Global Semiconductor Packaging Materials Market by Material, End-user and Geography - Forecast and Analysis 2023-2027

Published: Oct 2023 Pages: 206 SKU: IRTNTR43283

Semiconductor Packaging Materials Market Forecast 2023-2027

The semiconductor packaging materials market size is estimated to grow by USD 10.15 billion at a CAGR of 6.06% between 2022 and 2027.

The market's expansion hinges on several factors, notably the rising trend of miniaturizing electronic devices and the burgeoning use of semiconductor integrated circuits (ICs) in IoT applications. Advanced semiconductor material packaging technologies further drive growth alongside the increasing global demand for consumer electronics and smart devices. This surge reflects a growing appetite for innovative electronic solutions across various industries. The convergence of these factors underscores a promising trajectory for semiconductor ICs, positioning them as pivotal components in powering the next generation of interconnected and intelligent electronic devices.

What will be the Size of the Market During the Forecast Period?

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The market continues to thrive with the growing demand for electronic equipment and the advancement of semiconductor integration technologies. Innovations like 3D semiconductor packaging technology and fan-out wafer-level packaging are reshaping the landscape, supported by a robust ecosystem of semiconductor packaging suppliers. Interposers and bridges play a vital role in enhancing energy efficiency and optimizing process nodes in semiconductor manufacturing. The AP (advanced packaging) industry is witnessing significant growth, driven by increasing computing power and the proliferation of artificial intelligence applications. This growth extends to various sectors, including IoT devices, automotive electronics, data center equipment, and the rapid deployment of 5G technology. Consumer electronics, smartphones, and IoT devices rely on efficient semiconductor packaging solutions to deliver high-speed connectivity, with chips, wires, and signals powering the backbone of 5G infrastructure, transitioning from 4G to the next generation of connectivity.

Market Dynamics

These packaging solutions are crucial for various applications, from PC/laptops to vehicle electrification, aiming to reduce emissions and enhance efficiency. In smart corporate settings, wireless broadband (WiBro) technology is revolutionizing connectivity, while semiconductor packaging companies are leveraging ultra-high-density fan-out (UHD FO) techniques to optimize inputs and outputs (I/O). With a focus on miniaturization and performance, square millimeter and line and spacing (L/S) measurements are key considerations, along with features like redistribution layers (RDL) in the upgraded versions of semiconductor packaging units. These innovations underscore the Semiconductor Industry Association's efforts to drive advancements in the industry. Our researchers analyzed the data with 2022 as the base year, along with the key drivers, trends, and challenges. A holistic analysis of drivers will help companies refine their marketing strategies to gain a competitive advantage.

Key Market Driver

One of the key factors driving the market growth is the rise in global demand for smart electronic devices. Due to the rise in the demand for semiconductor equipment electronics and smart electronic devices, the global consumer electronics market is expected to grow at a CAGR of more than 12% during the forecast period. Factors such as the rise in the sales of smart devices such as smartwatches, smartphones, and smart bands globally are fuelling the demand for ICs integrated together for manufacturing these devices.

As a result, it has fuelled the growth of semiconductor materials. Some of the key applications of IC and semiconductors include Tablets and smartphones. Other applications of semiconductors include Wi-Fi connectivity, multimedia streaming, touchscreens, and access to the Internet are based on the signals that are generated within high-tech circuits within the device which are embedded with semiconductor chips. Hence, such applications are expected to drive the market growth during the forecast period.

Significant Market Trends

A key factor shaping the market growth is the increase in the adoption of semiconductor ICs for automobiles and the shift toward copper as bonding wire material. There is a rising need for semiconductor wafers due to the automation and electrification of automobiles. Some of the key applications of semiconductor ICs that are used in automotive products are anti-lock braking systems, car navigation, airbag control, GPS, and display, power doors and windows, collision detection technology, infotainment, and automated driving. 

As a result, the rise in car production will drive the demand for semiconductor chips which in turn will fuel the demand devices, associated packaging materials, and assembly equipment market. Factors such as the rise in the adoption of semiconductor ICs for automobiles and the transition toward copper as bonding wire material are some of the trends, which is expected to fuel the growth of the global market trends during the forecast period.

