Outsourced Semiconductor Assembly And Test (OSAT) Market Analysis APAC, North America, Europe, South America, Middle East and Africa - US, China, Taiwan, South Korea, Japan - Size and Forecast 2024-2028

Published: Feb 2024 Pages: 158 SKU: IRTNTR77631

Outsourced Semiconductor Assembly And Test (OSAT) Market Forecast 2024-2028 

The Outsourced Semiconductor Assembly And Test (OSAT) Market market size is projected to increase by USD 23.06 billion, at a CAGR of 8.32% between between 2023 and 2028. The growth rate of the market depends on several factors, including advances in the packaging of chips, growing demand for miniaturization, and the increasing number of fabless semiconductor companies. Outsourced semiconductor assembly and test (OSAT) are vendors that provide specialized manufacturing and testing services to semiconductor companies. The OSAT services involve assembling, packaging, and testing integrated circuits (ICs), and other semiconductor devices.

The market growth and forecasting report includes key player's detailed analyses of the competitive landscape of the market and information about 20 market companies, including Aehr Test Systems, Amkor Technology Inc., ASE Technology Holding Co. Ltd., Chipbond Technology Corp., ChipMOS TECHNOLOGIES INC., Cohu Inc., Global Unichip Corp, Great Wall Technologies Pvt Ltd., HANA Micron Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., Lingsen Precision Industries Ltd., Powertech Technology Inc., SIGURD MICROELECTRONICS CORP., Taiwan Semiconductor Manufacturing Co. Ltd., Teradyne Inc., Tongfu Microelectronics Co. Ltd., UTAC Holdings Ltd., and Walton Advanced Engineering Inc. Additionally, Amkor Technology Inc provides comprehensive OSAT solutions, encompassing wafer sort, bump services, packaging, as well as test and burn-in services, offering turnkey solutions for diverse semiconductor needs.

What will be the Size of the Market During the Forecast Period?

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Market Overview

Key Driver

Advances in the packaging of chips are notably driving market growth. Using 3D packaging, foundries can reduce the size of electronic products with the help of miniaturized ICs. Moreover, 3D packaging allows the stacking of intelligence centers, which further addresses the challenge of space constraints. Such packaging techniques encourage electronic device manufacturers to develop advanced products that are much smaller in size, consume less power, and have an overall reduced product cost. Organic-substrate-interposer technology is highly adopted due to its low costs compared with silicon interposer technology. Some highly efficient RF applications have been shown using live connectors. However, their effectiveness in the next-generation application is still being studied.

Further, TSV-efficient interconnect techniques are used as an alternative to wire-bond and flip chips to create 3D packages and integrated 3D circuits. The 2.5/3D IC technology uses TSVs, which enable increased circuit compression, performance, and volume performance. 3D ICs are piled directly on top of each other, with interconnections being made by matching bond areas with TSVs. It also has an application on CMOS image sensors. TSVs are built into the back of the image sensor to create interconnectors, remove wire bonds, and allow for reduced form factor and high-density interconnects. Such factors are expected to drive the market growth during the forecast period. 

Key Trends

The increasing number of strategic partnerships and acquisitions is an emerging trend shaping market growth. In the ever-evolving outsourced semiconductor assembly and test market, companies are proactively engaging in strategic partnerships and acquisitions to fortify their presence across geographies, propel product development, gain access to cutting-edge technologies, and facilitate resource-sharing. This trend is indicative of the industry's dynamic nature, where collaboration and acquisition serve as essential growth strategies. Noteworthy examples include Aptos Technology's collaboration with Kaynes Semicon to establish a semiconductor packaging and testing facility, Foxconn Technology Group and HCL Group's joint venture to create an OSAT facility in India focusing on semiconductor design and test software.

Similarly, Amkor Technology Inc.'s partnership with GlobalFoundries to bolster the European supply chain for automotive semiconductor wafer production, and ASIP Technologies' joint venture with APACT in South Korea to establish a comprehensive OSAT facility in India by 2025, covering package design, bumping, assembly, testing, and dropship solutions. These strategic maneuvers are poised to significantly impact and contribute to positive growth in market trends during the forecast period. 

