Semiconductor Assembly and Packaging Services Market Analysis APAC, North America, Europe, South America, Middle East and Africa - US, South Korea, Taiwan, China, Japan - Size and Forecast 2023-2027

Published: Oct 2023 Pages: 181 SKU: IRTNTR46417

Semiconductor Assembly and Packaging Services Market Forecast 2023-2027

The Semiconductor Assembly and Packaging Services Market is estimated to grow by USD 14.39 billion at a CAGR of 6.51% between 2022 and 2027. The market's growth hinges on several critical factors, including the escalating demand for semiconductor wafers, driven by advancements like 3D chip packaging, FIWLP, and FOWLP technology. Additionally, the rapid proliferation of wireless computing devices, fueled by the rise of the Internet of Things (IoT), plays a pivotal role. These trends collectively shape the landscape of the semiconductor industry, driving innovation and fostering market expansion.

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Innovations like through-silicon vias, interposers, and bridges are revolutionizing the way signals and energy are transmitted within electronic hardware. These advancements not only enhance computing power but also enable high-performance and high-speed operations at the system level. With a focus on advanced packaging techniques and high-performance computing, the industry caters to diverse sectors such as the automotive industry and the consumer electronics segment, providing chipsets and integrated circuits for devices like smartphones and tablets. As demand for high bandwidth and low latency increases, semiconductor companies continuously strive to reduce power consumption while enhancing the functionality of their products. Through innovations in conductors and insulators, the semiconductor industry remains at the forefront of technological advancement, shaping the future of electronics worldwide.

Technavio’s Exclusive Customer Landscape

This market growth analysis report covers the adoption life cycle of the market from the innovator’s stage and the laggard’s stage. It also focuses on the adoption rates of major countries. Technavio has included key purchase criteria, adoption rates, adoption lifecycles, and drivers of price sensitivity to help companies evaluate and develop growth strategies from 2022 to 2027.

Customer Landscape

Market Dynamics 

In semiconductor technology, wires serve as vital conduits for transmitting data within high-speed systems, particularly in data centers and PC/laptop infrastructure. As artificial intelligence continues to advance, the demand for high-performance semiconductor integrated circuits grows, driving innovation in production processes and designing techniques. Companies are challenged to meet the increasing demand for semiconductors and semiconductor sales, particularly in sectors like IT & telecommunication and autonomous driving. Furthermore, initiatives to improve semiconductor IC quality and enhance silicon package design efficiencies are crucial in addressing issues such as the ongoing chip shortage. With the rise of smart television sets, portable electronics, and smart homes, the semiconductor industry plays a pivotal role in shaping modern lifestyles. Our researchers analyzed the data, with 2022 as the base year. A holistic analysis of drivers, trends, and challenges will help companies refine marketing strategies to gain a competitive advantage.

Key Market Driver

The growing demand for semiconductor wafers is driving market growth. The rise in sales of mobile and consumer electronic devices is supporting the growth of the market. Emerging technologies such as IoT, machine-to-machine (M2M), ultra-high-definition (UHD) TVs, hybrid laptops, and vehicle automation are further propelling the demand for wafers. The increasing demand for semiconductor wafers will have an impact on device manufacturers, which will focus on increasing production capacity.

The need for multi-functional ICs is increasing owing to the increasing functionalities of consumer electronic devices. Semiconductor manufacturers are developing semiconductor ICs with new and complex architecture and design. However, such designs increase the possibility of defects and manufacturing errors, which has created a demand for advanced assembly and packaging services. Thus, the growing demand for semiconductor wafers will drive the growth of the market during the forecast period.

Significant Market Trends

The short product lifecycle of mobile devices is a key market trend. Technological advances and the rise in disposable income are driving the growth of the mobile devices market. Electronic devices such as mobile and consumer devices become obsolete within 1.5 years, as they are replaced by advanced versions frequently. 