Major Market Challenge

Regulations associated with semiconductor packaging materials are one of the key challenges hindering market growth. One of the key challenges for semiconductor Companies is complying with strict material specifications set down by packaging assemblers and testers. As there is a growing concern for environmental hazards related to packaging, semiconductor chemical and materials suppliers are facing increased environmental regulations, especially in developing countries.

For instance, the restriction of hazardous substances (RoHS) directive calls for the removal of metals such as polybrominated biphenyls (PBB), mercury, bismuth, chromium VI, lead, and cadmium, as well as ozone-depleting substances from all PCB and semiconductor packaging materials. With the exception of exempt applications, the implementation of RoHS is well underway, and most global suppliers have already developed 'green' alternatives. Hence, such factors are expected to significantly hinder the market during the forecast period.

Customer Landscape

The market research and growth report includes the adoption lifecycle of the market, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. Furthermore, the market growth and forecasting report also includes key purchase criteria and drivers of price sensitivity to help companies evaluate and develop their growth strategies.

Customer Landscape

Who are the Major Semiconductor Packaging Materials Market Companies?

Companies are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.

Amkor Technology Inc: The company offers semiconductor packaging materials such as copper leadframe substrates.

The market growth analysis report also includes detailed analyses of the competitive landscape of the market and information about 15 market Companies, including:

  • ASE Technology Holding Co. Ltd.
  • BASF SE
  • ChipMOS TECHNOLOGIES INC.
  • DuPont de Nemours Inc.
  • Henkel AG and Co. KGaA
  • Heraeus Holding GmbH
  • Hitachi Ltd.
  • Honeywell International Inc.
  • Indium Corp.
  • Intel Corp.
  • KYOCERA Corp.
  • LG Innotek Co. Ltd.
  • MITSUI and CO. LTD.
  • Nan Ya Printed Circuit Board Corp.
  • Nippon Steel Corp.
  • Powertech Technology Inc.
  • Samsung Electronics Co. Ltd.
  • Taiwan SEMICONDUCTOR CO. LTD
  • Texas Instruments Inc.

Qualitative and quantitative analysis of Companies has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize Companies as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize Companies as dominant, leading, strong, tentative, and weak.

Market Segmentation

The market share growth by the organic substrates segment will be significant during the forecast period. There is a rising demand for organic substrates in semiconductor packaging as these materials are used these materials are base layers of individual semiconductor devices and ICs on which other layers are deposited to complete the circuit. These materials are a part of the circuit, and it is important that these are efficient conductors of electricity and thinner core materials which are preferably used to surround these in demanding system applications. 

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The organic substrates segment was valued at USD 10.76 billion in 2017. One of the key reasons for the increasing adoption of organic substrates when compared to lead frames and bonding wires is that the industry advances more toward leadless and cable-less packages. The main advantage of these segments is their flexibility which allows them to be used as interconnects. One of the main Companies which offer organic substrates includes Samsung Electro-Mechanics which offers organic substrates for semiconductor packaging, catering to various industries, such as mobile devices, automotive, and Internet of Things (IoT) applications. Hence, such applications are expected to drive the growth of this segment which, in turn, will drive the market during the forecast period.

Regional Analysis

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APAC is estimated to contribute 70% to the growth of the global market during the forecast period. Technavio’s analysts have elaborately explained the regional trends and drivers that shape the market during the forecast period. Some of the key regions in APAC that drive the global market growth include countries like Taiwan, China, Japan, and South Korea. These countries house home-bred companies as well as international corporations introducing innovative offerings. The growing adoption of smart mobile devices and consumer electronic goods is driving the growth in the adoption of semiconductor packaging in these countries. Factors such as the availability of cheap labor, raw materials, and favorable factors of production have led to international corporations having scaled up their manufacturing operations in China making it a prominent player in the growth of the market. Hence, such factors are expected to drive the market growth in the region during the forecast period.

Market Analyst Overview

The market is propelled by the increasing demand for electronic equipment and the adoption of advanced semiconductor integration techniques. Key trends include the emergence of 3D semiconductor packaging technology and fan-out wafer-level packaging, driven by semiconductor packaging suppliers and die manufacturers. This growth is supported by the semiconductor design sector, which relies on encapsulants, underfill materials, die-attach techniques, and solder balls. Smart homes and corporate settings, along with high-speed internet and wireless broadband, fuel demand, particularly for memory chipmakers and interposers. Innovations in energy-efficient processes and AP (advanced packaging) techniques are reshaping computing power, artificial intelligence, and storage solutions.

