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The aggressive promotional policies of the Chinese government and investment by private companies has driven the semiconductor industry in China to grow at a quick rate. China’s semiconductor consumption grew at a CAGR of about 19% over the last decade.
The increasing use of packaging and testing devices for the completion of semiconductor chip manufacturing has driven the growth of the semiconductor packaging and test market in China, which has resulted in a projected CAGR of over 7% during the forecast period.
The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics.
The semiconductor packaging and test market by outsourced semiconductor assembly and test in China is anticipated to rise to $3.30 billion by 2019. The outsourcing segment is driven by factors such as the overall growth in the semiconductor industry and the rising costs for packaging and testing equipment.
The rising costs of the packaging and test equipment has driven chip manufacturers to sell off the packaging and test facilities and focus more on partnerships and mergers to outsource their packaging and testing of chips.
For instance, Amkor, a leading packaging and test equipment manufacturer has formed a joint venture with the Japanese firm, J-devices.
Top vendors in the market are -
Other prominent vendors included in this report are ChipMos, Greatek, Huahong, JCET, KYEC, Lingsen Precision, Nepes, SMIC, Tianshui Huatian, and Unisem.
Technavio’s market research analysts analyze upcoming trends such as the emergence of 3D chip packaging, which involves the stacking of multiple chips into a single stack, thereby occupying less space in a device. The rise of 3D chip packaging will provide semiconductor foundries with new business opportunities in the coming years and drive the market growth during the forecast period.
This report provides a number of factors contributing to the adoption, limitations, and opportunities of the semiconductor packaging and test market in China. It also offers an analysis of each factor and an estimation of the extent to which the factors are likely to impact the overall market growth.
Technavio also offers customization on reports based on specific client requirement.
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