Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

January 20, 2016
SKU:
IRTNTR7971
This global market research report covers the growth prospects of the semiconductor packaging and assembly equipment market with segmentations based on the type (die-level packaging and assembly equipment and wafer-level packaging and assembly equipment) and by geography (APAC, Europe, and North America). It also includes an insightful analysis of the leading vendors in this market, including Applied Materials, ASMPT, DISCO, EV Group, Kulicke and Soffa Industries, TEL, and Tokyo Seimitsu.

Market outlook of the global semiconductor packaging and assembly equipment industry

Technavio’s market research analyst predicts the global semiconductor packaging and assembly equipment market to grow steadily at a CAGR of around 5% during the forecast period. The increasing global demand for semiconductor ICs is a critical factor that is expected to drive the demand for semiconductor packaging and assembly equipment during the forecast period.

The growing complexity of semiconductor IC designs is the key driver for the growth of this market. Recently, it has been observed that the need for semiconductor ICs that can perform multiple functions is increasing. Consequently, vendors have developed semiconductor ICs with complex architecture so as to address the rising need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels market growth during the forecast period.

Segmentation by type and analysis of the semiconductor packaging and assembly equipment market

  • Die- level packaging and assembly equipment
  • Wafer-level packaging and assembly equipment

In this market research, analysts have estimated the die-level packaging and assembly equipment segment to be the major revenue contributing segment in this market during the forecasted period. The increasing demand for application processes, such as baseband and SoCs that are integrated into both mobile and consumer electronic devices, is the primary reason for the segment’s impressive market share of nearly 56% by 2020. 

Geographical segmentation of the semiconductor packaging and assembly equipment market

  • APAC
  • Europe
  • North America

Technavio market research analysts have estimated the APAC region to continue dominating this market during the forecast period. This region currently accounts for more than 71% of the total revenue share and is predicted to retain its dominating hold over the market by the end of 2020. The presence of leading semiconductor foundries in this region, such as Taiwan Semiconductor Manufacturing, United Microelectronics, Samsung, and Semiconductor Manufacturing International, is expected to impel market growth during the forecast period.

Competitive landscape and key vendors

This market is expected to exhibit steady growth over the forecast period and is highly competitive due to the presence of multiple leading foundries and OSATs.  The recent shift towards 3D IC technology is envisaged to intensify the level of competition between the foundries and OSATs.

Key vendors in this market are -

  • Applied Materials
  • ASMPT
  • DISCO
  • EVG
  • Kulicke and Soffa Industries
  • TEL
  • Tokyo Seimitsu

Other prominent vendors analyzed in this market research are Rudolph Technologies, SEMES, Suss Microtec, Ultratech, and Ulvac Technologies.

Key questions answered in the report include

  • What will the market size and the growth rate be in 2020?
  • What are the key factors driving the global semiconductor packaging and assembly equipment industry?
  • What are the key market trends impacting the growth of the global semiconductor packaging and assembly equipment industry?
  • What are the challenges to market growth?
  • Who are the key vendors in the global semiconductor packaging and assembly equipment industry?
  • What are the market opportunities and threats faced by the vendors in the global semiconductor packaging and assembly equipment industry?
  • Trending factors influencing the market shares of the APAC, Europe, and North America?
  • What are the key outcomes of the five forces analysis of the global semiconductor packaging and assembly equipment industry?

Technavio also offers customization on reports based on specific client requirement.

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