The industry is undergoing digital transformation, embracing smart manufacturing practices to enhance semiconductor sales and meet the demand for ultra-high-density packaging solutions. Emerging technologies like Si Interposers and ultra-high-density I/O are driving advancements in heterogeneous dies and low-profile semiconductor packages. As the demand for mission-critical applications and low-latency 5G services grows, the semiconductor sector, including integrated circuits chipset manufacturers, is poised to capitalize on innovations in chip production and semiconductor manufacturing. The ecosystem, spanning the semiconductor value chain from foundry services to flip chip segments, continues to evolve to meet the needs of diverse industries such as IoT devices, automotive electronics, and data center equipment. Key packaging technologies like System-in-Package (SiP), Fan-Out Wafer-Level Packaging (FOWLP), and 3D Integrated Circuits (ICs) are pivotal in enabling advancements in 5G technology and supporting initiatives such as the United States government's CHIPS Act 2022. Materials like ceramics, polymers, solder, conductive adhesives, and wire bonds play a crucial role in ensuring the reliability and performance of semiconductor packages across various applications and industries.

Segment Overview

The market forecasting report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2017 to 2027. 

  • Material Outlook
    • Organic substrates
    • Lead frames
    • Bonding wires
    • Ceramic packages
    • Others
  • End-user Outlook
    • Consumer electronics
    • Automotive
    • Medical devices
    • Communication and telecom
    • Others
  • Geography Outlook
    • North America
      • The U.S.
      • Canada
    • Europe
      • U.K.
      • Germany
      • France
      • Rest of Europe
    • APAC
      • China
      • India
    • South America
      • Chile
      • Argentina
      • Brazil
    • Middle East & Africa
      • Saudi Arabia
      • South Africa
      • Rest of the Middle East & Africa

Market Scope

Market Report Coverage

Details

Page number

206

Base year

2022

Historic period

2017-2021

Forecast period

2023-2027

Growth momentum & CAGR

Accelerate at a CAGR of 6.06%

Market growth 2023-2027

USD 10.15 billion

Market structure

Fragmented

YoY growth 2022-2023(%)

4.52

Regional analysis

APAC, North America, Europe, South America, and Middle East and Africa

Performing market contribution

APAC at 70%

Key countries

US, China, Taiwan, Japan, and South Korea

Competitive landscape

 Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks

Key companies profiled

Amkor Technology Inc., ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp., Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan SEMICONDUCTOR CO. LTD, and Texas Instruments Inc.

Market dynamics

Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, and Market condition analysis for the forecast period.

Customization purview

If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.

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What are the Key Data Covered in this Market Research Report?

  • CAGR of the market during the forecast period
  • Detailed information on factors that will drive the growth of the market between 2023 and 2027
  • Precise estimation of the market size and its contribution to the market in focus on the parent market
  • Accurate predictions about upcoming trends and changes in consumer behavior
  • Growth of the market across APAC, North America, Europe, South America, and the Middle East and Africa
  • A thorough analysis of the market’s competitive landscape and detailed information about Companies
  • Comprehensive analysis of factors that will challenge the growth of market Companies

We can help! Our analysts can customize this market research report to meet your requirements. 

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1 Executive Summary

  • 1.1 Market overview
    • Exhibit 01: Executive Summary – Chart on Market Overview
    • Exhibit 02: Executive Summary – Data Table on Market Overview
    • Exhibit 03: Executive Summary – Chart on Global Market Characteristics
    • Exhibit 04: Executive Summary – Chart on Market by Geography
    • Exhibit 05: Executive Summary – Chart on Market Segmentation by Material
    • Exhibit 06: Executive Summary – Chart on Market Segmentation by End-user
    • Exhibit 07: Executive Summary – Chart on Incremental Growth
    • Exhibit 08: Executive Summary – Data Table on Incremental Growth
    • Exhibit 09: Executive Summary – Chart on Vendor Market Positioning

