Wire Bonder Equipment Market by Product, End-user and Geography - Forecast and Analysis 2023-2027

Published: Jan 2023 Pages: 158 SKU: IRTNTR43223

The wire bonder equipment market is estimated to grow at a CAGR of 3.3% between 2022 and 2027. The size of the market is forecast to increase by USD 219.24 million. The growth of the market depends on several factors, including the rising electronics products across the world, the rising electronic content in automobiles, and the increase in the number of OSAT vendors.

This report extensively covers market segmentation by product (ball bonders, stud-bump bonders, and wedge bonders), end-user (OSAT and IDM), and geography (APAC, North America, Europe, South America, and Middle East and Africa). It also includes an in-depth analysis of drivers, trends, and challenges. Furthermore, the report includes historic market data from 2017 to 2021.

What will be the Size of the Wire Bonder Equipment Market During the Forecast Period?

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Parent Market Analysis

Technavio categorizes the global wire bonder equipment market as a part of the global industrial machinery market. The parent, the global industrial machinery market, covers companies engaged in manufacturing industrial machinery and components covering presses, machine tools, compressors, pollution control equipment, elevators, escalators, insulators, pumps, roller bearings, and other metal fabrications. Our research report has extensively covered external factors influencing the parent market growth during the forecast period.

Wire Bonder Equipment Market: Key Drivers, Trends, Challenges, and Customer Landscape

The increase in the number of OSAT vendors is notably driving the market growth, although factors such as the shortage of skilled and trained personnel may impede the market growth. Our researchers analyzed the data with 2022 as the base year, along with the key drivers, trends, and challenges. A holistic analysis of drivers will help companies refine their marketing strategies to gain a competitive advantage.

Key Wire Bonder Equipment Market Driver

The increase in the number of OSAT vendors is the key factor driving the global wire bonder equipment market growth. The number of OSATs in APAC, especially China, is growing at a considerable pace due to their strong liquidity and financial backing. This allows OSATs to have ample capital to undertake R & D as well as capacity expansion. Semiconductor manufacturers also receive a significant amount of governmental support and backing for developing the industry. Major countries from APAC, such as South Korea, China, and Japan, undertake such investments propelling the growth of these facilities.

The easy availability of capital will boost the development of these companies while ensuring scale and technical competence through acquisitions. The increase in the number of OSATS signifies that most companies in the semiconductor market are resorting to the fabless model. This increases the orders received for packaging by these OSATs, who now must increase their production capacities. This is expected to generate significant demand during the forecast period.

Significant Wire Bonder Equipment Market Trend

The increasing popularity of flip-chip bonding technology is the primary trend in the global wire bonder equipment market growth. The use of flip-chip technology for carrying out the packaging of semiconductor devices has been witnessing growth since the last decade.

This technology is an alternative to the legacy wire bonding technique and is expected to slowly take over the wire bonding's share in the market. Therefore, the rising trend in the adoption of flip-chip bonding technology is expected to negatively impact the market during the forecast period.

Major Wire Bonder Equipment Market Challenge

Shortage of skilled and trained personnel is a major challenge to the global wire bonder equipment market growth. A major issue faced by the semiconductor manufacturing sector is the lack of skilled and trained personnel with respect to manufacturing and operating these complex machines. The major reasons for the widening of this gap are the retirement of the baby boomers and the growing global economic expansion. In addition, there has been a loss of embedded knowledge due to the retirement of the baby boomers, which has also created a gap in the number of experienced people available. In addition, the younger generation has an inclination toward the service industry.

Furthermore, there is a lack of basic skills and knowledge in the fields of engineering, mathematics, science, and technology nowadays due to the gradual decline in technical education programs in schools. This has impacted the manufacturing sector significantly and will likely hinder the growth of the semiconductor market to a certain extent, thereby affecting the sales of capital equipment, such as wire bonder equipment, during the forecast period.

Key Wire Bonder Equipment Market Customer Landscape

The report includes the adoption lifecycle of the market, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. Furthermore, the report also includes key purchase criteria and drivers of price sensitivity to help companies evaluate and develop their growth strategies.