The integration of AI chips in smartphones is driven by developments in advanced technologies. For instance, in January 2022, OnePlus launched OnePlus 10 Pro in India, powered by a 4-nm Kryo Octa-Core Qualcomm Snapdragon 8-Gen 1 chip with a 3.6 GHz CPU. Similarly, in September 2022, Apple launched the iPhone 14 series, powered by A16 bionic SoC. The demand for semiconductor ICs to manufacture these devices will increase during the forecast period. This, in turn, will increase production at foundries, which will fuel the need for WLP solutions.

Major Market Challenge

The need for high initial capital investments is challenging market growth. Establishing a manufacturing setup requires a significant amount of capital. Therefore, companies with comparatively low production scales outsource manufacturing to foundries and OSATs such as TSMC and ASE. Device manufacturers are investing in R&D to solve manufacturing and packaging challenges.

The growing demand for compact ICs and the emergence of new 3D packaging solutions such as TSV, stacked packaging, and MEMS packaging have transformed the manufacturing process of semiconductor ICs. Manufacturers should invest significantly in manufacturing equipment to produce compact ICs. The manufacturing process is complex, time-consuming, and expensive. Rapid technological changes increase the total cost of ownership of the equipment. Thus, the need for high initial capital investments will hinder the growth of the global market during the forecast period.

Who are the Major Semiconductor Assembly and Packaging Services Market Companies?

Companies are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.

ASE Technology Holding Co. Ltd. - The company offers semiconductor assembly and packaging services through Wafer technology or Wafer Level Chip Chip Scale Package for applications such as portable media players, memory cards, and controllers.

We also have detailed analyses of the market’s competitive landscape and offer information on 20 market Companies, including:

  • Amkor Technology Inc.
  • ChipMOS TECHNOLOGIES Inc.
  • Intel Corp.
  • Jiangsu Changdian Technology Co. Ltd.
  • King Yuan Electronics Co. Ltd.
  • KLA Corp.
  • Microchip Technology Inc.
  • Powertech Technology Inc.
  • Renesas Electronics Corp.
  • Samsung Electronics Co. Ltd.
  • Taiwan Semiconductor Manufacturing Co. Ltd.
  • Tokyo Electron Ltd.
  • Toshiba Corp.
  • ULVAC Inc.
  • ASMPT GmbH and Co. KG

Technavio's market forecasting report provides an in-depth analysis of the market and its players through combined qualitative and quantitative data. The analysis classifies Companies into categories based on their business approaches, including pure-play, category-focused, industry-focused, and diversified. Companies are specially categorized into dominant, leading, strong, tentative, and weak, based on their quantitative data analysis.

Market Segmentation

This industry caters to a wide array of sectors including automotive, consumer electronics, healthcare, aerospace, and defense. With advancements in technologies like ultra-high-density fan-out, semiconductor packaging vendors are meeting the diverse needs of IT firms and automakers. Additionally, the industry focuses on sustainability, particularly in the context of vehicle electrification and smart manufacturing practices. As demand for electronic hardware continues to surge, semiconductor assembly and packaging services remain pivotal in driving innovation and meeting market demands. The market is witnessing transformative changes driven by advancements in process nodes and the AP industry. As demand for high-speed electronic hardware escalates, innovations in advanced packaging techniques such as through-silicon vias, interposers, and bridges are becoming increasingly vital. These technologies enhance signals transmission efficiency while managing energy consumption. Moreover, the market is evolving to accommodate the growing need for semiconductors and electronic hardware, with a focus on minimizing Resistance and optimizing chips performance.

Type Analysis

The WLP segment will account for a significant share of market growth during the forecast period. WLP is considered ideal for analog, linear, and integrated passive components. It is less expensive than die-level packaging, as it can be done on a larger scale.

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The WLP segment was valued at USD 20.05 billion in 2017 and continued to grow until 2021. There are two types of WLP, namely fan-out wafer-level packaging (FOWLP) and FIWLP. FIWLP solutions are primarily used in manufacturing ICs. FOWLP solutions are mainly used for packaging. The growth of the WLP segment during the forecast period is attributed to factors such as the emergence of 3D architecture. The adoption of advanced packaging techniques such as 2.5D and 3D ICs and advances in complementary metal-oxide (CMOS) technology has further increased the use of WLP technology in most semiconductor devices.