2 Market Landscape

  • 2.1 Market ecosystem
    • Exhibit 10: Parent market
    • Exhibit 11: Market Characteristics

3 Market Sizing

  • 3.1 Market definition
    • Exhibit 12: Offerings of vendors included in the market definition
  • 3.2 Market segment analysis
    • Exhibit 13: Market segments
  • 3.3 Market size 2022
    • 3.4 Market outlook: Forecast for 2022-2027
      • Exhibit 14: Chart on Global - Market size and forecast 2022-2027 ($ million)
      • Exhibit 15: Data Table on Global - Market size and forecast 2022-2027 ($ million)
      • Exhibit 16: Chart on Global Market: Year-over-year growth 2022-2027 (%)
      • Exhibit 17: Data Table on Global Market: Year-over-year growth 2022-2027 (%)

    4 Historic Market Size

    • 4.1 Global semiconductor packaging materials market 2017 - 2021
      • Exhibit 18: Historic Market Size – Data Table on global semiconductor packaging materials market 2017 - 2021 ($ million)
    • 4.2 Material Segment Analysis 2017 - 2021
      • Exhibit 19: Historic Market Size – Material Segment 2017 - 2021 ($ million)
    • 4.3 End-user Segment Analysis 2017 - 2021
      • Exhibit 20: Historic Market Size – End-user Segment 2017 - 2021 ($ million)
    • 4.4 Geography Segment Analysis 2017 - 2021
      • Exhibit 21: Historic Market Size – Geography Segment 2017 - 2021 ($ million)
    • 4.5 Country Segment Analysis 2017 - 2021
      • Exhibit 22: Historic Market Size – Country Segment 2017 - 2021 ($ million)

    5 Five Forces Analysis

    • 5.1 Five forces summary
      • Exhibit 23: Five forces analysis - Comparison between 2022 and 2027
    • 5.2 Bargaining power of buyers
      • Exhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2022 and 2027
    • 5.3 Bargaining power of suppliers
      • Exhibit 25: Bargaining power of suppliers – Impact of key factors in 2022 and 2027
    • 5.4 Threat of new entrants
      • Exhibit 26: Threat of new entrants – Impact of key factors in 2022 and 2027
    • 5.5 Threat of substitutes
      • Exhibit 27: Threat of substitutes – Impact of key factors in 2022 and 2027
    • 5.6 Threat of rivalry
      • Exhibit 28: Threat of rivalry – Impact of key factors in 2022 and 2027
    • 5.7 Market condition
      • Exhibit 29: Chart on Market condition - Five forces 2022 and 2027

    6 Market Segmentation by Material

    • 6.1 Market segments
      • Exhibit 30: Chart on Material - Market share 2022-2027 (%)
      • Exhibit 31: Data Table on Material - Market share 2022-2027 (%)
    • 6.2 Comparison by Material
      • Exhibit 32: Chart on Comparison by Material
      • Exhibit 33: Data Table on Comparison by Material
    • 6.3 Organic substrates - Market size and forecast 2022-2027
      • Exhibit 34: Chart on Organic substrates - Market size and forecast 2022-2027 ($ million)
      • Exhibit 35: Data Table on Organic substrates - Market size and forecast 2022-2027 ($ million)
      • Exhibit 36: Chart on Organic substrates - Year-over-year growth 2022-2027 (%)
      • Exhibit 37: Data Table on Organic substrates - Year-over-year growth 2022-2027 (%)
    • 6.4 Lead frames - Market size and forecast 2022-2027
      • Exhibit 38: Chart on Lead frames - Market size and forecast 2022-2027 ($ million)
      • Exhibit 39: Data Table on Lead frames - Market size and forecast 2022-2027 ($ million)
      • Exhibit 40: Chart on Lead frames - Year-over-year growth 2022-2027 (%)
      • Exhibit 41: Data Table on Lead frames - Year-over-year growth 2022-2027 (%)
    • 6.5 Bonding wires - Market size and forecast 2022-2027
      • Exhibit 42: Chart on Bonding wires - Market size and forecast 2022-2027 ($ million)
      • Exhibit 43: Data Table on Bonding wires - Market size and forecast 2022-2027 ($ million)
      • Exhibit 44: Chart on Bonding wires - Year-over-year growth 2022-2027 (%)
      • Exhibit 45: Data Table on Bonding wires - Year-over-year growth 2022-2027 (%)
    • 6.6 Ceramic packages - Market size and forecast 2022-2027
      • Exhibit 46: Chart on Ceramic packages - Market size and forecast 2022-2027 ($ million)
      • Exhibit 47: Data Table on Ceramic packages - Market size and forecast 2022-2027 ($ million)
      • Exhibit 48: Chart on Ceramic packages - Year-over-year growth 2022-2027 (%)
      • Exhibit 49: Data Table on Ceramic packages - Year-over-year growth 2022-2027 (%)
    • 6.7 Others - Market size and forecast 2022-2027
      • Exhibit 50: Chart on Others - Market size and forecast 2022-2027 ($ million)
      • Exhibit 51: Data Table on Others - Market size and forecast 2022-2027 ($ million)
      • Exhibit 52: Chart on Others - Year-over-year growth 2022-2027 (%)
      • Exhibit 53: Data Table on Others - Year-over-year growth 2022-2027 (%)
    • 6.8 Market opportunity by Material
      • Exhibit 54: Market opportunity by Material ($ million)
      • Exhibit 55: Data Table on Market opportunity by Material ($ million)

