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Global Fabless IC Market 2018-2022

  • Published: May 2018
  • Pages: 139
  • SKU: IRTNTR22002
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This market research report presents a comprehensive analysis of the global fabless IC market based on application segments including communication devices, computing devices, consumer electronic devices, automobile components, and others. Additionally, the report also provides an analysis of the market’s growth by device type (digital ICs and analog ICs) and by geography (the Americas, APAC, and EMEA).

 

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Overview of the fabless IC market

According to Technavio’s global semiconductor market research report, the rising penetration of ICs in the automotive sector will impel the market’s growth during the next few years. To create safer and greener automobiles offering high performance, automotive manufacturers are using customized ICs in different components including fuel injection systems, audio amplifiers, and rollover and stability control systems. With the increasing IC content in modern vehicles including commercial and premium cars, the demand for fabless ICs in the automotive sector has increased considerably in the recent years. Many OEMs are using two or three ICs in automobiles depending on the complexity of the designs. The integration of ICs into cars for audio amplifiers and other systems will further drive the demand for fabless ICs in the forthcoming years. Technavio’s market research analysts have predicted that the fabless IC market will grow at a CAGR close to 8% by 2022.

With the emergence of IoT, the need for interoperability among IoT devices has increased considerably in the recent years. ICs play a crucial role in achieving interoperability and supporting components linking all technologies.  As a result, vendors are developing new designs to support multiple applications on a single platform, which requires IC chips with a larger number of transistors. Furthermore, IoT requires ultralow power (ULP) processors, multiple embedded cores, and integrated wireless connectivity in a single package. According to our semiconductor industry research analysis, such increasing adoption of ICs to provide interoperability among IoT devices will be one of the major trends gaining traction in the fabless IC market during the next few years.

Companies covered

With the presence of a considerable number of fabless IC manufacturers, this market appears to be moderately fragmented. This analog fabless IC market research report will help clients identify new growth opportunities and design unique growth strategies by providing a comprehensive analysis of the market’s competitive landscape and offering information on the products offered by companies. Additionally, the report also recommends areas the companies should focus on to enhance their customer base across various geographies.

This research report provides an analysis of various companies in this market including –

  • Advanced Micro Devices
  • Apple
  • Broadcom
  • MediaTek
  • NVIDIA
  • Qualcomm Technologies

Segmentation by application and analysis of the fabless IC market

  • Communication devices
  • Computing devices
  • Consumer electronic devices
  • Automobile components

The communication devices held the largest application segment share of fabless IC market during 2017. According to this analog fabless IC market research report, the segment will continue gaining the largest IC market share throughout the forecast period.

Segmentation by geography and analysis of the fabless IC market

  • Americas
  • APAC
  • EMEA

Technavio’s fabless IC market research report suggested APAC accounted for the maximum growth of the market during 2017. Owing to the increasing focus of electronics manufacturing in the emerging economies including China and India, this region will account for the maximum revenue during the next few years as well.

 

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Key questions answered in the report include

  • What will the market size and the growth rate be in 2022?
  • What are the key factors driving the global fabless IC market?
  • What are the key market trends impacting the growth of the global fabless IC market?
  • What are the challenges to market growth?
  • Who are the key vendors in the global fabless IC market?
  • What are the market opportunities and threats faced by the vendors in the global fabless IC market?
  • What are the trending factors influencing the market shares of the Americas, APAC, and EMEA?
  • What are the key outcomes of the five forces analysis of the global fabless IC market?

Technavio also offers customization on reports based on specific client requirement.

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: MARKET SEGMENTATION BY APPLICATION

  • Segmentation by application
  • Comparison by application
  • Communication devices – Market size and forecast 2017-2022
  • Computing devices – Market size and forecast 2017-2022
  • Consumer electronic devices – Market size and forecast 2017-2022
  • Automobile components – Market size and forecast 2017-2022
  • Others – Market size and forecast 2017-2022
  • Market opportunity by application

PART 08: MARKET SEGMENTATION BY DEVICE TYPE

  • Segmentation by device type
  • Comparison by device type
  • Digital ICs – Market size and forecast 2017-2022
  • Analog ICs – Market size and forecast 2017-2022
  • Market opportunity by device type
  • Customer landscape

PART 09: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • APAC – Market size and forecast 2017-2022
  • Americas – Market size and forecast 2017-2022
  • EMEA – Market size and forecast 2017-2022
  • Key leading countries
  • China
  • Taiwan
  • US
  • South Korea
  • Japan
  • Market opportunity

PART 10: DECISION FRAMEWORK

PART 11: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 12: MARKET TRENDS

  • Increasing adoption of ICs to achieve interoperability among IoT devices
  • Growth of ICs in VR devices, drones, and robotics
  • Miniaturization of electronic devices
  • M&A in semiconductor market

PART 13: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 14: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Advanced Micro Devices
  • Apple
  • Broadcom
  • MediaTek
  • NVIDIA
  • Qualcomm Technologies

PART 15: APPENDIX

  • List of abbreviations

Research Framework

Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

TechnavioINFORMATION SOURCES

Primary sources

  • Manufacturers and suppliers
  • Channel partners
  • Industry experts
  • Strategic decision makers

Secondary sources

  • Industry journals and periodicals
  • Government data
  • Financial reports of key industry players
  • Historical data
  • Press releases
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TechnavioDATA ANALYSIS

Data Synthesis

  • Collation of data
  • Estimation of key figures
  • Analysis of derived insights

Data Validation

  • Triangulation with data models
  • Reference against proprietary databases
  • Corroboration with industry experts
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TechnavioREPORT WRITING

Qualitative

  • Market drivers
  • Market challenges
  • Market trends
  • Five forces analysis

Quantitative

  • Market size and forecast
  • Market segmentation
  • Geographical insights
  • Competitive landscape
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