Global Wire Bonder Equipment Market Customer Landscape

Who are the Major Wire Bonder Equipment Market Vendors?

Vendors are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.

asmpt.com - The company offers wire bonder equipment such as eagle 60 wire bonder.

The report also includes detailed analyses of the competitive landscape of the market and information about 15 market vendors, including:

  • Accelonix Ltd.
  • BE Semiconductor Industries NV
  • Bergen Group
  • Cirexx International
  • Corintech Ltd.
  • DIAS Automation HK Ltd.
  • F & K DELVOTEC Bondtechnik GmbH
  • F & S BONDTEC Semiconductor GmbH
  • Hesse GmbH
  • HYBOND Inc.
  • Kulicke and Soffa Industries Inc.
  • Micro Point Pro Ltd.
  • Palomar Technologies Inc.
  • Powertech Technology Inc.
  • Toray Industries Inc.

Qualitative and quantitative analysis of vendors has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize vendors as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize vendors as dominant, leading, strong, tentative, and weak.

What is the Fastest-Growing Segment in the Wire Bonder Equipment Market?

The market share growth by the ball bonders segment will be significant during the forecast period. Ball bonding is usually carried out using joining methods such as thermocompression and thermo-sonic bonding. The thermocompression method uses pressure and temperatures of 150C and above to generate an intermetallic bond. Thermo-sonic bonding uses a combination of heat and ultrasonic energy to form the intermetallic bond.

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The ball bonders segment was valued at USD 927.35 million in 2017 and continue to grow by 2021. Ball bonder equipment can achieve faster speeds that are capable of bonding more than 5-12 wires per second. Gold, copper, and palladium-coated wires are usually used in this wire bonding process. This technology is ideal for carrying out bonding applications for fine-pitch applications in the range of 40 microns or less. The method is used for applications such as ball grid array (BGA), small outline package (SOP), quad flat package (QFP), and multi-chip modules (MCM) hybrids, as well as for wafer-level bumping. All these factors are expected to propel the demand for ball bonder equipment for ball bonding, leveraging the growth of the market in focus during the forecast period.

Which are the Key Regions for the Wire Bonder Equipment Market?

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APAC is estimated to contribute 84% to the growth of the global market during the forecast period. Technavio’s analysts have elaborately explained the regional trends and drivers that shape the market during the forecast period. APAC dominates the market due to the presence of several major OSATs, such as ASE and STATS ChipPAC. These packaging and assembly vendors are making significant investments to revamp their production lines with respect to the latest technological developments in packaging technology. This is expected to generate demand for new wire bonder equipment in the market. Taiwan and China are hubs for semiconductor device manufacturing, which further propels the demand for assembly and packaging equipment in the region. 

The outbreak of COVID-19 adversely affected the operations of various end-user industries, including the electronics industry, in APAC in 2020. However, the lockdown restrictions were lifted in the first half of 2021 owing to the initiation of vaccination drives, which resulted in the resumption of operations in end-user industries. Therefore, although the regional semiconductor industry witnessed a downturn in 2020 due to the pandemic, the developments in the industry, such as the setting up of new semiconductor manufacturing facilities, are anticipated to drive the growth of the wire bonder equipment market in APAC during the forecast period.

Segment Overview

The report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2017 to 2027. The market has been segmented by Product (Ball bonders, Stud-bump bonders, and Wedge bonders), End-user (OSAT and IDM), and Geography (APAC, North America, Europe, South America, and Middle East and Africa).

  • Product Outlook (USD Million, 2017 - 2027)
    • Ball bonders
    • Stud-bump bonders
    • Wedge bonders
  • End-user Outlook (USD Million, 2017 - 2027)
    • OSAT
    • IDM
  • Region Outlook (USD Million, 2017 - 2027)
    • North America
      • The U.S.
      • Canada
    • Europe
      • The U.K.
      • Germany
      • France
      • Rest of Europe
    • APAC
      • China
      • India
    • South America
      • Chile
      • Argentina
      • Brazil
    • Middle East & Africa
      • Saudi Arabia
      • South Africa
      • Rest of the Middle East & Africa

