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Global Embedded Die Packaging Market 2018-2022

  • Published: Aug 2018
  • Pages: 117
  • SKU: IRTNTR23028
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The embedded die packaging market size will grow by USD 14.71 million during 2018-2022. This report offers an analysis of the market based on application (consumer electronics, automotive, healthcare, and others) and geography (the Americas, APAC, and EMEA). The embedded die packaging market research report further analyzes the market’s competitive landscape and offers information on several companies including Advanced Semiconductor Engineering (ASE) Technology, Amkor Technology, Austria Technologies & Systemtechnik Aktiengesellschaft (AT&S), SHINKO ELECTRIC INDUSTRIES, and TDK.

Below are some of the key findings from the embedded die packaging market research report:

Global Embedded Die Packaging Market 2018-2022

 

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Global embedded die packaging industry overview

The growing miniaturization of devices will be one of the major factors driving the embedded die packaging market growth during the predicted period. Several end-user sectors including aerospace and defense, consumer electronics, healthcare, automotive, and others have witnessed a considerable increase in demand for miniaturized electronic components. Owing to its ability to offer smaller sized IC packages, the use of embedded die packaging technology has increased across several applications. Features such as better functionality and efficiency of the electronic circuit, improved signal inductance, reduced size, high signal density, and higher reliability are also propelling the demand for embedded die packaging solutions in different applications.

The rising growth in high-performance computing is one of the key trends expected to gain traction in the market. HPC systems often aid in solving recurring problems and complex operations efficiently with respect to weather forecasting, quantum mechanics, and molecular modeling. The increasing demand for HPC will further give rise to the need for ICs manufactured using embedded die packaging technology. As this technology also leads to the creation of reliable IC packages, the growing demand for HPC systems will eventually boost the growth of embedded die packaging in the forthcoming years.

Top embedded die packaging companies covered in this market research report

The embedded die packaging market is moderately fragmented with companies focusing on integrating advanced technologies including haptics, gesture recognition, facial recognition, GPS tracking, heart rate monitoring, and voice recognition. By offering a complete analysis of the market’s competitive landscape and with information on the products offered by the companies, this embedded die packaging industry analysis report is designed to aid clients to identify new growth opportunities and build innovative strategies for strengthening their position in the market.

The report offers a complete analysis of various companies including:

  • Advanced Semiconductor Engineering (ASE) Technology
  • Amkor Technology
  • Austria Technologies & Systemtechnik Aktiengesellschaft (AT&S)
  • SHINKO ELECTRIC INDUSTRIES
  • TDK

Embedded die packaging market segmentation based on geographic regions

  • Americas
  • APAC
  • EMEA

The APAC region will account for the highest embedded die packaging market revenue throughout the forecast period. The APAC region will also witness the fastest growth in the market due to the rising use of embedded die packaging in the consumer electronics and automotive sector, especially in emerging economies of the region.

Embedded die packaging market segmentation based on application

  • Consumer electronics
  • Automotive
  • Healthcare
  • Others

The consumer electronics segment will account for the highest embedded die packaging market growth due to the increasing demand for miniaturization coupled with the adoption of packaging technology for several smartphone components. Additionally, the report will also provide an accurate prediction of the contribution of the various application segments to the growth of the embedded die packaging market size.

Key highlights of the global embedded die packaging market for the forecast years 2018-2022:

  • CAGR of the market during the forecast period 2018-2022
  • Detailed information on factors that will accelerate the growth of the embedded die packaging market during the next five years
  • Precise estimation of the global embedded die packaging market size and its contribution to the parent market
  • Accurate predictions on upcoming trends and changes in consumer behavior
  • The growth of the embedded die packaging industry across the Americas, APAC, and EMEA
  • A thorough analysis of the market’s competitive landscape and detailed information on several vendors
  • Comprehensive details on the factors that will challenge the growth of the embedded die packaging companies

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PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: MARKET SEGMENTATION BY APPLICATION

  • Segmentation by application
  • Comparison by application
  • Consumer electronics – Market size and forecast 2017-2022
  • Automotive – Market size and forecast 2017-2022
  • Healthcare – Market size and forecast
  • Others – Market size and forecast 2017-2022
  • Market opportunity by application

PART 08: CUSTOMER LANDSCAPE

PART 09: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • APAC – Market size and forecast 2017-2022
  • Americas – Market size and forecast 2017-2022
  • EMEA – Market size and forecast 2017-2022
  • Key leading countries
  • Market opportunity

PART 10: DECISION FRAMEWORK

PART 11: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 12: MARKET TRENDS

  • Increasing interest in MEMS
  • Slowdown in key market segments
  • Growth in high-performance computing

PART 13: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 14: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Advanced Semiconductor Engineering (ASE) Technology
  • Amkor Technology
  • Austria Technologies & Systemtechnik Aktiengesellschaft (AT&S)
  • SHINKO ELECTRIC INDUSTRIES
  • TDK

PART 15: APPENDIX

  • List of abbreviations

Research Framework

Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

TechnavioINFORMATION SOURCES

Primary sources

  • Manufacturers and suppliers
  • Channel partners
  • Industry experts
  • Strategic decision makers

Secondary sources

  • Industry journals and periodicals
  • Government data
  • Financial reports of key industry players
  • Historical data
  • Press releases
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TechnavioDATA ANALYSIS

Data Synthesis

  • Collation of data
  • Estimation of key figures
  • Analysis of derived insights

Data Validation

  • Triangulation with data models
  • Reference against proprietary databases
  • Corroboration with industry experts
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TechnavioREPORT WRITING

Qualitative

  • Market drivers
  • Market challenges
  • Market trends
  • Five forces analysis

Quantitative

  • Market size and forecast
  • Market segmentation
  • Geographical insights
  • Competitive landscape
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