Enjoy complimentary customisation on priority with our Enterprise License!
Technavio’s market research analysts predict the global fan-in WLP market to grow steadily during the forecast period and post a CAGR of almost 10% by 2020. This industry research report identifies the increasing complexity of semiconductor IC designs to be one of the key factors that will have a positive impact on the growth of this market in the coming years. The addition of advanced functionalities in consumer electronic devices will lead to the increased demand for multifunctional ICs. This, in turn, will induce semiconductor manufacturers to develop new and more complex architecture and design for semiconductor ICs. As a result, there will be a significant increase in the adoption of WLP solutions as they ensure the robust performance of semiconductor ICs.
One of the major trends that will gain traction in this market is the increased adoption of semiconductor ICs in automobiles. Several automotive manufacturers have started focusing on the electrification and automation of automobiles. This will increase the need for semiconductors ICs in various products such as GPS, airbag control, anti-lock braking system (ABS), power doors and windows, car navigation and display, infotainment, collision detection technology, and automated driving and will consecutively increase the demand for packaging solutions such as fan-in wafer level packaging.
The market consists of a few semiconductor packaging vendors and is dominated by major players such as STATS ChipPAC, STMicroelectronics, TSMC, and Texas Instruments. Vendors mainly compete on the basis of factors such as capital expenditure, pace of innovation, and new partnerships. Technological advancements in the consumer electronics sector and the Internet of Things (IoT), increase the demand for advanced packaging technologies such as fan-in and fan-out packaging, which will, in turn, intensify the level of competition among market players. Due to the demand for fan-in WLP packaging from smartphone manufacturers to develop better chip-scale packages, several vendors in the advanced packaging industry are entering the market, leading to intense competition among existing players.
The leading vendors in the market are -
The other prominent vendors in the market are Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, and FlipChip International.
During 2015, the analog and mixed IC segment accounted for the major shares and dominated the market. The demand for analog ICs from different segments such as consumer electronics, communications, and automotive and the increasing adoption of smartphones, phablets, and tablets, will fuel the growth of the market segment in the coming years. Additionally, technological advancements in the semiconductor industry that demand the need to ensure the robust performance of advanced ICs will also drive the demand for fan-in WLP packaging.
This market study predicts that in terms of geographical regions, APAC will be the major revenue contributor to the market throughout the next four years. This is mainly due to the presence of a number of semiconductor foundries in this region. Moreover, the rise in demand for semiconductor devices due to the presence of prominent consumer electronics manufacturers, such as Samsung, Sony, LG, Toshiba, and Panasonic, will also bolster this market’s growth prospects.
Technavio also offers customization on reports based on specific client requirement.
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
PART 05: Technology landscape
PART 06: Market landscape
PART 07: Market segmentation by application
PART 08: Geographical segmentation
PART 09: Market drivers
PART 10: Impact of drivers
PART 11: Market challenges
PART 12: Impact of drivers and challenges
PART 13: Market trends
PART 14: Vendor landscape
PART 15: Market summary
PART 16: Appendix
PART 17: Explore Technavio
Get lifetime access to our
Technavio Insights
Cookie Policy
The Site uses cookies to record users' preferences in relation to the functionality of accessibility. We, our Affiliates, and our Vendors may store and access cookies on a device, and process personal data including unique identifiers sent by a device, to personalise content, tailor, and report on advertising and to analyse our traffic. By clicking “I’m fine with this”, you are allowing the use of these cookies. Please refer to the help guide of your browser for further information on cookies, including how to disable them. Review our Privacy & Cookie Notice.