    7 Market Segmentation by End-user

    • 7.1 Market segments
      • Exhibit 56: Chart on End-user - Market share 2022-2027 (%)
      • Exhibit 57: Data Table on End-user - Market share 2022-2027 (%)
    • 7.2 Comparison by End-user
      • Exhibit 58: Chart on Comparison by End-user
      • Exhibit 59: Data Table on Comparison by End-user
    • 7.3 Consumer electronics - Market size and forecast 2022-2027
      • Exhibit 60: Chart on Consumer electronics - Market size and forecast 2022-2027 ($ million)
      • Exhibit 61: Data Table on Consumer electronics - Market size and forecast 2022-2027 ($ million)
      • Exhibit 62: Chart on Consumer electronics - Year-over-year growth 2022-2027 (%)
      • Exhibit 63: Data Table on Consumer electronics - Year-over-year growth 2022-2027 (%)
    • 7.4 Automotive - Market size and forecast 2022-2027
      • Exhibit 64: Chart on Automotive - Market size and forecast 2022-2027 ($ million)
      • Exhibit 65: Data Table on Automotive - Market size and forecast 2022-2027 ($ million)
      • Exhibit 66: Chart on Automotive - Year-over-year growth 2022-2027 (%)
      • Exhibit 67: Data Table on Automotive - Year-over-year growth 2022-2027 (%)
    • 7.5 Medical devices - Market size and forecast 2022-2027
      • Exhibit 68: Chart on Medical devices - Market size and forecast 2022-2027 ($ million)
      • Exhibit 69: Data Table on Medical devices - Market size and forecast 2022-2027 ($ million)
      • Exhibit 70: Chart on Medical devices - Year-over-year growth 2022-2027 (%)
      • Exhibit 71: Data Table on Medical devices - Year-over-year growth 2022-2027 (%)
    • 7.6 Communication and telecom - Market size and forecast 2022-2027
      • Exhibit 72: Chart on Communication and telecom - Market size and forecast 2022-2027 ($ million)
      • Exhibit 73: Data Table on Communication and telecom - Market size and forecast 2022-2027 ($ million)
      • Exhibit 74: Chart on Communication and telecom - Year-over-year growth 2022-2027 (%)
      • Exhibit 75: Data Table on Communication and telecom - Year-over-year growth 2022-2027 (%)
    • 7.7 Others - Market size and forecast 2022-2027
      • Exhibit 76: Chart on Others - Market size and forecast 2022-2027 ($ million)
      • Exhibit 77: Data Table on Others - Market size and forecast 2022-2027 ($ million)
      • Exhibit 78: Chart on Others - Year-over-year growth 2022-2027 (%)
      • Exhibit 79: Data Table on Others - Year-over-year growth 2022-2027 (%)
    • 7.8 Market opportunity by End-user
      • Exhibit 80: Market opportunity by End-user ($ million)
      • Exhibit 81: Data Table on Market opportunity by End-user ($ million)