Significant Restrain

The rising shortage of semiconductors is a significant challenge hindering market growth. The semiconductor industry is a highly volatile sector, which sees cyclical patterns that may witness an increase in profit margins and revenue, followed by a slump and retrenchments in the industry. This cyclical nature of the global semiconductor industry leads to the industry is highly volatile. Some examples of downturns that affect the outsourced semiconductor assembly and test market drastically are excess production capacity, rapid obsolescence of products, and rapid price erosion in digital ICs. These high fluctuations can often lead to excess inventory levels in times of low demand as well as low inventory levels in times of high demand. 

Further, the average price of DRAM fell by 3%-8% due to the conflict between Russia and Ukraine in 2022. As a result, leading electronics manufacturers, such as Samsung Electronics Co. Ltd. and SK HYNIX Inc., decided to cut their investments in DRAM production and divert their resources toward the production of complementary metal oxide semiconductor image sensors. Thus, vendors of semiconductors must manage and maintain IC inventories to avoid monetary losses. These factors will negatively impact the growth of the market during the forecast period.

Market Segmentation 

By Service

The market share growth by the assembly and packaging segment will be significant during the forecast period. The semiconductor industry is highly dependent on OSAT for performing tasks related to the final stages of production. This includes tasks such as sealing, wire bonding, encapsulation, and testing. The assembly services of semiconductor products is a highly dynamic industry, where vendors must make high R and D investments to stay competitive in the outsourced semiconductor assembly and test market.

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The assembly and packaging segment was the largest and was valued at USD 25.15 billion in 2018. OSAT companies are involved in designing and developing packages for semiconductor products, which can reduce the overall component size while retaining or even increasing efficiency and performance. OSAT offers advanced packaging technologies such as advanced system in package (SiP), wafer-level packaging, embedded die solutions, multi-chip modules, heterogeneous integration, three-dimension () through-silicon via (TSV) technology, and 3D IC. The rising demand for these high-end packaging solutions is accelerating the adoption of OSAT service by integrated device manufacturers (IDM), fabless companies and foundries. Moreover, the growing complexity in the semiconductor assembly and packaging process owing to the advancement in manufacturing nodes and the miniaturization of the ICs is expected to propel the growth of the segment during the forecast period. 

Market Segmentation By End-user

OSAT companies have a pivotal role in the telecommunication industry by providing specialized expertise, and cost-effective, and customized services that are needed to produce high-quality semiconductor chips. These chips are essential for the operations of telecommunication networks and the development of new telecommunication devices and technologies. Telecommunication is constantly evolving with new technologies such as fifth-generation (5G), IoT, and edge computing, driving the need for advanced semiconductor chips. Therefore, OSAT companies help telecommunication companies stay at the forefront of the technologies by providing the latest assembly and packaging solutions. Further, the increasing deployment of 5G technology in communication is expected to drive the demand for OSAT to provide high-quality services for assembly, packaging and testing services. Thus, the telecommunication segment is expected to witness substantial growth in the market during the forecast period.

Regional Overview

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APAC is estimated to contribute 58% to the growth of the global market during the forecast period. Technavio's analysts have provided extensive insight into the market forecast, detailing the regional trends and drivers influencing the market's trajectory throughout the forecast period. There are a few key countries, such as Taiwan, South Korea, Japan, and China, which contribute significantly to market demand as they are the base for most of the major semiconductor device manufacturers due to the cheap labor costs and proximity to various raw material supply sources. In addition, the presence of end-user industries, especially those manufacturing consumer electronics and mobile devices, supports the demand for OSAT services in APAC. Moreover, the rising demand for miniaturized ICs is increasing from several end-user industries, such as consumer electronics, automotive, optical devices, and others, primarily due to advances in wired and wireless technologies, the growing implementation of IoT, increasing automation in these industries, has necessitated the need for OSAT vendors for providing assembly and packaging technologies.

In addition, the companies are heavily investing in the expansion of OSAT facilities to meet the growing demand for testing, assembly, and packaging of semiconductor products. For instance, in October 2023, Jiangsu Changjiang Electronics Technology Co., Ltd., a leading IC manufacturing and OSAT services provider in China, announced the expansion of OSAT facility capacity in the city of Jiangyin in China. Such expansion is expected to accelerate the growth of the regional market during the forecast period.

Market Customer Landscape

The market forecasting report includes the adoption lifecycle of the market research and growth, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. Furthermore, the report also includes key purchase criteria and drivers of price sensitivity to help companies evaluate and develop their market growth and trends strategies.

Global Market Customer Landscape

Market Companies

Companies are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.

ASE Technology Holding Co. Ltd. - The company offers OSAT solutions for PC, communications, consumer integrated circuits markets under the brand Siliconware Precision Industries. 

