Global Embedded Die Packaging Market 2018-2022

The embedded die packaging market size will grow by USD 14.71 million during 2018-2022. This report offers an analysis of the market based on application (consumer electronics, automotive, healthcare, and others) and geography (the Americas, APAC, and EMEA). The embedded die packaging market research report further analyzes the market’s competitive landscape and offers information on several companies including Advanced Semiconductor Engineering (ASE) Technology, Amkor Technology, Austria Technologies & Systemtechnik Aktiengesellschaft (AT&S), SHINKO ELECTRIC INDUSTRIES, and TDK.

Below are some of the key findings from the embedded die packaging market research report:

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Global embedded die packaging industry overview

The growing miniaturization of devices will be one of the major factors driving the embedded die packaging market growth during the predicted period. Several end-user sectors including aerospace and defense, consumer electronics, healthcare, automotive, and others have witnessed a considerable increase in demand for miniaturized electronic components. Owing to its ability to offer smaller sized IC packages, the use of embedded die packaging technology has increased across several applications. Features such as better functionality and efficiency of the electronic circuit, improved signal inductance, reduced size, high signal density, and higher reliability are also propelling the demand for embedded die packaging solutions in different applications.

The rising growth in high-performance computing is one of the key trends expected to gain traction in the market. HPC systems often aid in solving recurring problems and complex operations efficiently with respect to weather forecasting, quantum mechanics, and molecular modeling. The increasing demand for HPC will further give rise to the need for ICs manufactured using embedded die packaging technology. As this technology also leads to the creation of reliable IC packages, the growing demand for HPC systems will eventually boost the growth of embedded die packaging in the forthcoming years.

Top embedded die packaging companies covered in this market research report

The embedded die packaging market is moderately fragmented with companies focusing on integrating advanced technologies including haptics, gesture recognition, facial recognition, GPS tracking, heart rate monitoring, and voice recognition. By offering a complete analysis of the market’s competitive landscape and with information on the products offered by the companies, this embedded die packaging industry analysis report is designed to aid clients to identify new growth opportunities and build innovative strategies for strengthening their position in the market.

The report offers a complete analysis of various companies including:

• Advanced Semiconductor Engineering (ASE) Technology
• Amkor Technology
• Austria Technologies & Systemtechnik Aktiengesellschaft (AT&S)
• SHINKO ELECTRIC INDUSTRIES
• TDK

Embedded die packaging market segmentation based on geographic regions

• Americas
• APAC
• EMEA

The APAC region will account for the highest embedded die packaging market revenue throughout the forecast period. The APAC region will also witness the fastest growth in the market due to the rising use of embedded die packaging in the consumer electronics and automotive sector, especially in emerging economies of the region.

Embedded die packaging market segmentation based on application

• Consumer electronics
• Automotive
• Healthcare
• Others

The consumer electronics segment will account for the highest embedded die packaging market growth due to the increasing demand for miniaturization coupled with the adoption of packaging technology for several smartphone components. Additionally, the report will also provide an accurate prediction of the contribution of the various application segments to the growth of the embedded die packaging market size.

Key highlights of the global embedded die packaging market for the forecast years 2018-2022:

• CAGR of the market during the forecast period 2018-2022
• Detailed information on factors that will accelerate the growth of the embedded die packaging market during the next five years
• Precise estimation of the global embedded die packaging market size and its contribution to the parent market
• Accurate predictions on upcoming trends and changes in consumer behavior
• The growth of the embedded die packaging industry across the Americas, APAC, and EMEA
• A thorough analysis of the market’s competitive landscape and detailed information on several vendors
• Comprehensive details on the factors that will challenge the growth of the embedded die packaging companies

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