Wafer Dicing Saws Market by End-user, Packaging Technology, and Geography - Forecast and Analysis 2021-2025

“The Wafer Dicing Saws Market study is a comprehensive report with in-depth qualitative and quantitative research evaluating the current scenario and analyzing the growth of USD 91.16 million and CAGR of 3.04% by segment End-user, Packaging, and Geography during the forecast period 2020 to 2025” 

Furthermore, this report extensively covers the market segmentation by end-user (pureplay foundries and IDMs), packaging (BGA and QFN), and geography (APAC, North America, Europe, South America, and MEA). The market report also offers information on several market vendors, including advanced Dicing Technologies, DISCO Corp., Loadpoint Ltd., Shenyang Heyan Technology Co. Ltd., Tokyo Seimitsu Co. Ltd., TUV NORD AG, and UKAM Industrial Superhard Tools.

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Parent Market Analysis

Technavio categorizes the Wafer Dicing Saws Market as a part of the Information technology industry within the Semiconductors & Semiconductor Equipment industry. Our Technavio research report has extensively covered external factors influencing the parent market growth potential in the coming years, which will determine the levels of growth of the forecast year.

Wafer Dicing Saws Market: Key Drivers, Trends, and Challenges

Our research analysts have studied the historical data and deduced the key market drivers and the COVID-19 pandemic's impact on the wafer dicing saws industry. The holistic analysis of the drivers will help deduce end goals and refine marketing strategies to gain a competitive edge. 

Key Wafer Dicing Saws Market Driver

One of the key factors driving growth in the market is the growing demand for IoT. IoT is an ecosystem wherein many devices are connected to the Internet. These devices include mobile phones, tablets, and other consumer electronic devices. The business possibilities are numerous with the advent of IoT. These devices are assigned an IP address; they can collect and receive data, eliminating the need for any manual operation of the device. IoT devices require a range of semiconductors such as sensors, microcontrollers, and memory components. These components are prepared from dies, which need to be diced from silicon wafers. These dies are then packaged and further encapsulated using chip carriers. ICs are developed and integrated with different electronic devices such as computers, household items, and TVs. Therefore, the demand for semiconductor manufacturing equipment will accelerate with the increasing need for semiconductors to enable the growth of IoT. Thus, the requirement for dicing saws has increased over the years. Furthermore, the increasing demand for IoT wearables and connected car solutions has further increased the demand for silicon wafers. 

Key Wafer Dicing Saws Market Challenge

The volatile nature of the semiconductor industry will be a major challenge for the wafer-dicing saws market during the forecast period. The demand for wafer dicing saws depends on the overall demand for semiconductors. The current and anticipated demand for the semiconductor industry and products that use semiconductors is highly volatile due to a number of reasons. Products that use semiconductors include mobile devices, computers, consumer electronics, automotive goods, and telecommunication equipment. The fluctuating demand for these goods will impact the overall semiconductor market, thereby impacting the semiconductor equipment market. The introduction of new technology invariably leads to high inventory levels of wafers. When new chips are introduced at regular intervals, the original equipment manufacturers (OEMs) reject the older chips. Thus, the older stock of semiconductor chips piles on, increasing the inventory levels. In conclusion, the semiconductor industry is a highly volatile and price-sensitive industry. These inherent features of the semiconductor industry pose a challenge to the market which is dependent on the market for semiconductors and their related products. 

Wafer Dicing Saws Market Value Chain Analysis

Our In-house experts produce extensive information on the value chain, and parent market of the wafer dicing saws market which vendors can leverage to gain a competitive advantage during the forecast period. The Value Chain information provides an end-end understanding of product insight and profit and also optimization and evaluation of business strategies The players across the value chain includes selective data and analysis from entire research findings as per the scope of the report.

Who are the Major Wafer Dicing Saws Market Vendors?