Market analysis and report of qualitative and quantitative analysis of companies has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize companies as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize companies as dominant, leading, strong, tentative, and weak.

Segment Overview

The market research report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2018 to 2028. 

  • Service Outlook
    • Assembly and packaging
    • Testing
  • End-user Outlook
    • Telecommunication
    • Consumer electronics
    • Industrial electronics
    • Automotive
    • Others
  • Region Outlook
    • North America
      • The U.S.
      • Canada
    • South America
      • Chile 
      • Brazil
      • Australia 
    • Europe
      • U.K.
      • Germany
      • France
      • Rest of Europe
    • APAC
      • China
      • India
    • Middle East & Africa
      • Saudi Arabia
      • South Africa
      • Rest of the Middle East & Africa

Market Analyst Overview 

The global OSAT market is intricately linked to the semiconductor industry's dynamics, with semiconductor demand and chip manufacturing being pivotal aspects. OSATs (Outsourced Semiconductor Assembly and Test) play a crucial role in semiconductor product development by offering innovative and cost-effective solutions in IC packaging and testing. Key players like AMD and Nvidia leverage OSATs for their chip packaging and test services, essential building blocks for modern technology. As advancements in fields like AI, cloud computing, and high-speed, low-power integration drive significant sales, OSAT plants become integral for efficient downstream technologies. Key sectors like AI, automotive, and electronics influence the market, facing challenges and threats that impact capacity utilization and operations, necessitating stock adjustments for a balanced approach.

However, the market faces challenges, including declining demand in certain sectors like cloud services, influencing OSAT plants in the first half of 2023. The miniaturization trend, a major factor shaping the testing process, continues to impact the OSAT market, while vertical integration by key semiconductor manufacturers poses both opportunities and threats. The market's recent years have seen a shift toward core competencies, with large players focusing on control over front-end devices, and despite high expenditures, the OSAT market demonstrates resilience and a capacity for moderate recovery in the upcoming quarters. 

Outsourced Semiconductor Assembly And Test (OSAT) Market Scope

Report Coverage

Details

Page number

158

Base year

2023

Historic period

2018-2022

Forecast period

2024-2028

Growth momentum & CAGR

Accelerate at a CAGR of 8.32%

Market Growth 2024-2028

USD 23.06 billion

Market structure

Fragmented

YoY growth 2023-2024(%)

6.42

Regional analysis

APAC, North America, Europe, South America, and Middle East and Africa

Performing market contribution

APAC at 58%

Key countries

US, China, Taiwan, South Korea, and Japan

Competitive landscape

 Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks

Key companies profiled

Aehr Test Systems, Amkor Technology Inc., ASE Technology Holding Co. Ltd., Chipbond Technology Corp., ChipMOS TECHNOLOGIES INC., Cohu Inc., Global Unichip Corp, Great Wall Technologies Pvt Ltd., HANA Micron Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., Lingsen Precision Industries Ltd., Powertech Technology Inc., SIGURD MICROELECTRONICS CORP., Taiwan Semiconductor Manufacturing Co. Ltd., Teradyne Inc., Tongfu Microelectronics Co. Ltd., UTAC Holdings Ltd., and Walton Advanced Engineering Inc.

Market dynamics

Parent market growth analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for the forecast period. 

Customization purview

If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.

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What are the Key Data Covered in this Market Research Report?

  • CAGR of the market report forecast during the forecast period
  • Detailed information on factors that will drive the growth of the market  between 2024 and 2028
  • Precise estimation of the market  size and its contribution of the market in focus to the parent market
  • Accurate predictions about upcoming trends and changes in consumer behavior
  • Growth of the market across APAC, North America, Europe, South America, and Middle East and Africa
  • Thorough market analysis and report of the market’s competitive landscape and detailed information about companies
  • Comprehensive analysis of factors that will challenge the growth of Industry companies

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1 Executive Summary

  • 1.1 Market overview
    • Exhibit 01: Executive Summary – Chart on Market Overview
    • Exhibit 02: Executive Summary – Data Table on Market Overview
    • Exhibit 03: Executive Summary – Chart on Global Market Characteristics
    • Exhibit 04: Executive Summary – Chart on Market by Geography
    • Exhibit 05: Executive Summary – Chart on Market Segmentation by Service
    • Exhibit 06: Executive Summary – Chart on Market Segmentation by End-user
    • Exhibit 07: Executive Summary – Chart on Incremental Growth
    • Exhibit 08: Executive Summary – Data Table on Incremental Growth
    • Exhibit 09: Executive Summary – Chart on Vendor Market Positioning