Application Analysis

The communication sector segment will account for a significant share of market growth during the forecast period. Advances in smartphone technology have increased the demand for ICs with more power and smaller size. Hence, the adoption of smartphones is increasing rapidly. As a result, the demand for SoCs is also increasing. In addition, the demand for other communication devices is increasing. In the hospitality sector, tablets such as point of sale (POS) tablets are used for ticketing and advertising. The smartwatch market is also attracting Companies globally. The introduction of low-cost smartwatches will drive the unit shipment of smartwatches. The integration of advanced functionalities will increase the demand for devices. Therefore, the growing shipments of communication devices, such as smartphones, tablets, and smartwatches, will drive the growth of the global assembly and packaging services market during the forecast period.

Regional Analysis

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APAC is estimated to contribute 76% to the growth of the global market during the forecast period. Technavio’s analysts have elaborately explained the regional trends, drivers, and challenges that are expected to shape the market during the forecast period.

The growth of the market in APAC is attributed to factors such as the presence of prominent semiconductor foundries along with numerous OSATs. Manufacturers are investing significantly in building new fabrication units in the region. Advanced packages are more affordable in terms of manufacturing and testing. Advanced solutions such as WLPs have higher thermal performance, lower power consumption, and larger package density. They ensure better board-level reliability and electrical performance, shorter interconnections, and a higher degree of packaging design freedom than other technologies. Therefore, advanced packaging technologies are expected to be adopted extensively in chip packaging across end-user industries in APAC.

Market Analyst Overview

The innovations like through-silicon vias, interposers, and bridges play pivotal roles. These advancements facilitate the efficient routing of signals and energy within electronic hardware, enhancing computing power and enabling high-performance, high speed operations. The industry caters to diverse sectors such as automotive, consumer electronics, healthcare, aerospace, and defense, with a focus on sustainable transportation and smart manufacturing practices. The packaging vendors leverage ultra-high-density fan-out technologies and heterogeneous dies to meet the evolving demands of IT firms and automakers. With continual digital transformation and the Semiconductor Industry Association's agenda, the sector thrives on funding and collaboration to optimize chip production.

Segment Overview

The market research and growth report forecasts market growth by revenue at global, regional, & country levels and provides an analysis of the latest trends and growth opportunities from 2017 to 2027.

  • Type Outlook
    • WLP 
    • Die level packaging
  • Application Outlook
    • Communication sector
    • Industrial and automotive sector 
    • Computing and networking sector
    • Consumer electronics sector
  • Region Outlook
    • North America
      • The U.S.
      • Canada
    • Europe
      • U.K.
      • Germany
      • France
      • Rest of Europe
    • APAC
      • China
      • India
    • Middle East & Africa
      • Saudi Arabia
      • South Africa
      • Rest of the Middle East & Africa
    • South America
      • Argentina
      • Brazil
      • Chile

Industry  Scope

Report Coverage

Details

Page number

181

Base year

2022

Historic period

2017 - 2021

Forecast period

2023-2027

Growth momentum & CAGR

Accelerate at a CAGR of 6.51%

Market growth 2023-2027

USD 14.39 billion

Market structure

USD Fragmented

YoY growth 2022-2023(%)

5.48

Regional analysis

APAC, North America, Europe, South America, and Middle East and Africa

Performing market contribution

APAC at 76%

Key countries

US, South Korea, Taiwan, China, and Japan

Competitive landscape

 Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks

Key companies profiled

Amkor Technology Inc., ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES Inc., Intel Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., KLA Corp., Microchip Technology Inc., Powertech Technology Inc., Renesas Electronics Corp., Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Toshiba Corp., ULVAC Inc., ASMPT GmbH and Co. KG, HANA Micron Co. Ltd., Promex Industries Inc., SIGNETICS Corp., and Yole Developpement SA

Market dynamics

Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, Market growth and Forecasting, COVID 19 impact and recovery analysis and future consumer dynamics, Market condition analysis for forecast period

Customization purview

If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.

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What are the Key Data Covered in this Market Research Report?