Wire Bonder Equipment Market Scope

Report Coverage

Details

Page number

158

Base year

2022

Historic period

2017-2021

Forecast period

2023-2027

Growth momentum & CAGR

Accelerate at a CAGR of 3.3%

Market growth 2023-2027

USD 219.24 million

Market structure

Fragmented

YoY growth 2022-2023(%)

3.1

Regional analysis

APAC, North America, Europe, South America, and Middle East and Africa

Performing market contribution

APAC at 84%

Key countries

US, China, Japan, India, and Germany

Competitive landscape

 Leading Vendors, Market Positioning of Vendors, Competitive Strategies, and Industry Risks

Key companies profiled

Accelonix Ltd., ASM Pacific Technology Ltd., BE Semiconductor Industries NV, Bergen Group, Cirexx International, Corintech Ltd., DIAS Automation HK Ltd., F & K DELVOTEC Bondtechnik GmbH, F & S BONDTEC Semiconductor GmbH, Hesse GmbH, HYBOND Inc., Kulicke and Soffa Industries Inc., Micro Point Pro Ltd., Palomar Technologies Inc., Powertech Technology Inc., Toray Industries Inc., TPT Wirebonder GmbH and Co. KG, Ultrasonic Engineering Co. Ltd, WestBond Inc., and Yamaha Motor Co. Ltd.

Market dynamics

Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for forecast period.

Customization purview

If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.

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What are the Key Data Covered in this Wire Bonder Equipment Market Report?

  • CAGR of the market during the forecast period
  • Detailed information on factors that will drive the growth of the wire bonder equipment market between 2023 and 2027
  • Precise estimation of the wire bonder equipment market size and its contribution to the parent market
  • Accurate predictions about upcoming trends and changes in consumer behavior
  • Growth of the market across APAC, North America, Europe, South America, and Middle East and Africa
  • Thorough analysis of the market’s competitive landscape and detailed information about vendors
  • Comprehensive analysis of factors that will challenge the growth of wire bonder equipment market vendors

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1 Executive Summary

  • 1.1 Market overview
    • Exhibit 01: Executive Summary – Chart on Market Overview
    • Exhibit 02: Executive Summary – Data Table on Market Overview
    • Exhibit 03: Executive Summary – Chart on Global Market Characteristics
    • Exhibit 04: Executive Summary – Chart on Market by Geography
    • Exhibit 05: Executive Summary – Chart on Market Segmentation by Product
    • Exhibit 06: Executive Summary – Chart on Market Segmentation by End-user
    • Exhibit 07: Executive Summary – Chart on Incremental Growth
    • Exhibit 08: Executive Summary – Data Table on Incremental Growth
    • Exhibit 09: Executive Summary – Chart on Vendor Market Positioning

2 Market Landscape

  • 2.1 Market ecosystem
    • Exhibit 10: Parent market
    • Exhibit 11: Market Characteristics

3 Market Sizing

  • 3.1 Market definition
    • Exhibit 12: Offerings of vendors included in the market definition
  • 3.2 Market segment analysis
    • Exhibit 13: Market segments
  • 3.3 Market size 2022
    • 3.4 Market outlook: Forecast for 2022-2027
      • Exhibit 14: Chart on Global - Market size and forecast 2022-2027 ($ million)
      • Exhibit 15: Data Table on Global - Market size and forecast 2022-2027 ($ million)
      • Exhibit 16: Chart on Global Market: Year-over-year growth 2022-2027 (%)
      • Exhibit 17: Data Table on Global Market: Year-over-year growth 2022-2027 (%)

    4 Historic Market Size

    • 4.1 Global wire bonder equipment market 2017 - 2021
      • Exhibit 18: Historic Market Size – Data Table on Global wire bonder equipment market 2017 - 2021 ($ million)
    • 4.2 Product Segment Analysis 2017 - 2021
      • Exhibit 19: Historic Market Size – Product Segment 2017 - 2021 ($ million)
    • 4.3 End-user Segment Analysis 2017 - 2021
      • Exhibit 20: Historic Market Size – End-user Segment 2017 - 2021 ($ million)
    • 4.4 Geography Segment Analysis 2017 - 2021
      • Exhibit 21: Historic Market Size – Geography Segment 2017 - 2021 ($ million)
    • 4.5 Country Segment Analysis 2017 - 2021
      • Exhibit 22: Historic Market Size – Country Segment 2017 - 2021 ($ million)