2 Market Landscape

  • 2.1 Market ecosystem
    • Exhibit 10: Parent market
    • Exhibit 11: Market Characteristics

3 Market Sizing

  • 3.1 Market definition
    • Exhibit 12: Offerings of vendors included in the market definition
  • 3.2 Market segment analysis
    • Exhibit 13: Market segments
  • 3.3 Market size 2023
    • 3.4 Market outlook: Forecast for 2023-2028
      • Exhibit 14: Chart on Global - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 15: Data Table on Global - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 16: Chart on Global Market: Year-over-year growth 2023-2028 (%)
      • Exhibit 17: Data Table on Global Market: Year-over-year growth 2023-2028 (%)

    4 Historic Market Size

    • 4.1 Global OSAT Market 2024-2028 2018 - 2022
      • Exhibit 18: Historic Market Size – Data Table on global osat market 2024-2028 2018 - 2022 ($ billion)
    • 4.2 Service Segment Analysis 2018 - 2022
      • Exhibit 19: Historic Market Size – Service Segment 2018 - 2022 ($ billion)
    • 4.3 End-user Segment Analysis 2018 - 2022
      • Exhibit 20: Historic Market Size – End-user Segment 2018 - 2022 ($ billion)
    • 4.4 Geography Segment Analysis 2018 - 2022
      • Exhibit 21: Historic Market Size – Geography Segment 2018 - 2022 ($ billion)
    • 4.5 Country Segment Analysis 2018 - 2022
      • Exhibit 22: Historic Market Size – Country Segment 2018 - 2022 ($ billion)

    5 Five Forces Analysis

    • 5.1 Five forces summary
      • Exhibit 23: Five forces analysis - Comparison between 2023 and 2028
    • 5.2 Bargaining power of buyers
      • Exhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2023 and 2028
    • 5.3 Bargaining power of suppliers
      • Exhibit 25: Bargaining power of suppliers – Impact of key factors in 2023 and 2028
    • 5.4 Threat of new entrants
      • Exhibit 26: Threat of new entrants – Impact of key factors in 2023 and 2028
    • 5.5 Threat of substitutes
      • Exhibit 27: Threat of substitutes – Impact of key factors in 2023 and 2028
    • 5.6 Threat of rivalry
      • Exhibit 28: Threat of rivalry – Impact of key factors in 2023 and 2028
    • 5.7 Market condition
      • Exhibit 29: Chart on Market condition - Five forces 2023 and 2028

    6 Market Segmentation by Service

    • 6.1 Market segments
      • Exhibit 30: Chart on Service - Market share 2023-2028 (%)
      • Exhibit 31: Data Table on Service - Market share 2023-2028 (%)
    • 6.2 Comparison by Service
      • Exhibit 32: Chart on Comparison by Service
      • Exhibit 33: Data Table on Comparison by Service
    • 6.3 Assembly and packaging - Market size and forecast 2023-2028
      • Exhibit 34: Chart on Assembly and packaging - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 35: Data Table on Assembly and packaging - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 36: Chart on Assembly and packaging - Year-over-year growth 2023-2028 (%)
      • Exhibit 37: Data Table on Assembly and packaging - Year-over-year growth 2023-2028 (%)
    • 6.4 Testing - Market size and forecast 2023-2028
      • Exhibit 38: Chart on Testing - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 39: Data Table on Testing - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 40: Chart on Testing - Year-over-year growth 2023-2028 (%)
      • Exhibit 41: Data Table on Testing - Year-over-year growth 2023-2028 (%)
    • 6.5 Market opportunity by Service
      • Exhibit 42: Market opportunity by Service ($ billion)
      • Exhibit 43: Data Table on Market opportunity by Service ($ billion)