  • CAGR of the market during the forecast period
  • Detailed information on factors that will drive the growth of the market between 2023 and 2027
  • Precise estimation of the size of the market and its contribution to the parent market
  • Accurate predictions about upcoming trends and changes in consumer behavior
  • Growth of the market across APAC, North America, Europe, South America, and Middle East and Africa
  • A thorough analysis of the market’s competitive landscape and detailed information about companies
  • Comprehensive analysis of factors that will challenge the growth of market companies

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1 Executive Summary

  • 1.1 Market overview
    • Exhibit 01: Executive Summary – Chart on Market Overview
    • Exhibit 02: Executive Summary – Data Table on Market Overview
    • Exhibit 03: Executive Summary – Chart on Global Market Characteristics
    • Exhibit 04: Executive Summary – Chart on Market by Geography
    • Exhibit 05: Executive Summary – Chart on Market Segmentation by Type
    • Exhibit 06: Executive Summary – Chart on Market Segmentation by Application
    • Exhibit 07: Executive Summary – Chart on Incremental Growth
    • Exhibit 08: Executive Summary – Data Table on Incremental Growth
    • Exhibit 09: Executive Summary – Chart on Vendor Market Positioning

2 Market Landscape

  • 2.1 Market ecosystem
    • Exhibit 10: Parent market
    • Exhibit 11: Market Characteristics

3 Market Sizing

  • 3.1 Market definition
    • Exhibit 12: Offerings of vendors included in the market definition
  • 3.2 Market segment analysis
    • Exhibit 13: Market segments
  • 3.3 Market size 2022
    • 3.4 Market outlook: Forecast for 2022-2027
      • Exhibit 14: Chart on Global - Market size and forecast 2022-2027 ($ million)
      • Exhibit 15: Data Table on Global - Market size and forecast 2022-2027 ($ million)
      • Exhibit 16: Chart on Global Market: Year-over-year growth 2022-2027 (%)
      • Exhibit 17: Data Table on Global Market: Year-over-year growth 2022-2027 (%)

    4 Historic Market Size

    • 4.1 Global semiconductor assembly and packaging services market 2017 - 2021
      • Exhibit 18: Historic Market Size – Data Table on global semiconductor assembly and packaging services market 2017 - 2021 ($ million)
    • 4.2 Type Segment Analysis 2017 - 2021
      • Exhibit 19: Historic Market Size – Type Segment 2017 - 2021 ($ million)
    • 4.3 Application Segment Analysis 2017 - 2021
      • Exhibit 20: Historic Market Size – Application Segment 2017 - 2021 ($ million)
    • 4.4 Geography Segment Analysis 2017 - 2021
      • Exhibit 21: Historic Market Size – Geography Segment 2017 - 2021 ($ million)
    • 4.5 Country Segment Analysis 2017 - 2021
      • Exhibit 22: Historic Market Size – Country Segment 2017 - 2021 ($ million)

    5 Five Forces Analysis

    • 5.1 Five forces summary
      • Exhibit 23: Five forces analysis - Comparison between 2022 and 2027
    • 5.2 Bargaining power of buyers
      • Exhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2022 and 2027
    • 5.3 Bargaining power of suppliers
      • Exhibit 25: Bargaining power of suppliers – Impact of key factors in 2022 and 2027
    • 5.4 Threat of new entrants
      • Exhibit 26: Threat of new entrants – Impact of key factors in 2022 and 2027
    • 5.5 Threat of substitutes
      • Exhibit 27: Threat of substitutes – Impact of key factors in 2022 and 2027
    • 5.6 Threat of rivalry
      • Exhibit 28: Threat of rivalry – Impact of key factors in 2022 and 2027
    • 5.7 Market condition
      • Exhibit 29: Chart on Market condition - Five forces 2022 and 2027