The report analyzes the market’s competitive landscape and offers information on several market vendors, including: 

 

• Advanced Dicing Technologies
• DISCO Corp.
• Loadpoint Ltd.
• Shenyang Heyan Technology Co. Ltd.
• Tokyo Seimitsu Co. Ltd.
• TUV NORD AG
• UKAM Industrial Superhard Tools

 

This statistical study of the wafer dicing saws market encompasses successful business strategies deployed by the key vendors. The wafer dicing saws market is concentrated and the vendors are deploying organic and inorganic growth strategies to compete in the market. The vendor profiles are designed to help clients improve their market position, and information on production and sustainability along with this the report provides a detailed analysis of several leading Companies.

Which are the Key Regions for Wafer Dicing Saws Market?

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86% of the market’s growth will originate from APAC during the forecast period. Taiwan, South Korea (Republic of Korea), Japan, and China are the key markets for wafer dicing saws in APAC. Market growth in this region will be faster than the growth of the market in other regions.

The regional market will mainly be dominated by countries such as Japan, China, Taiwan, South Korea, Singapore, Thailand, Vietnam, and the Philippines during the forecast period, where manufacturers are increasingly investing in processes that ensure efficiency in terms of wafer-handling techniques. With advances in the semiconductor industry, an increasing number of manufacturers of semiconductor devices are expected to invest in wafer dicing equipment and tools during the forecast period. 

COVID Impact and Recovery Analysis

The outbreak of COVID-19 adversely affected the operations of various end-user industries in the region in 2020, including the electronics industry. Supply chain disruptions, shortages of workers, and the weakening economy slowed down electronic manufacturing activities in the region, especially during the first half of 2020. However, major semiconductor manufacturing companies in the region are focusing on making supply chain networks more agile and are planning to expand their fabrication facilities globally. 

What are the Revenue-generating End-user Segments in the Wafer Dicing Saws Market?

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The market share growth by the pureplay foundries segment will be significant during the forecast period. The top four pure-play foundries, namely TSMC, United Microelectronics Corporation (UMC), and Semiconductor Manufacturing International Corporation (SMIC), cater to several customers. Unless there is a pressing need to use better technologies, these firms will continue to use wafer-dicing saws to meet the present and forecasted demand as using wafer-dicing saws is much more economical. Pureplay foundries also have high economies of scale. They have the finances to adopt the best technology, which will help them to produce more ICs. These factors will, in turn, propel the demand for wafer-dicing saws during the forecast period. The need for semiconductors is bound to increase with an increase in the adoption of smart devices such as wearables, smart clothing, and smart textiles. 

This report provides an accurate prediction of the contribution of all the segments to the growth of the market size and actionable market insights on the post-COVID-19 impact on each segment.

Wafer Dicing Saws Market Scope
Report Coverage	Details
Page number	120
Base year	2020
Forecast period	2021-2025
Growth momentum & CAGR	Decelerate at a CAGR of 3.04%
Market growth 2021-2025	$ 91.16 million
Market structure	Concentrated
YoY growth (%)	2.57
Regional analysis	North America, APAC, Europe, South America, and MEA
Performing market contribution	APAC at 86%
Key consumer countries	Taiwan, South Korea (Republic of Korea), Japan, China, and US
Competitive landscape	Leading companies, Competitive strategies, Consumer engagement scope
Key companies profiled	Advanced Dicing Technologies, DISCO Corp., Loadpoint Ltd., Shenyang Heyan Technology Co. Ltd., Tokyo Seimitsu Co. Ltd., TUV NORD AG, and UKAM Industrial Superhard Tools
Market dynamics	Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for the forecast period
Customization purview	If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.

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What are the Key Data Covered in this Wafer Dicing Saws Market Report?

• CAGR of the market during the forecast period 2021-2025
• Detailed information on factors that will drive market growth during the next five years
• Precise estimation of the market size and its contribution to the parent market
• Accurate predictions on upcoming trends and changes in consumer behaviour
• The growth of the wafer dicing saws industry across North America, APAC, Europe, South America, and MEA
• A thorough analysis of the market’s competitive landscape and detailed information on vendors
• Comprehensive details of factors that will challenge the growth of market vendors

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