    7 Market Segmentation by End-user

    • 7.1 Market segments
      • Exhibit 44: Chart on End-user - Market share 2023-2028 (%)
      • Exhibit 45: Data Table on End-user - Market share 2023-2028 (%)
    • 7.2 Comparison by End-user
      • Exhibit 46: Chart on Comparison by End-user
      • Exhibit 47: Data Table on Comparison by End-user
    • 7.3 Telecommunication - Market size and forecast 2023-2028
      • Exhibit 48: Chart on Telecommunication - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 49: Data Table on Telecommunication - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 50: Chart on Telecommunication - Year-over-year growth 2023-2028 (%)
      • Exhibit 51: Data Table on Telecommunication - Year-over-year growth 2023-2028 (%)
    • 7.4 Consumer electronics - Market size and forecast 2023-2028
      • Exhibit 52: Chart on Consumer electronics - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 53: Data Table on Consumer electronics - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 54: Chart on Consumer electronics - Year-over-year growth 2023-2028 (%)
      • Exhibit 55: Data Table on Consumer electronics - Year-over-year growth 2023-2028 (%)
    • 7.5 Industrial electronics - Market size and forecast 2023-2028
      • Exhibit 56: Chart on Industrial electronics - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 57: Data Table on Industrial electronics - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 58: Chart on Industrial electronics - Year-over-year growth 2023-2028 (%)
      • Exhibit 59: Data Table on Industrial electronics - Year-over-year growth 2023-2028 (%)
    • 7.6 Automotive - Market size and forecast 2023-2028
      • Exhibit 60: Chart on Automotive - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 61: Data Table on Automotive - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 62: Chart on Automotive - Year-over-year growth 2023-2028 (%)
      • Exhibit 63: Data Table on Automotive - Year-over-year growth 2023-2028 (%)
    • 7.7 Others - Market size and forecast 2023-2028
      • Exhibit 64: Chart on Others - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 65: Data Table on Others - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 66: Chart on Others - Year-over-year growth 2023-2028 (%)
      • Exhibit 67: Data Table on Others - Year-over-year growth 2023-2028 (%)
    • 7.8 Market opportunity by End-user
      • Exhibit 68: Market opportunity by End-user ($ billion)
      • Exhibit 69: Data Table on Market opportunity by End-user ($ billion)

    8 Customer Landscape

    • 8.1 Customer landscape overview
      • Exhibit 70: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

    9 Geographic Landscape

    • 9.1 Geographic segmentation
      • Exhibit 71: Chart on Market share by geography 2023-2028 (%)
      • Exhibit 72: Data Table on Market share by geography 2023-2028 (%)
    • 9.2 Geographic comparison
      • Exhibit 73: Chart on Geographic comparison
      • Exhibit 74: Data Table on Geographic comparison
    • 9.3 APAC - Market size and forecast 2023-2028
      • Exhibit 75: Chart on APAC - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 76: Data Table on APAC - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 77: Chart on APAC - Year-over-year growth 2023-2028 (%)
      • Exhibit 78: Data Table on APAC - Year-over-year growth 2023-2028 (%)
    • 9.4 North America - Market size and forecast 2023-2028
      • Exhibit 79: Chart on North America - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 80: Data Table on North America - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 81: Chart on North America - Year-over-year growth 2023-2028 (%)
      • Exhibit 82: Data Table on North America - Year-over-year growth 2023-2028 (%)
    • 9.5 Europe - Market size and forecast 2023-2028
      • Exhibit 83: Chart on Europe - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 84: Data Table on Europe - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 85: Chart on Europe - Year-over-year growth 2023-2028 (%)
      • Exhibit 86: Data Table on Europe - Year-over-year growth 2023-2028 (%)
    • 9.6 South America - Market size and forecast 2023-2028
      • Exhibit 87: Chart on South America - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 88: Data Table on South America - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 89: Chart on South America - Year-over-year growth 2023-2028 (%)
      • Exhibit 90: Data Table on South America - Year-over-year growth 2023-2028 (%)
    • 9.7 Middle East and Africa - Market size and forecast 2023-2028
      • Exhibit 91: Chart on Middle East and Africa - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 92: Data Table on Middle East and Africa - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 93: Chart on Middle East and Africa - Year-over-year growth 2023-2028 (%)
      • Exhibit 94: Data Table on Middle East and Africa - Year-over-year growth 2023-2028 (%)
    • 9.8 China - Market size and forecast 2023-2028
      • Exhibit 95: Chart on China - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 96: Data Table on China - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 97: Chart on China - Year-over-year growth 2023-2028 (%)
      • Exhibit 98: Data Table on China - Year-over-year growth 2023-2028 (%)
    • 9.9 Taiwan - Market size and forecast 2023-2028
      • Exhibit 99: Chart on Taiwan - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 100: Data Table on Taiwan - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 101: Chart on Taiwan - Year-over-year growth 2023-2028 (%)
      • Exhibit 102: Data Table on Taiwan - Year-over-year growth 2023-2028 (%)
    • 9.10 US - Market size and forecast 2023-2028
      • Exhibit 103: Chart on US - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 104: Data Table on US - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 105: Chart on US - Year-over-year growth 2023-2028 (%)
      • Exhibit 106: Data Table on US - Year-over-year growth 2023-2028 (%)
    • 9.11 South Korea - Market size and forecast 2023-2028
      • Exhibit 107: Chart on South Korea - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 108: Data Table on South Korea - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 109: Chart on South Korea - Year-over-year growth 2023-2028 (%)
      • Exhibit 110: Data Table on South Korea - Year-over-year growth 2023-2028 (%)
    • 9.12 Japan - Market size and forecast 2023-2028
      • Exhibit 111: Chart on Japan - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 112: Data Table on Japan - Market size and forecast 2023-2028 ($ billion)
      • Exhibit 113: Chart on Japan - Year-over-year growth 2023-2028 (%)
      • Exhibit 114: Data Table on Japan - Year-over-year growth 2023-2028 (%)
    • 9.13 Market opportunity by geography
      • Exhibit 115: Market opportunity by geography ($ billion)
      • Exhibit 116: Data Tables on Market opportunity by geography ($ billion)