    8 Customer Landscape

    • 8.1 Customer landscape overview
      • Exhibit 82: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

    9 Geographic Landscape

    • 9.1 Geographic segmentation
      • Exhibit 83: Chart on Market share by geography 2022-2027 (%)
      • Exhibit 84: Data Table on Market share by geography 2022-2027 (%)
    • 9.2 Geographic comparison
      • Exhibit 85: Chart on Geographic comparison
      • Exhibit 86: Data Table on Geographic comparison
    • 9.3 APAC - Market size and forecast 2022-2027
      • Exhibit 87: Chart on APAC - Market size and forecast 2022-2027 ($ million)
      • Exhibit 88: Data Table on APAC - Market size and forecast 2022-2027 ($ million)
      • Exhibit 89: Chart on APAC - Year-over-year growth 2022-2027 (%)
      • Exhibit 90: Data Table on APAC - Year-over-year growth 2022-2027 (%)
    • 9.4 North America - Market size and forecast 2022-2027
      • Exhibit 91: Chart on North America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 92: Data Table on North America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 93: Chart on North America - Year-over-year growth 2022-2027 (%)
      • Exhibit 94: Data Table on North America - Year-over-year growth 2022-2027 (%)
    • 9.5 Europe - Market size and forecast 2022-2027
      • Exhibit 95: Chart on Europe - Market size and forecast 2022-2027 ($ million)
      • Exhibit 96: Data Table on Europe - Market size and forecast 2022-2027 ($ million)
      • Exhibit 97: Chart on Europe - Year-over-year growth 2022-2027 (%)
      • Exhibit 98: Data Table on Europe - Year-over-year growth 2022-2027 (%)
    • 9.6 South America - Market size and forecast 2022-2027
      • Exhibit 99: Chart on South America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 100: Data Table on South America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 101: Chart on South America - Year-over-year growth 2022-2027 (%)
      • Exhibit 102: Data Table on South America - Year-over-year growth 2022-2027 (%)
    • 9.7 Middle East and Africa - Market size and forecast 2022-2027
      • Exhibit 103: Chart on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
      • Exhibit 104: Data Table on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
      • Exhibit 105: Chart on Middle East and Africa - Year-over-year growth 2022-2027 (%)
      • Exhibit 106: Data Table on Middle East and Africa - Year-over-year growth 2022-2027 (%)
    • 9.8 China - Market size and forecast 2022-2027
      • Exhibit 107: Chart on China - Market size and forecast 2022-2027 ($ million)
      • Exhibit 108: Data Table on China - Market size and forecast 2022-2027 ($ million)
      • Exhibit 109: Chart on China - Year-over-year growth 2022-2027 (%)
      • Exhibit 110: Data Table on China - Year-over-year growth 2022-2027 (%)
    • 9.9 Taiwan - Market size and forecast 2022-2027
      • Exhibit 111: Chart on Taiwan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 112: Data Table on Taiwan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 113: Chart on Taiwan - Year-over-year growth 2022-2027 (%)
      • Exhibit 114: Data Table on Taiwan - Year-over-year growth 2022-2027 (%)
    • 9.10 US - Market size and forecast 2022-2027
      • Exhibit 115: Chart on US - Market size and forecast 2022-2027 ($ million)
      • Exhibit 116: Data Table on US - Market size and forecast 2022-2027 ($ million)
      • Exhibit 117: Chart on US - Year-over-year growth 2022-2027 (%)
      • Exhibit 118: Data Table on US - Year-over-year growth 2022-2027 (%)
    • 9.11 Japan - Market size and forecast 2022-2027
      • Exhibit 119: Chart on Japan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 120: Data Table on Japan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 121: Chart on Japan - Year-over-year growth 2022-2027 (%)
      • Exhibit 122: Data Table on Japan - Year-over-year growth 2022-2027 (%)
    • 9.12 South Korea - Market size and forecast 2022-2027
      • Exhibit 123: Chart on South Korea - Market size and forecast 2022-2027 ($ million)
      • Exhibit 124: Data Table on South Korea - Market size and forecast 2022-2027 ($ million)
      • Exhibit 125: Chart on South Korea - Year-over-year growth 2022-2027 (%)
      • Exhibit 126: Data Table on South Korea - Year-over-year growth 2022-2027 (%)
    • 9.13 Market opportunity by geography
      • Exhibit 127: Market opportunity by geography ($ million)
      • Exhibit 128: Data Tables on Market opportunity by geography ($ million)