    6 Market Segmentation by Type

    • 6.1 Market segments
      • Exhibit 30: Chart on Type - Market share 2022-2027 (%)
      • Exhibit 31: Data Table on Type - Market share 2022-2027 (%)
    • 6.2 Comparison by Type
      • Exhibit 32: Chart on Comparison by Type
      • Exhibit 33: Data Table on Comparison by Type
    • 6.3 WLP - Market size and forecast 2022-2027
      • Exhibit 34: Chart on WLP - Market size and forecast 2022-2027 ($ million)
      • Exhibit 35: Data Table on WLP - Market size and forecast 2022-2027 ($ million)
      • Exhibit 36: Chart on WLP - Year-over-year growth 2022-2027 (%)
      • Exhibit 37: Data Table on WLP - Year-over-year growth 2022-2027 (%)
    • 6.4 Die level packaging - Market size and forecast 2022-2027
      • Exhibit 38: Chart on Die level packaging - Market size and forecast 2022-2027 ($ million)
      • Exhibit 39: Data Table on Die level packaging - Market size and forecast 2022-2027 ($ million)
      • Exhibit 40: Chart on Die level packaging - Year-over-year growth 2022-2027 (%)
      • Exhibit 41: Data Table on Die level packaging - Year-over-year growth 2022-2027 (%)
    • 6.5 Market opportunity by Type
      • Exhibit 42: Market opportunity by Type ($ million)
      • Exhibit 43: Data Table on Market opportunity by Type ($ million)

    7 Market Segmentation by Application

    • 7.1 Market segments
      • Exhibit 44: Chart on Application - Market share 2022-2027 (%)
      • Exhibit 45: Data Table on Application - Market share 2022-2027 (%)
    • 7.2 Comparison by Application
      • Exhibit 46: Chart on Comparison by Application
      • Exhibit 47: Data Table on Comparison by Application
    • 7.3 Communication sector - Market size and forecast 2022-2027
      • Exhibit 48: Chart on Communication sector - Market size and forecast 2022-2027 ($ million)
      • Exhibit 49: Data Table on Communication sector - Market size and forecast 2022-2027 ($ million)
      • Exhibit 50: Chart on Communication sector - Year-over-year growth 2022-2027 (%)
      • Exhibit 51: Data Table on Communication sector - Year-over-year growth 2022-2027 (%)
    • 7.4 Industrial and automotive sector - Market size and forecast 2022-2027
      • Exhibit 52: Chart on Industrial and automotive sector - Market size and forecast 2022-2027 ($ million)
      • Exhibit 53: Data Table on Industrial and automotive sector - Market size and forecast 2022-2027 ($ million)
      • Exhibit 54: Chart on Industrial and automotive sector - Year-over-year growth 2022-2027 (%)
      • Exhibit 55: Data Table on Industrial and automotive sector - Year-over-year growth 2022-2027 (%)
    • 7.5 Computing and networking sector - Market size and forecast 2022-2027
      • Exhibit 56: Chart on Computing and networking sector - Market size and forecast 2022-2027 ($ million)
      • Exhibit 57: Data Table on Computing and networking sector - Market size and forecast 2022-2027 ($ million)
      • Exhibit 58: Chart on Computing and networking sector - Year-over-year growth 2022-2027 (%)
      • Exhibit 59: Data Table on Computing and networking sector - Year-over-year growth 2022-2027 (%)
    • 7.6 Consumer electronics sector - Market size and forecast 2022-2027
      • Exhibit 60: Chart on Consumer electronics sector - Market size and forecast 2022-2027 ($ million)
      • Exhibit 61: Data Table on Consumer electronics sector - Market size and forecast 2022-2027 ($ million)
      • Exhibit 62: Chart on Consumer electronics sector - Year-over-year growth 2022-2027 (%)
      • Exhibit 63: Data Table on Consumer electronics sector - Year-over-year growth 2022-2027 (%)
    • 7.7 Market opportunity by Application
      • Exhibit 64: Market opportunity by Application ($ million)
      • Exhibit 65: Data Table on Market opportunity by Application ($ million)

    8 Customer Landscape

    • 8.1 Customer landscape overview
      • Exhibit 66: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