    5 Five Forces Analysis

    • 5.1 Five forces summary
      • Exhibit 23: Five forces analysis - Comparison between 2022 and 2027
    • 5.2 Bargaining power of buyers
      • Exhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2022 and 2027
    • 5.3 Bargaining power of suppliers
      • Exhibit 25: Bargaining power of suppliers – Impact of key factors in 2022 and 2027
    • 5.4 Threat of new entrants
      • Exhibit 26: Threat of new entrants – Impact of key factors in 2022 and 2027
    • 5.5 Threat of substitutes
      • Exhibit 27: Threat of substitutes – Impact of key factors in 2022 and 2027
    • 5.6 Threat of rivalry
      • Exhibit 28: Threat of rivalry – Impact of key factors in 2022 and 2027
    • 5.7 Market condition
      • Exhibit 29: Chart on Market condition - Five forces 2022 and 2027

    6 Market Segmentation by Product

    • 6.1 Market segments
      • Exhibit 30: Chart on Product - Market share 2022-2027 (%)
      • Exhibit 31: Data Table on Product - Market share 2022-2027 (%)
    • 6.2 Comparison by Product
      • Exhibit 32: Chart on Comparison by Product
      • Exhibit 33: Data Table on Comparison by Product
    • 6.3 Ball bonders - Market size and forecast 2022-2027
      • Exhibit 34: Chart on Ball bonders - Market size and forecast 2022-2027 ($ million)
      • Exhibit 35: Data Table on Ball bonders - Market size and forecast 2022-2027 ($ million)
      • Exhibit 36: Chart on Ball bonders - Year-over-year growth 2022-2027 (%)
      • Exhibit 37: Data Table on Ball bonders - Year-over-year growth 2022-2027 (%)
    • 6.4 Stud-bump bonders - Market size and forecast 2022-2027
      • Exhibit 38: Chart on Stud-bump bonders - Market size and forecast 2022-2027 ($ million)
      • Exhibit 39: Data Table on Stud-bump bonders - Market size and forecast 2022-2027 ($ million)
      • Exhibit 40: Chart on Stud-bump bonders - Year-over-year growth 2022-2027 (%)
      • Exhibit 41: Data Table on Stud-bump bonders - Year-over-year growth 2022-2027 (%)
    • 6.5 Wedge bonders - Market size and forecast 2022-2027
      • Exhibit 42: Chart on Wedge bonders - Market size and forecast 2022-2027 ($ million)
      • Exhibit 43: Data Table on Wedge bonders - Market size and forecast 2022-2027 ($ million)
      • Exhibit 44: Chart on Wedge bonders - Year-over-year growth 2022-2027 (%)
      • Exhibit 45: Data Table on Wedge bonders - Year-over-year growth 2022-2027 (%)
    • 6.6 Market opportunity by Product
      • Exhibit 46: Market opportunity by Product ($ million)

    7 Market Segmentation by End-user

    • 7.1 Market segments
      • Exhibit 47: Chart on End-user - Market share 2022-2027 (%)
      • Exhibit 48: Data Table on End-user - Market share 2022-2027 (%)
    • 7.2 Comparison by End-user
      • Exhibit 49: Chart on Comparison by End-user
      • Exhibit 50: Data Table on Comparison by End-user
    • 7.3 OSAT - Market size and forecast 2022-2027
      • Exhibit 51: Chart on OSAT - Market size and forecast 2022-2027 ($ million)
      • Exhibit 52: Data Table on OSAT - Market size and forecast 2022-2027 ($ million)
      • Exhibit 53: Chart on OSAT - Year-over-year growth 2022-2027 (%)
      • Exhibit 54: Data Table on OSAT - Year-over-year growth 2022-2027 (%)
    • 7.4 IDM - Market size and forecast 2022-2027
      • Exhibit 55: Chart on IDM - Market size and forecast 2022-2027 ($ million)
      • Exhibit 56: Data Table on IDM - Market size and forecast 2022-2027 ($ million)
      • Exhibit 57: Chart on IDM - Year-over-year growth 2022-2027 (%)
      • Exhibit 58: Data Table on IDM - Year-over-year growth 2022-2027 (%)
    • 7.5 Market opportunity by End-user
      • Exhibit 59: Market opportunity by End-user ($ million)