    10 Drivers, Challenges, and Trends

    • 10.1 Market drivers
      • 10.2 Market challenges
        • 10.3 Impact of drivers and challenges
          • Exhibit 117: Impact of drivers and challenges in 2023 and 2028
        • 10.4 Market trends

          11 Vendor Landscape

          • 11.1 Overview
            • 11.2 Vendor landscape
              • Exhibit 118: Overview on Criticality of inputs and Factors of differentiation
            • 11.3 Landscape disruption
              • Exhibit 119: Overview on factors of disruption
            • 11.4 Industry risks
              • Exhibit 120: Impact of key risks on business

            12 Vendor Analysis

            • 12.1 Vendors covered
              • Exhibit 121: Vendors covered
            • 12.2 Market positioning of vendors
              • Exhibit 122: Matrix on vendor position and classification
            • 12.3 Amkor Technology Inc.
              • Exhibit 123: Amkor Technology Inc. - Overview
              • Exhibit 124: Amkor Technology Inc. - Business segments
              • Exhibit 125: Amkor Technology Inc. - Key offerings
              • Exhibit 126: Amkor Technology Inc. - Segment focus
            • 12.4 ASE Technology Holding Co. Ltd.
              • Exhibit 127: ASE Technology Holding Co. Ltd. - Overview
              • Exhibit 128: ASE Technology Holding Co. Ltd. - Business segments
              • Exhibit 129: ASE Technology Holding Co. Ltd. - Key offerings
              • Exhibit 130: ASE Technology Holding Co. Ltd. - Segment focus
            • 12.5 Chipbond Technology Corp.
              • Exhibit 131: Chipbond Technology Corp. - Overview
              • Exhibit 132: Chipbond Technology Corp. - Product / Service
              • Exhibit 133: Chipbond Technology Corp. - Key offerings
            • 12.6 ChipMOS TECHNOLOGIES INC.
              • Exhibit 134: ChipMOS TECHNOLOGIES INC. - Overview
              • Exhibit 135: ChipMOS TECHNOLOGIES INC. - Business segments
              • Exhibit 136: ChipMOS TECHNOLOGIES INC. - Key offerings
              • Exhibit 137: ChipMOS TECHNOLOGIES INC. - Segment focus
            • 12.7 Global Unichip Corp
              • Exhibit 138: Global Unichip Corp - Overview
              • Exhibit 139: Global Unichip Corp - Product / Service
              • Exhibit 140: Global Unichip Corp - Key offerings
            • 12.8 Great Wall Technologies Pvt Ltd.
              • Exhibit 141: Great Wall Technologies Pvt Ltd. - Overview
              • Exhibit 142: Great Wall Technologies Pvt Ltd. - Product / Service
              • Exhibit 143: Great Wall Technologies Pvt Ltd. - Key offerings
            • 12.9 Jiangsu Changdian Technology Co. Ltd.
              • Exhibit 144: Jiangsu Changdian Technology Co. Ltd. - Overview
              • Exhibit 145: Jiangsu Changdian Technology Co. Ltd. - Product / Service
              • Exhibit 146: Jiangsu Changdian Technology Co. Ltd. - Key offerings
            • 12.10 King Yuan Electronics Co. Ltd.
              • Exhibit 147: King Yuan Electronics Co. Ltd. - Overview
              • Exhibit 148: King Yuan Electronics Co. Ltd. - Business segments
              • Exhibit 149: King Yuan Electronics Co. Ltd. - Key offerings
              • Exhibit 150: King Yuan Electronics Co. Ltd. - Segment focus
            • 12.11 Lingsen Precision Industries Ltd.
              • Exhibit 151: Lingsen Precision Industries Ltd. - Overview
              • Exhibit 152: Lingsen Precision Industries Ltd. - Product / Service
              • Exhibit 153: Lingsen Precision Industries Ltd. - Key offerings
            • 12.12 Powertech Technology Inc.
              • Exhibit 154: Powertech Technology Inc. - Overview
              • Exhibit 155: Powertech Technology Inc. - Business segments
              • Exhibit 156: Powertech Technology Inc. - Key offerings
              • Exhibit 157: Powertech Technology Inc. - Segment focus
            • 12.13 SIGURD MICROELECTRONICS CORP.
              • Exhibit 158: SIGURD MICROELECTRONICS CORP. - Overview
              • Exhibit 159: SIGURD MICROELECTRONICS CORP. - Product / Service