    9 Geographic Landscape

    • 9.1 Geographic segmentation
      • Exhibit 67: Chart on Market share by geography 2022-2027 (%)
      • Exhibit 68: Data Table on Market share by geography 2022-2027 (%)
    • 9.2 Geographic comparison
      • Exhibit 69: Chart on Geographic comparison
      • Exhibit 70: Data Table on Geographic comparison
    • 9.3 APAC - Market size and forecast 2022-2027
      • Exhibit 71: Chart on APAC - Market size and forecast 2022-2027 ($ million)
      • Exhibit 72: Data Table on APAC - Market size and forecast 2022-2027 ($ million)
      • Exhibit 73: Chart on APAC - Year-over-year growth 2022-2027 (%)
      • Exhibit 74: Data Table on APAC - Year-over-year growth 2022-2027 (%)
    • 9.4 North America - Market size and forecast 2022-2027
      • Exhibit 75: Chart on North America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 76: Data Table on North America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 77: Chart on North America - Year-over-year growth 2022-2027 (%)
      • Exhibit 78: Data Table on North America - Year-over-year growth 2022-2027 (%)
    • 9.5 Europe - Market size and forecast 2022-2027
      • Exhibit 79: Chart on Europe - Market size and forecast 2022-2027 ($ million)
      • Exhibit 80: Data Table on Europe - Market size and forecast 2022-2027 ($ million)
      • Exhibit 81: Chart on Europe - Year-over-year growth 2022-2027 (%)
      • Exhibit 82: Data Table on Europe - Year-over-year growth 2022-2027 (%)
    • 9.6 South America - Market size and forecast 2022-2027
      • Exhibit 83: Chart on South America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 84: Data Table on South America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 85: Chart on South America - Year-over-year growth 2022-2027 (%)
      • Exhibit 86: Data Table on South America - Year-over-year growth 2022-2027 (%)
    • 9.7 Middle East and Africa - Market size and forecast 2022-2027
      • Exhibit 87: Chart on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
      • Exhibit 88: Data Table on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
      • Exhibit 89: Chart on Middle East and Africa - Year-over-year growth 2022-2027 (%)
      • Exhibit 90: Data Table on Middle East and Africa - Year-over-year growth 2022-2027 (%)
    • 9.8 South Korea - Market size and forecast 2022-2027
      • Exhibit 91: Chart on South Korea - Market size and forecast 2022-2027 ($ million)
      • Exhibit 92: Data Table on South Korea - Market size and forecast 2022-2027 ($ million)
      • Exhibit 93: Chart on South Korea - Year-over-year growth 2022-2027 (%)
      • Exhibit 94: Data Table on South Korea - Year-over-year growth 2022-2027 (%)
    • 9.9 Taiwan - Market size and forecast 2022-2027
      • Exhibit 95: Chart on Taiwan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 96: Data Table on Taiwan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 97: Chart on Taiwan - Year-over-year growth 2022-2027 (%)
      • Exhibit 98: Data Table on Taiwan - Year-over-year growth 2022-2027 (%)
    • 9.10 China - Market size and forecast 2022-2027
      • Exhibit 99: Chart on China - Market size and forecast 2022-2027 ($ million)
      • Exhibit 100: Data Table on China - Market size and forecast 2022-2027 ($ million)
      • Exhibit 101: Chart on China - Year-over-year growth 2022-2027 (%)
      • Exhibit 102: Data Table on China - Year-over-year growth 2022-2027 (%)
    • 9.11 US - Market size and forecast 2022-2027
      • Exhibit 103: Chart on US - Market size and forecast 2022-2027 ($ million)
      • Exhibit 104: Data Table on US - Market size and forecast 2022-2027 ($ million)
      • Exhibit 105: Chart on US - Year-over-year growth 2022-2027 (%)
      • Exhibit 106: Data Table on US - Year-over-year growth 2022-2027 (%)
    • 9.12 Japan - Market size and forecast 2022-2027
      • Exhibit 107: Chart on Japan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 108: Data Table on Japan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 109: Chart on Japan - Year-over-year growth 2022-2027 (%)
      • Exhibit 110: Data Table on Japan - Year-over-year growth 2022-2027 (%)
    • 9.13 Market opportunity by geography
      • Exhibit 111: Market opportunity by geography ($ million)
      • Exhibit 112: Data Tables on Market opportunity by geography ($ million)