    8 Customer Landscape

    • 8.1 Customer landscape overview
      • Exhibit 60: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

    9 Geographic Landscape

    • 9.1 Geographic segmentation
      • Exhibit 61: Chart on Market share by geography 2022-2027 (%)
      • Exhibit 62: Data Table on Market share by geography 2022-2027 (%)
    • 9.2 Geographic comparison
      • Exhibit 63: Chart on Geographic comparison
      • Exhibit 64: Data Table on Geographic comparison
    • 9.3 APAC - Market size and forecast 2022-2027
      • Exhibit 65: Chart on APAC - Market size and forecast 2022-2027 ($ million)
      • Exhibit 66: Data Table on APAC - Market size and forecast 2022-2027 ($ million)
      • Exhibit 67: Chart on APAC - Year-over-year growth 2022-2027 (%)
      • Exhibit 68: Data Table on APAC - Year-over-year growth 2022-2027 (%)
    • 9.4 North America - Market size and forecast 2022-2027
      • Exhibit 69: Chart on North America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 70: Data Table on North America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 71: Chart on North America - Year-over-year growth 2022-2027 (%)
      • Exhibit 72: Data Table on North America - Year-over-year growth 2022-2027 (%)
    • 9.5 Europe - Market size and forecast 2022-2027
      • Exhibit 73: Chart on Europe - Market size and forecast 2022-2027 ($ million)
      • Exhibit 74: Data Table on Europe - Market size and forecast 2022-2027 ($ million)
      • Exhibit 75: Chart on Europe - Year-over-year growth 2022-2027 (%)
      • Exhibit 76: Data Table on Europe - Year-over-year growth 2022-2027 (%)
    • 9.6 South America - Market size and forecast 2022-2027
      • Exhibit 77: Chart on South America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 78: Data Table on South America - Market size and forecast 2022-2027 ($ million)
      • Exhibit 79: Chart on South America - Year-over-year growth 2022-2027 (%)
      • Exhibit 80: Data Table on South America - Year-over-year growth 2022-2027 (%)
    • 9.7 Middle East and Africa - Market size and forecast 2022-2027
      • Exhibit 81: Chart on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
      • Exhibit 82: Data Table on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
      • Exhibit 83: Chart on Middle East and Africa - Year-over-year growth 2022-2027 (%)
      • Exhibit 84: Data Table on Middle East and Africa - Year-over-year growth 2022-2027 (%)
    • 9.8 China - Market size and forecast 2022-2027
      • Exhibit 85: Chart on China - Market size and forecast 2022-2027 ($ million)
      • Exhibit 86: Data Table on China - Market size and forecast 2022-2027 ($ million)
      • Exhibit 87: Chart on China - Year-over-year growth 2022-2027 (%)
      • Exhibit 88: Data Table on China - Year-over-year growth 2022-2027 (%)
    • 9.9 US - Market size and forecast 2022-2027
      • Exhibit 89: Chart on US - Market size and forecast 2022-2027 ($ million)
      • Exhibit 90: Data Table on US - Market size and forecast 2022-2027 ($ million)
      • Exhibit 91: Chart on US - Year-over-year growth 2022-2027 (%)
      • Exhibit 92: Data Table on US - Year-over-year growth 2022-2027 (%)
    • 9.10 Japan - Market size and forecast 2022-2027
      • Exhibit 93: Chart on Japan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 94: Data Table on Japan - Market size and forecast 2022-2027 ($ million)
      • Exhibit 95: Chart on Japan - Year-over-year growth 2022-2027 (%)
      • Exhibit 96: Data Table on Japan - Year-over-year growth 2022-2027 (%)
    • 9.11 India - Market size and forecast 2022-2027
      • Exhibit 97: Chart on India - Market size and forecast 2022-2027 ($ million)
      • Exhibit 98: Data Table on India - Market size and forecast 2022-2027 ($ million)
      • Exhibit 99: Chart on India - Year-over-year growth 2022-2027 (%)
      • Exhibit 100: Data Table on India - Year-over-year growth 2022-2027 (%)
    • 9.12 Germany - Market size and forecast 2022-2027
      • Exhibit 101: Chart on Germany - Market size and forecast 2022-2027 ($ million)
      • Exhibit 102: Data Table on Germany - Market size and forecast 2022-2027 ($ million)
      • Exhibit 103: Chart on Germany - Year-over-year growth 2022-2027 (%)
      • Exhibit 104: Data Table on Germany - Year-over-year growth 2022-2027 (%)
    • 9.13 Market opportunity by geography
      • Exhibit 105: Market opportunity by geography ($ million)