    10 Drivers, Challenges, and Trends

    • 10.1 Market drivers
      • 10.2 Market challenges
        • 10.3 Impact of drivers and challenges
          • Exhibit 129: Impact of drivers and challenges in 2022 and 2027
        • 10.4 Market trends

          11 Vendor Landscape

          • 11.1 Overview
            • 11.2 Vendor landscape
              • Exhibit 130: Overview on Criticality of inputs and Factors of differentiation
            • 11.3 Landscape disruption
              • Exhibit 131: Overview on factors of disruption
            • 11.4 Industry risks
              • Exhibit 132: Impact of key risks on business

            12 Vendor Analysis

            • 12.1 Vendors covered
              • Exhibit 133: Vendors covered
            • 12.2 Market positioning of vendors
              • Exhibit 134: Matrix on vendor position and classification
            • 12.3 Amkor Technology Inc.
              • Exhibit 135: Amkor Technology Inc. - Overview
              • Exhibit 136: Amkor Technology Inc. - Business segments
              • Exhibit 137: Amkor Technology Inc. - Key offerings
              • Exhibit 138: Amkor Technology Inc. - Segment focus
            • 12.4 ASE Technology Holding Co. Ltd.
              • Exhibit 139: ASE Technology Holding Co. Ltd. - Overview
              • Exhibit 140: ASE Technology Holding Co. Ltd. - Business segments
              • Exhibit 141: ASE Technology Holding Co. Ltd. - Key offerings
              • Exhibit 142: ASE Technology Holding Co. Ltd. - Segment focus
            • 12.5 BASF SE
              • Exhibit 143: BASF SE - Overview
              • Exhibit 144: BASF SE - Business segments
              • Exhibit 145: BASF SE - Key news
              • Exhibit 146: BASF SE - Key offerings
              • Exhibit 147: BASF SE - Segment focus
            • 12.6 ChipMOS TECHNOLOGIES INC.
              • Exhibit 148: ChipMOS TECHNOLOGIES INC. - Overview
              • Exhibit 149: ChipMOS TECHNOLOGIES INC. - Business segments
              • Exhibit 150: ChipMOS TECHNOLOGIES INC. - Key offerings
              • Exhibit 151: ChipMOS TECHNOLOGIES INC. - Segment focus
            • 12.7 DuPont de Nemours Inc.
              • Exhibit 152: DuPont de Nemours Inc. - Overview
              • Exhibit 153: DuPont de Nemours Inc. - Business segments
              • Exhibit 154: DuPont de Nemours Inc. - Key news
              • Exhibit 155: DuPont de Nemours Inc. - Key offerings
              • Exhibit 156: DuPont de Nemours Inc. - Segment focus
            • 12.8 Henkel AG and Co. KGaA
              • Exhibit 157: Henkel AG and Co. KGaA - Overview
              • Exhibit 158: Henkel AG and Co. KGaA - Business segments
              • Exhibit 159: Henkel AG and Co. KGaA - Key news
              • Exhibit 160: Henkel AG and Co. KGaA - Key offerings
              • Exhibit 161: Henkel AG and Co. KGaA - Segment focus
            • 12.9 Heraeus Holding GmbH
              • Exhibit 162: Heraeus Holding GmbH - Overview
              • Exhibit 163: Heraeus Holding GmbH - Product / Service
              • Exhibit 164: Heraeus Holding GmbH - Key offerings
            • 12.10 Hitachi Ltd.
              • Exhibit 165: Hitachi Ltd. - Overview
              • Exhibit 166: Hitachi Ltd. - Business segments
              • Exhibit 167: Hitachi Ltd. - Key news
              • Exhibit 168: Hitachi Ltd. - Key offerings
              • Exhibit 169: Hitachi Ltd. - Segment focus
            • 12.11 Honeywell International Inc.
              • Exhibit 170: Honeywell International Inc. - Overview
              • Exhibit 171: Honeywell International Inc. - Business segments
              • Exhibit 172: Honeywell International Inc. - Key news
              • Exhibit 173: Honeywell International Inc. - Key offerings
              • Exhibit 174: Honeywell International Inc. - Segment focus
            • 12.12 Intel Corp.
              • Exhibit 175: Intel Corp. - Overview
              • Exhibit 176: Intel Corp. - Business segments
              • Exhibit 177: Intel Corp. - Key news
              • Exhibit 178: Intel Corp. - Key offerings
              • Exhibit 179: Intel Corp. - Segment focus
            • 12.13 KYOCERA Corp.
              • Exhibit 180: KYOCERA Corp. - Overview
              • Exhibit 181: KYOCERA Corp. - Business segments
              • Exhibit 182: KYOCERA Corp. - Key news
              • Exhibit 183: KYOCERA Corp. - Key offerings
              • Exhibit 184: KYOCERA Corp. - Segment focus
            • 12.14 Nippon Steel Corp.
              • Exhibit 185: Nippon Steel Corp. - Overview
              • Exhibit 186: Nippon Steel Corp. - Business segments
              • Exhibit 187: Nippon Steel Corp. - Key offerings
              • Exhibit 188: Nippon Steel Corp. - Segment focus
            • 12.15 Powertech Technology Inc.
              • Exhibit 189: Powertech Technology Inc. - Overview
              • Exhibit 190: Powertech Technology Inc. - Business segments
              • Exhibit 191: Powertech Technology Inc. - Key offerings
              • Exhibit 192: Powertech Technology Inc. - Segment focus
            • 12.16 Samsung Electronics Co. Ltd.
              • Exhibit 193: Samsung Electronics Co. Ltd. - Overview
              • Exhibit 194: Samsung Electronics Co. Ltd. - Business segments
              • Exhibit 195: Samsung Electronics Co. Ltd. - Key news
              • Exhibit 196: Samsung Electronics Co. Ltd. - Key offerings
              • Exhibit 197: Samsung Electronics Co. Ltd. - Segment focus
            • 12.17 Texas Instruments Inc.
              • Exhibit 198: Texas Instruments Inc. - Overview
              • Exhibit 199: Texas Instruments Inc. - Business segments
              • Exhibit 200: Texas Instruments Inc. - Key news
              • Exhibit 201: Texas Instruments Inc. - Key offerings
              • Exhibit 202: Texas Instruments Inc. - Segment focus

