • Exhibit 144: Analog Devices Inc. - Overview
              • Exhibit 145: Analog Devices Inc. - Business segments
              • Exhibit 146: Analog Devices Inc. - Key news
              • Exhibit 147: Analog Devices Inc. - Key offerings
              • Exhibit 148: Analog Devices Inc. - Segment focus
            • 12.7 ChipMOS TECHNOLOGIES INC.
              • Exhibit 149: ChipMOS TECHNOLOGIES INC. - Overview
              • Exhibit 150: ChipMOS TECHNOLOGIES INC. - Business segments
              • Exhibit 151: ChipMOS TECHNOLOGIES INC. - Key offerings
              • Exhibit 152: ChipMOS TECHNOLOGIES INC. - Segment focus
            • 12.8 Fujitsu Ltd.
              • Exhibit 153: Fujitsu Ltd. - Overview
              • Exhibit 154: Fujitsu Ltd. - Business segments
              • Exhibit 155: Fujitsu Ltd. - Key news
              • Exhibit 156: Fujitsu Ltd. - Key offerings
              • Exhibit 157: Fujitsu Ltd. - Segment focus
            • 12.9 Intel Corp.
              • Exhibit 158: Intel Corp. - Overview
              • Exhibit 159: Intel Corp. - Business segments
              • Exhibit 160: Intel Corp. - Key news
              • Exhibit 161: Intel Corp. - Key offerings
              • Exhibit 162: Intel Corp. - Segment focus
            • 12.10 Jiangsu Changdian Technology Co. Ltd.
              • Exhibit 163: Jiangsu Changdian Technology Co. Ltd. - Overview
              • Exhibit 164: Jiangsu Changdian Technology Co. Ltd. - Product / Service
              • Exhibit 165: Jiangsu Changdian Technology Co. Ltd. - Key offerings
            • 12.11 King Yuan Electronics Co. Ltd.
              • Exhibit 166: King Yuan Electronics Co. Ltd. - Overview
              • Exhibit 167: King Yuan Electronics Co. Ltd. - Business segments
              • Exhibit 168: King Yuan Electronics Co. Ltd. - Key offerings
              • Exhibit 169: King Yuan Electronics Co. Ltd. - Segment focus
            • 12.12 Kyocera Corp.
              • Exhibit 170: Kyocera Corp. - Overview
              • Exhibit 171: Kyocera Corp. - Key offerings
            • 12.13 Powertech Technology Inc.
              • Exhibit 172: Powertech Technology Inc. - Overview
              • Exhibit 173: Powertech Technology Inc. - Business segments
              • Exhibit 174: Powertech Technology Inc. - Key offerings
              • Exhibit 175: Powertech Technology Inc. - Segment focus
            • 12.14 Samsung Electronics Co. Ltd.
              • Exhibit 176: Samsung Electronics Co. Ltd. - Overview
              • Exhibit 177: Samsung Electronics Co. Ltd. - Business segments
              • Exhibit 178: Samsung Electronics Co. Ltd. - Key news
              • Exhibit 179: Samsung Electronics Co. Ltd. - Key offerings
              • Exhibit 180: Samsung Electronics Co. Ltd. - Segment focus
            • 12.15 Taiwan Semiconductor Manufacturing Co. Ltd.
              • Exhibit 181: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
              • Exhibit 182: Taiwan Semiconductor Manufacturing Co. Ltd. - Product / Service
              • Exhibit 183: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
            • 12.16 Texas Instruments Inc.
              • Exhibit 184: Texas Instruments Inc. - Overview
              • Exhibit 185: Texas Instruments Inc. - Business segments
              • Exhibit 186: Texas Instruments Inc. - Key news
              • Exhibit 187: Texas Instruments Inc. - Key offerings
              • Exhibit 188: Texas Instruments Inc. - Segment focus
            • 12.17 Tongfu Microelectronics Co. Ltd.
              • Exhibit 189: Tongfu Microelectronics Co. Ltd. - Overview
              • Exhibit 190: Tongfu Microelectronics Co. Ltd. - Product / Service
              • Exhibit 191: Tongfu Microelectronics Co. Ltd. - Key offerings

            13 Appendix

            • 13.1 Scope of the report
              • 13.2 Inclusions and exclusions checklist
                • Exhibit 192: Inclusions checklist
                • Exhibit 193: Exclusions checklist
              • 13.3 Currency conversion rates for US$
                • Exhibit 194: Currency conversion rates for US$
              • 13.4 Research methodology
                • Exhibit 195: Research methodology
                • Exhibit 196: Validation techniques employed for market sizing
                • Exhibit 197: Information sources
              • 13.5 List of abbreviations
                • Exhibit 198: List of abbreviations

              Research Framework

              Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

              INFORMATION SOURCES

              Primary sources

              • Manufacturers and suppliers
              • Channel partners
              • Industry experts
              • Strategic decision makers

              Secondary sources

              • Industry journals and periodicals
              • Government data
              • Financial reports of key industry players
              • Historical data
              • Press releases

              DATA ANALYSIS

              Data Synthesis

              • Collation of data
              • Estimation of key figures
              • Analysis of derived insights

              Data Validation

              • Triangulation with data models
              • Reference against proprietary databases
              • Corroboration with industry experts

              REPORT WRITING

              Qualitative

              • Market drivers
              • Market challenges
              • Market trends
              • Five forces analysis

              Quantitative

              • Market size and forecast
              • Market segmentation
              • Geographical insights
              • Competitive landscape

              PURCHASE FULL REPORT OF

              high end semiconductor packaging market market

              QUICK BUY

              Key Questions Answered

              • What are the key global market and the regional market share?
              • What are the revenue-generating key market segments?
              • What are the key factors driving and challenging this market’s growth?
              • Who are the key market vendors and their growth strategies?
              • What are the latest trends influencing the growth of this market?
              • What are the variables influencing the market growth in the primary regions?
              • What are the factors influencing the growth of the parent market?

              Why should you prefer Technavio's market insights report?

              • Off-the-shelf research reports
              • Reports can be tailored to meet the customer's needs
              • Trusted by more than 100 fortune 500 organizations
              • Information about the market's key drivers, trends, and challenges
              • Parent market analysis
              • Every week, 50,000 people visit our subscription platform
              • Detailed vendors report with competitive landscape
              • Covid-19 impact and recovery analysis
              • Data on revenue-generating market segments
              • Details on the market shares of various regions
              • Five-force market analysis