    10 Drivers, Challenges, and Trends

    • 10.1 Market drivers
      • 10.2 Market challenges
        • 10.3 Impact of drivers and challenges
          • Exhibit 106: Impact of drivers and challenges in 2022 and 2027
        • 10.4 Market trends

          11 Vendor Landscape

          • 11.1 Overview
            • 11.2 Vendor landscape
              • Exhibit 107: Overview on Criticality of inputs and Factors of differentiation
            • 11.3 Landscape disruption
              • Exhibit 108: Overview on factors of disruption
            • 11.4 Industry risks
              • Exhibit 109: Impact of key risks on business

            12 Vendor Analysis

            • 12.1 Vendors covered
              • Exhibit 110: Vendors covered
            • 12.2 Market positioning of vendors
              • Exhibit 111: Matrix on vendor position and classification
            • 12.3 ASM Pacific Technology Ltd.
              • Exhibit 112: ASM Pacific Technology Ltd. - Overview
              • Exhibit 113: ASM Pacific Technology Ltd. - Business segments
              • Exhibit 114: ASM Pacific Technology Ltd. - Key offerings
              • Exhibit 115: ASM Pacific Technology Ltd. - Segment focus
            • 12.4 BE Semiconductor Industries NV
              • Exhibit 116: BE Semiconductor Industries NV - Overview
              • Exhibit 117: BE Semiconductor Industries NV - Business segments
              • Exhibit 118: BE Semiconductor Industries NV - Key offerings
              • Exhibit 119: BE Semiconductor Industries NV - Segment focus
            • 12.5 Corintech Ltd.
              • Exhibit 120: Corintech Ltd. - Overview
              • Exhibit 121: Corintech Ltd. - Product / Service
              • Exhibit 122: Corintech Ltd. - Key offerings
            • 12.6 DIAS Automation HK Ltd.
              • Exhibit 123: DIAS Automation HK Ltd. - Overview
              • Exhibit 124: DIAS Automation HK Ltd. - Product / Service
              • Exhibit 125: DIAS Automation HK Ltd. - Key offerings
            • 12.7 F and K DELVOTEC Bondtechnik GmbH
              • Exhibit 126: F and K DELVOTEC Bondtechnik GmbH - Overview
              • Exhibit 127: F and K DELVOTEC Bondtechnik GmbH - Product / Service
              • Exhibit 128: F and K DELVOTEC Bondtechnik GmbH - Key offerings
            • 12.8 F and S BONDTEC Semiconductor GmbH
              • Exhibit 129: F and S BONDTEC Semiconductor GmbH - Overview
              • Exhibit 130: F and S BONDTEC Semiconductor GmbH - Product / Service
              • Exhibit 131: F and S BONDTEC Semiconductor GmbH - Key offerings
            • 12.9 Hesse GmbH
              • Exhibit 132: Hesse GmbH - Overview
              • Exhibit 133: Hesse GmbH - Product / Service
              • Exhibit 134: Hesse GmbH - Key offerings
            • 12.10 HYBOND Inc.
              • Exhibit 135: HYBOND Inc. - Overview
              • Exhibit 136: HYBOND Inc. - Product / Service
              • Exhibit 137: HYBOND Inc. - Key offerings
            • 12.11 Kulicke and Soffa Industries Inc.
              • Exhibit 138: Kulicke and Soffa Industries Inc. - Overview
              • Exhibit 139: Kulicke and Soffa Industries Inc. - Business segments
              • Exhibit 140: Kulicke and Soffa Industries Inc. - Key offerings
              • Exhibit 141: Kulicke and Soffa Industries Inc. - Segment focus
            • 12.12 Micro Point Pro Ltd.
              • Exhibit 142: Micro Point Pro Ltd. - Overview
              • Exhibit 143: Micro Point Pro Ltd. - Product / Service
              • Exhibit 144: Micro Point Pro Ltd. - Key offerings
            • 12.13 Palomar Technologies Inc.
              • Exhibit 145: Palomar Technologies Inc. - Overview
              • Exhibit 146: Palomar Technologies Inc. - Product / Service
              • Exhibit 147: Palomar Technologies Inc. - Key offerings
            • 12.14 Toray Industries Inc.
              • Exhibit 148: Toray Industries Inc. - Overview
              • Exhibit 149: Toray Industries Inc. - Business segments
              • Exhibit 150: Toray Industries Inc. - Key offerings
              • Exhibit 151: Toray Industries Inc. - Segment focus
            • 12.15 TPT Wirebonder GmbH and Co. KG
              • Exhibit 152: TPT Wirebonder GmbH and Co. KG - Overview
              • Exhibit 153: TPT Wirebonder GmbH and Co. KG - Product / Service
              • Exhibit 154: TPT Wirebonder GmbH and Co. KG - Key offerings
            • 12.16 WestBond Inc.
              • Exhibit 155: WestBond Inc. - Overview
              • Exhibit 156: WestBond Inc. - Product / Service
              • Exhibit 157: WestBond Inc. - Key offerings
            • 12.17 Yamaha Motor Co. Ltd.
              • Exhibit 158: Yamaha Motor Co. Ltd. - Overview
              • Exhibit 159: Yamaha Motor Co. Ltd. - Business segments
              • Exhibit 160: Yamaha Motor Co. Ltd. - Key news
              • Exhibit 161: Yamaha Motor Co. Ltd. - Key offerings
              • Exhibit 162: Yamaha Motor Co. Ltd. - Segment focus