    10 Drivers, Challenges, and Trends

    • 10.1 Market drivers
      • 10.2 Market challenges
        • 10.3 Impact of drivers and challenges
          • Exhibit 113: Impact of drivers and challenges in 2022 and 2027
        • 10.4 Market trends

          11 Vendor Landscape

          • 11.1 Overview
            • 11.2 Vendor landscape
              • Exhibit 114: Overview on Criticality of inputs and Factors of differentiation
            • 11.3 Landscape disruption
              • Exhibit 115: Overview on factors of disruption
            • 11.4 Industry risks
              • Exhibit 116: Impact of key risks on business

            12 Vendor Analysis

            • 12.1 Vendors covered
              • Exhibit 117: Vendors covered
            • 12.2 Market positioning of vendors
              • Exhibit 118: Matrix on vendor position and classification
            • 12.3 Amkor Technology Inc.
              • Exhibit 119: Amkor Technology Inc. - Overview
              • Exhibit 120: Amkor Technology Inc. - Business segments
              • Exhibit 121: Amkor Technology Inc. - Key offerings
              • Exhibit 122: Amkor Technology Inc. - Segment focus
            • 12.4 ASE Technology Holding Co. Ltd.
              • Exhibit 123: ASE Technology Holding Co. Ltd. - Overview
              • Exhibit 124: ASE Technology Holding Co. Ltd. - Business segments
              • Exhibit 125: ASE Technology Holding Co. Ltd. - Key offerings
              • Exhibit 126: ASE Technology Holding Co. Ltd. - Segment focus
            • 12.5 ASMPT GmbH and Co. KG
              • Exhibit 127: ASMPT GmbH and Co. KG - Overview
              • Exhibit 128: ASMPT GmbH and Co. KG - Business segments
              • Exhibit 129: ASMPT GmbH and Co. KG - Key offerings
              • Exhibit 130: ASMPT GmbH and Co. KG - Segment focus
            • 12.6 ChipMOS TECHNOLOGIES Inc.
              • Exhibit 131: ChipMOS TECHNOLOGIES Inc. - Overview
              • Exhibit 132: ChipMOS TECHNOLOGIES Inc. - Business segments
              • Exhibit 133: ChipMOS TECHNOLOGIES Inc. - Key offerings
              • Exhibit 134: ChipMOS TECHNOLOGIES Inc. - Segment focus
            • 12.7 HANA Micron Co. Ltd.
              • Exhibit 135: HANA Micron Co. Ltd. - Overview
              • Exhibit 136: HANA Micron Co. Ltd. - Business segments
              • Exhibit 137: HANA Micron Co. Ltd. - Key offerings
              • Exhibit 138: HANA Micron Co. Ltd. - Segment focus
            • 12.8 Intel Corp.
              • Exhibit 139: Intel Corp. - Overview
              • Exhibit 140: Intel Corp. - Business segments
              • Exhibit 141: Intel Corp. - Key news
              • Exhibit 142: Intel Corp. - Key offerings
              • Exhibit 143: Intel Corp. - Segment focus
            • 12.9 King Yuan Electronics Co. Ltd.
              • Exhibit 144: King Yuan Electronics Co. Ltd. - Overview
              • Exhibit 145: King Yuan Electronics Co. Ltd. - Business segments
              • Exhibit 146: King Yuan Electronics Co. Ltd. - Key offerings
              • Exhibit 147: King Yuan Electronics Co. Ltd. - Segment focus
            • 12.10 KLA Corp.
              • Exhibit 148: KLA Corp. - Overview
              • Exhibit 149: KLA Corp. - Business segments
              • Exhibit 150: KLA Corp. - Key news
              • Exhibit 151: KLA Corp. - Key offerings
              • Exhibit 152: KLA Corp. - Segment focus
            • 12.11 Microchip Technology Inc.
              • Exhibit 153: Microchip Technology Inc. - Overview
              • Exhibit 154: Microchip Technology Inc. - Business segments
              • Exhibit 155: Microchip Technology Inc. - Key offerings
              • Exhibit 156: Microchip Technology Inc. - Segment focus
            • 12.12 Powertech Technology Inc.
              • Exhibit 157: Powertech Technology Inc. - Overview
              • Exhibit 158: Powertech Technology Inc. - Business segments
              • Exhibit 159: Powertech Technology Inc. - Key offerings
              • Exhibit 160: Powertech Technology Inc. - Segment focus
            • 12.13 Renesas Electronics Corp.
              • Exhibit 161: Renesas Electronics Corp. - Overview
              • Exhibit 162: Renesas Electronics Corp. - Business segments
              • Exhibit 163: Renesas Electronics Corp. - Key offerings
              • Exhibit 164: Renesas Electronics Corp. - Segment focus
            • 12.14 Samsung Electronics Co. Ltd.
              • Exhibit 165: Samsung Electronics Co. Ltd. - Overview
              • Exhibit 166: Samsung Electronics Co. Ltd. - Business segments
              • Exhibit 167: Samsung Electronics Co. Ltd. - Key news
              • Exhibit 168: Samsung Electronics Co. Ltd. - Key offerings
              • Exhibit 169: Samsung Electronics Co. Ltd. - Segment focus
            • 12.15 Taiwan Semiconductor Manufacturing Co. Ltd.
              • Exhibit 170: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
              • Exhibit 171: Taiwan Semiconductor Manufacturing Co. Ltd. - Product / Service
              • Exhibit 172: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
            • 12.16 ULVAC Inc.
              • Exhibit 173: ULVAC Inc. - Overview
              • Exhibit 174: ULVAC Inc. - Business segments
              • Exhibit 175: ULVAC Inc. - Key news
              • Exhibit 176: ULVAC Inc. - Key offerings
              • Exhibit 177: ULVAC Inc. - Segment focus
            • 12.17 Yole Developpement SA
              • Exhibit 178: Yole Developpement SA - Overview
              • Exhibit 179: Yole Developpement SA - Product / Service
              • Exhibit 180: Yole Developpement SA - Key offerings

