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Global Organic Substrate Packaging Material Market 2015-2019

  • Published: Sep 2015
  • Pages: 67
  • SKU: IRTNTR6945
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Overview of the organic substrate packaging material market

Organic substrates are the foundation layers of individual semiconductor devices on which other layers are added to complete the circuit. They are surrounded by ultra-thin materials that have a dielectric base. The use of these substrates is gaining popularity as the semiconductor industry is moving towards packages that are wireless. Technavio’s study predicts the global organic substrate packaging material market to grow at a CAGR of around 5% through 2019.

Improvements in the packaging technologies along with development in semiconductors are driving the growth of the market. For instance, Mitsubishi Gas and Chemical introduced bismaleimide-triazine resin laminates, which are the typical material for BGA packages. The development of portable electronic devices has increased the demand for packaging materials as they advance the reliability of semiconductors. 

Segmentation of organic substrate packaging material market by packaging technology

  • SO packages
  • GA packages
  • Flat no-leads packages
  • QFP
  • DIP
  • Other technologies

Market segmentation by geography

On the basis of geography, the global automotive interiors material market can be classified as follows: -

  • Europe
  • North America
  • APAC
  • ROW

APAC is the dominant market in this segment with a market share of around 67%, with Taiwan leading the regional market. Apart from the growing smartphone and consumer electronics industry, the integration of the semiconductor fabrication and packaging industries between Taiwan and China are the key growth factors for the organic substrate packaging material market in the country.

North America has the second largest market share in the global organic substrate packaging material market and is expected to generate nearly $2 billion in revenue by the end of the forecast period. Europe, meanwhile, has been witnessing a slow growth in the market despite the presence of major semiconductor producing companies such as Philips, in the region.

Growth factors of the global organic substrate packaging material market

There is an increasing trend smaller, lightweight, and cost-effective electronic devices globally. This trend has driven innovation within the organic substrate packaging materials industry. Technologies such as SiP, PoP, and WLP are pushing the development of new solutions. For instance, a conductive bump soldered on top of the chip in flip-chip packaging ensures high system density and improved performance in a miniaturized package.

Vendor landscape of the global organic substrate packaging material market

The global organic substrate packaging material market is highly fragmented due to the presence of multinational, regional, and local vendors in the market. Local vendors are providing innovative and low-cost solutions through re-engineering processes, and this has created intense competition in the market. The increase in automated line production has also facilitated the growth of innovation in the market.

Some of the major vendors in the market are:

  • ASE Kaohsiung
  • AMKOR
  • SPIL
  • STATS ChipPAC
  • Mitsubishi
  • AJINOMOTO

Other sections of the report include an analysis of the following

  • Key drivers, challenges, and trends in the global organic substrate packaging material market
  • Five forces analysis of the organic substrate packaging material market
  • Key countries in the global organic substrate packaging material market
  • Detailed analysis of the key vendors in the market

Related reports

PART 01: Executive summary
Highlights
PART 02: Scope of the report
Market overview
Top-vendor offerings
PART 03: Market research methodology
Research methodology
Economic indicators
PART 04: Introduction
Key market highlights
PART 05: Market landscape
Market overview
Market size and forecast
Five forces analysis
PART 06: Market segmentation by packaging technology
Market segmentation by packaging technology
Global SO market
Global GA packages market
Global Flat No-leads packages market
Global QFP market
Global DIP market
Global other technologies market
PART 07: Geographical segmentation
Global organic substrate packaging material market by geography 2014-2019
Organic substrate packaging material market in APAC
Organic substrate packaging material market in Taiwan
Organic substrate packaging material market in Japan
Organic substrate packaging material market in South Korea
Organic substrate packaging material market in China
Organic substrate packaging material market in North America
Organic substrate packaging material market in Europe
PART 08: Key leading countries
Taiwan
South Korea
China
PART 09: Market drivers
Growth drivers
PART 10: Impact of drivers
PART 11: Market challenges
Market restraints
PART 12: Impact of drivers and challenges
PART 13: Market trends
Emerging trends
PART 14: Vendor landscape
Competitive Scenario
Key market vendors 2014
PART 15: Key vendor analysis
Ajinomoto
Amkor Technology
ASE Kaohsiung
Mitsubishi Gas Chemical Company
SPIL
STATS ChipPAC
PART 16: Appendix
List of abbreviation

Research Framework

Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

TechnavioINFORMATION SOURCES

Primary sources

  • Manufacturers and suppliers
  • Channel partners
  • Industry experts
  • Strategic decision makers

Secondary sources

  • Industry journals and periodicals
  • Government data
  • Financial reports of key industry players
  • Historical data
  • Press releases
Technavio

TechnavioDATA ANALYSIS

Data Synthesis

  • Collation of data
  • Estimation of key figures
  • Analysis of derived insights

Data Validation

  • Triangulation with data models
  • Reference against proprietary databases
  • Corroboration with industry experts
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TechnavioREPORT WRITING

Qualitative

  • Market drivers
  • Market challenges
  • Market trends
  • Five forces analysis

Quantitative

  • Market size and forecast
  • Market segmentation
  • Geographical insights
  • Competitive landscape
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