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About Interconnect Device
Interconnect is an electrical connection that connects two or more devices. It derives its applications in the process and discrete industries by facilitating effective interconnection and smooth operations. With the increase in integration of IT and electronics in the process and discrete industries, there is a growing need of interconnects which can connect various devices in use and provide real-time information to the operators on shop-floor.
Technavio's global interconnect market forecast report predicts the market to grow at a CAGR of 8.68% over the period 2014-2019.
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See the complete table of contents and list of exhibits, as well as selected illustrations and example pages from this report.
Covered in this Report
The interconnect market analysis report includes the present scenario and the growth prospects of the global interconnect market for the period 2015-2019. The market can be segmented into two divisions: connectors and cable assemblies.
Technavio's interconnect market research report has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC, Europe, and North America; it also covers the landscape of the global interconnect market and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.
Key Regions
• APAC
• Europe
• North America
Key Vendors
• Amphenol
• Foxconn
• Molex
• TE Connectivity
• Yazaki
Other Prominent Vendors
• 3M
• Alstom SA
• Belden Incorporated
• Delphi
• JST
• Phoenix Contact
• Rosenberger
• Sumitomo Wiring Systems
Key Market Driver
• Increasing Demand for Bandwidth
• For a full, detailed list, view our report
Key Market Challenge
• Absence of Uniform Standard
• For a full, detailed list, view our report
Key Market Trend
• Real-time Data for Industrial Applications
• For a full, detailed list, view our report
Want to dial in on a specific region or segment? We can help! Our analysts can customize this market research report to meet your requirements. Get in touch
Key Questions Answered in this Report
• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
05. Introduction
06. Market Landscape
06.1 Market Overview
06.2 Market Size and Forecast
06.3 Five Forces Analysis
07. Geographical Segmentation
07.1 Global Interconnect Market by Geographical Segmentation 2014-2019
07.2 Interconnect Market in the APAC Region
07.2.1 Market Size and Forecast
07.3 Interconnect Market in the Europe
07.3.1 Market Size and Forecast
07.4 Interconnect Market in North America
07.4.1 Market Size and Forecast
07.5 Interconnect Market in RoW
07.5.1 Market Size and Forecast
08. Market Segmentation by Product
08.1 Global Interconnect Market by Product 2014-2019
08.2 Global Interconnect Market by Product: Cable Assembly
08.2.1 Market Size and Forecast
08.3 Global Interconnect Market by Product: Connector
08.3.1 Market Size and Forecast
09. Market Segmentation by End-users
09.1 Global Interconnect Market by End-users 2014-2019
09.2 Global Interconnect Market by End-user: Automotive
09.2.1 Market Size and Forecast
09.3 Global Interconnect Market by End-user: IT
09.3.1 Market Size and Forecast
09.4 Global Interconnect Market by End-user: Telecommunication
09.4.1 Market Size and Forecast
09.5 Global Interconnect Market by End-user: Industrial
09.5.1 Market Size and Forecast
09.6 Global Interconnect Market by End-user: Others
09.6.1 Market Size and Forecast
10. Buying Criteria
11. Market Growth Drivers
12. Drivers and their Impact
13. Market Challenges
14. Impact of Drivers and Challenges
15. Market Trends
16. Trends and their Impact
17. Vendor Landscape
17.1 Competitive Scenario
17.2 Other Prominent Vendors
18. Key Vendor Analysis
18.1 Amphenol
18.1.1 Key Facts
18.1.2 Business Overview
18.1.3 Business Segmentation by Revenue 2013
18.1.4 Products Segmentation by Revenue 2012 and 2013
18.1.5 Geographical Segmentation by Revenue 2013
18.1.6 Business Strategy
18.1.7 Recent Developments
18.1.8 SWOT Analysis
18.2 Hon Hai (Foxconn)
18.2.1 Key Facts
18.2.2 Business Overview
18.2.3 Geographical Segmentation by Revenue 2013
18.2.4 Recent Developments
18.2.5 SWOT Analysis
18.3 Molex
18.3.1 Key Facts
18.3.2 Business Overview
18.3.3 Market Segmentation by Revenue 2013
18.3.4 Product Segmentation by Revenue 2013
18.3.5 Product Segmentation by Revenue 2012 and 2013
18.3.6 Geographical Segmentation by Revenue 2013
18.3.7 Business Strategy
18.3.8 Recent Developments
18.3.9 SWOT Analysis
18.4 TE Connectivity
18.4.1 Key Facts
18.4.2 Business Overview
18.4.3 Business Segmentation by Revenue 2013
18.4.4 Business Segmentation by Revenue 2012 and 2013
18.4.5 Geographical Segmentation by Revenue 2013
18.4.6 Business Strategy
18.4.7 Recent Developments
18.4.8 SWOT Analysis
18.5 Yazaki
18.5.1 Key Facts
18.5.2 Business Overview
18.5.3 Key Offerings
18.5.4 Net Sales by 2012 and 2013
18.5.5 Geographical Segmentation by Revenue 2014
18.5.6 SWOT Analysis
19. Other Reports in this Series
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