              • Exhibit 160: SIGURD MICROELECTRONICS CORP. - Key offerings
            • 12.14 Taiwan Semiconductor Manufacturing Co. Ltd.
              • Exhibit 161: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
              • Exhibit 162: Taiwan Semiconductor Manufacturing Co. Ltd. - Product / Service
              • Exhibit 163: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
            • 12.15 Teradyne Inc.
              • Exhibit 164: Teradyne Inc. - Overview
              • Exhibit 165: Teradyne Inc. - Business segments
              • Exhibit 166: Teradyne Inc. - Key news
              • Exhibit 167: Teradyne Inc. - Key offerings
              • Exhibit 168: Teradyne Inc. - Segment focus
            • 12.16 Tongfu Microelectronics Co. Ltd.
              • Exhibit 169: Tongfu Microelectronics Co. Ltd. - Overview
              • Exhibit 170: Tongfu Microelectronics Co. Ltd. - Product / Service
              • Exhibit 171: Tongfu Microelectronics Co. Ltd. - Key offerings
            • 12.17 UTAC Holdings Ltd.
              • Exhibit 172: UTAC Holdings Ltd. - Overview
              • Exhibit 173: UTAC Holdings Ltd. - Product / Service
              • Exhibit 174: UTAC Holdings Ltd. - Key offerings

            13 Appendix

            • 13.1 Scope of the report
              • 13.2 Inclusions and exclusions checklist
                • Exhibit 175: Inclusions checklist
                • Exhibit 176: Exclusions checklist
              • 13.3 Currency conversion rates for US$
                • Exhibit 177: Currency conversion rates for US$
              • 13.4 Research methodology
                • Exhibit 178: Research methodology
                • Exhibit 179: Validation techniques employed for market sizing
                • Exhibit 180: Information sources
              • 13.5 List of abbreviations
                • Exhibit 181: List of abbreviations

              Research Framework

              Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

              INFORMATION SOURCES

              Primary sources

              • Manufacturers and suppliers
              • Channel partners
              • Industry experts
              • Strategic decision makers

              Secondary sources

              • Industry journals and periodicals
              • Government data
              • Financial reports of key industry players
              • Historical data
              • Press releases

              DATA ANALYSIS

              Data Synthesis

              • Collation of data
              • Estimation of key figures
              • Analysis of derived insights

              Data Validation

              • Triangulation with data models
              • Reference against proprietary databases
              • Corroboration with industry experts

              REPORT WRITING

              Qualitative

              • Market drivers
              • Market challenges
              • Market trends
              • Five forces analysis

              Quantitative

              • Market size and forecast
              • Market segmentation
              • Geographical insights
              • Competitive landscape

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              Key Questions Answered

              • What are the key global market and the regional market share?
              • What are the revenue-generating key market segments?
              • What are the key factors driving and challenging this market’s growth?
              • Who are the key market vendors and their growth strategies?
              • What are the latest trends influencing the growth of this market?
              • What are the variables influencing the market growth in the primary regions?
              • What are the factors influencing the growth of the parent market?

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              • Data on revenue-generating market segments
              • Details on the market shares of various regions
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