            13 Appendix

            • 13.1 Scope of the report
              • 13.2 Inclusions and exclusions checklist
                • Exhibit 203: Inclusions checklist
                • Exhibit 204: Exclusions checklist
              • 13.3 Currency conversion rates for US$
                • Exhibit 205: Currency conversion rates for US$
              • 13.4 Research methodology
                • Exhibit 206: Research methodology
                • Exhibit 207: Validation techniques employed for market sizing
                • Exhibit 208: Information sources
              • 13.5 List of abbreviations
                • Exhibit 209: List of abbreviations

              Research Framework

              Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

              INFORMATION SOURCES

              Primary sources

              • Manufacturers and suppliers
              • Channel partners
              • Industry experts
              • Strategic decision makers

              Secondary sources

              • Industry journals and periodicals
              • Government data
              • Financial reports of key industry players
              • Historical data
              • Press releases

              DATA ANALYSIS

              Data Synthesis

              • Collation of data
              • Estimation of key figures
              • Analysis of derived insights

              Data Validation

              • Triangulation with data models
              • Reference against proprietary databases
              • Corroboration with industry experts

              REPORT WRITING

              Qualitative

              • Market drivers
              • Market challenges
              • Market trends
              • Five forces analysis

              Quantitative

              • Market size and forecast
              • Market segmentation
              • Geographical insights
              • Competitive landscape

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              Key Questions Answered

              • What are the key global market and the regional market share?
              • What are the revenue-generating key market segments?
              • What are the key factors driving and challenging this market’s growth?
              • Who are the key market vendors and their growth strategies?
              • What are the latest trends influencing the growth of this market?
              • What are the variables influencing the market growth in the primary regions?
              • What are the factors influencing the growth of the parent market?

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