            13 Appendix

            • 13.1 Scope of the report
              • 13.2 Inclusions and exclusions checklist
                • Exhibit 163: Inclusions checklist
                • Exhibit 164: Exclusions checklist
              • 13.3 Currency conversion rates for US$
                • Exhibit 165: Currency conversion rates for US$
              • 13.4 Research methodology
                • Exhibit 166: Research methodology
                • Exhibit 167: Validation techniques employed for market sizing
                • Exhibit 168: Information sources
              • 13.5 List of abbreviations
                • Exhibit 169: List of abbreviations

              Research Framework

              Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

              INFORMATION SOURCES

              Primary sources

              • Manufacturers and suppliers
              • Channel partners
              • Industry experts
              • Strategic decision makers

              Secondary sources

              • Industry journals and periodicals
              • Government data
              • Financial reports of key industry players
              • Historical data
              • Press releases

              DATA ANALYSIS

              Data Synthesis

              • Collation of data
              • Estimation of key figures
              • Analysis of derived insights

              Data Validation

              • Triangulation with data models
              • Reference against proprietary databases
              • Corroboration with industry experts

              REPORT WRITING

              Qualitative

              • Market drivers
              • Market challenges
              • Market trends
              • Five forces analysis

              Quantitative

              • Market size and forecast
              • Market segmentation
              • Geographical insights
              • Competitive landscape

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              Key Questions Answered

              • What are the key global market and the regional market share?
              • What are the revenue-generating key market segments?
              • What are the key factors driving and challenging this market’s growth?
              • Who are the key market vendors and their growth strategies?
              • What are the latest trends influencing the growth of this market?
              • What are the variables influencing the market growth in the primary regions?
              • What are the factors influencing the growth of the parent market?

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