            13 Appendix

            • 13.1 Scope of the report
              • 13.2 Inclusions and exclusions checklist
                • Exhibit 181: Inclusions checklist
                • Exhibit 182: Exclusions checklist
              • 13.3 Currency conversion rates for US$
                • Exhibit 183: Currency conversion rates for US$
              • 13.4 Research methodology
                • Exhibit 184: Research methodology
                • Exhibit 185: Validation techniques employed for market sizing
                • Exhibit 186: Information sources
              • 13.5 List of abbreviations
                • Exhibit 187: List of abbreviations

              Research Framework

              Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

              INFORMATION SOURCES

              Primary sources

              • Manufacturers and suppliers
              • Channel partners
              • Industry experts
              • Strategic decision makers

              Secondary sources

              • Industry journals and periodicals
              • Government data
              • Financial reports of key industry players
              • Historical data
              • Press releases

              DATA ANALYSIS

              Data Synthesis

              • Collation of data
              • Estimation of key figures
              • Analysis of derived insights

              Data Validation

              • Triangulation with data models
              • Reference against proprietary databases
              • Corroboration with industry experts

              REPORT WRITING

              Qualitative

              • Market drivers
              • Market challenges
              • Market trends
              • Five forces analysis

              Quantitative

              • Market size and forecast
              • Market segmentation
              • Geographical insights
              • Competitive landscape

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              semiconductor assembly and packaging services market market

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              Key Questions Answered

              • What are the key global market and the regional market share?
              • What are the revenue-generating key market segments?
              • What are the key factors driving and challenging this market’s growth?
              • Who are the key market vendors and their growth strategies?
              • What are the latest trends influencing the growth of this market?
              • What are the variables influencing the market growth in the primary regions?
              • What are the factors influencing the growth of the parent market?

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              • Information about the market's key drivers, trends, and challenges
              • Parent market analysis
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              • Detailed vendors report with competitive landscape
              • Covid-19 impact and recovery analysis
              • Data on revenue-generating market segments
              • Details on the market shares of various regions
              • Five-force market analysis