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Global Anti-static Packaging Market 2016-2020

  • Published: Oct 2016
  • Pages: 76
  • SKU: IRTNTR10578
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This industry research report identifies 3M, BASF, and Dow Chemical as the key vendors in the global anti-static packaging market. This industry research report also presents a competitive analysis of the market by end-users (communication network infrastructure, consumer electronics, computer peripherals, aerospace and defense, health and instrumentation, automotive, and others) and by geography (the Americas, APAC, and EMEA).

Overview of the global anti-static packaging market

Market research analysts at Technavio predict that the global anti-static packaging market will grow steadily during the next four years and post a CAGR of more than 8% by 2020. This market research analysis identifies the increasing miniaturization of electronic devices as one of the primary growth factors for this market. An increase in the demand for mobility in electronic devices has resulted in the adoption of smaller devices, which in turn, led to the miniaturization of semiconductor ICs. The adoption of advanced technologies such as 3D ICs and micro-electromechanical systems (MEMS) will help in the development of miniaturized and user-friendly electronic devices. These compact electronic devices require smaller and densely-built semiconductors and ICs. Since dense PCBs have more chances of tribocharging, there will be a rising demand for anti-static packaging products.

Focusing on improving the quality of life using technology and efficient services, governments around the globe are increasingly concentrating on the development of smart cities. Smart cities use sensors to monitor and control different aspects such as irrigation systems, bus networks, traffic conditions, and the brightness of public lighting systems. This will increase the demand for anti-static devices and in turn, will drive the demand for anti-static wrapping material.

Competitive landscape and key vendors

Due to the presence of various regional and small vendors, the market appears to be fragmented. The presence of most of the anti-static packaging material vendors is limited to certain geographies. The competitive environment in the market is quite intense and vendors have started following M&A strategies to sustain market competition. Major vendors follow M&A to expand their global reach both in the developed countries and the developing regions. Established vendors are currently developing and offering anti-static packaging materials for the rising middle class population in the developing economies and are strengthening their reach by acquiring reputed regional vendors.

The leading vendors in the market are -

  • 3M
  • BASF
  • Dow Chemical

The other prominent vendors in the market are DaklaPack, Desco Industries, Dou Yee, GWP, Kao-Chia Plastics, Miller Supply, Polyplus Packaging, TIP Corporation, and Uline.

Segmentation by end-users and analysis of the anti-static packaging market

  • Aerospace and defense
  • Automotive
  • Communication network infrastructure
  • Consumer electronics
  • Computer peripherals
  • Health and instrumentation

Due to the high deployment of next-generation wireless networks such as Wi-Fi, WiMAX, 3G/4G, and ultra-wideband, the communication and network infrastructure segment accounted for the major market shares and dominated this industry, during 2015. Since wireless networks use high-performance PCBs for broadcasting networks that require anti-static packaging, the estimated growth of the wireless network infrastructure will propel the market’s growth prospects.

Geographical segmentation and analysis of the anti-static packaging market

  • Americas
  • APAC
  • EMEA

This market study estimates that in terms of geographical regions, APAC will be the major revenue contributors to the market throughout the forecast period. The growth of the market will be mainly driven by the growing demand for smartphones and the development of the communication network infrastructure. The availability of low-cost labor and raw materials have attracted several companies to start manufacturing units for electronic goods that require anti-static packaging. Moreover, the presence of major semiconductor producing countries such as Taiwan, China, Japan, and South Korea that are the production houses for major electronics manufacturers like Samsung Electronics, SK Hynix, and Toshiba will fuel the growth of the market.

Key questions answered in the report include

  • What will the market size and the growth rate be in 2020?
  • What are the key factors driving the global anti-static packaging market?
  • What are the key market trends impacting the growth of the global anti-static packaging market?
  • What are the challenges to market growth?
  • Who are the key vendors in the global anti-static packaging market?
  • What are the market opportunities and threats faced by the vendors in the global anti-static packaging market?
  • Trending factors influencing the market shares of the Americas, APAC, and EMEA.
  • What are the key outcomes of the five forces analysis of the global anti-static packaging market?

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Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by end-user

  • Global anti-static packaging market by end-user
  • Global anti-static packaging market by communication network infrastructure
  • Global anti-static packaging market by consumer electronics industry
  • Global anti-static packaging market by computer peripherals
  • Global anti-static packaging market by aerospace and defense industry
  • Global anti-static packaging market by healthcare and instrumentation industry
  • Global anti-static packaging market by automotive industry
  • Global anti-static packaging market by other industries

PART 07: Geographical segmentation

  • Global anti-static packaging market by geography
  • Anti-static packaging market in APAC
  • Anti-static packaging market in Americas
  • Anti-static packaging market in EMEA

PART 08: Key leading countries

PART 09: Market drivers

PART 10: Impact of drivers

PART 11: Market challenges

PART 12: Impact of drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape

  • Competitive Scenario
  • 3M
  • BASF
  • Dow Chemical
  • Other prominent vendors

PART 15: Appendix

  • List of abbreviations

PART 16: Explore Technavio

Research Framework

Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

TechnavioINFORMATION SOURCES

Primary sources

  • Manufacturers and suppliers
  • Channel partners
  • Industry experts
  • Strategic decision makers

Secondary sources

  • Industry journals and periodicals
  • Government data
  • Financial reports of key industry players
  • Historical data
  • Press releases
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TechnavioDATA ANALYSIS

Data Synthesis

  • Collation of data
  • Estimation of key figures
  • Analysis of derived insights

Data Validation

  • Triangulation with data models
  • Reference against proprietary databases
  • Corroboration with industry experts
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TechnavioREPORT WRITING

Qualitative

  • Market drivers
  • Market challenges
  • Market trends
  • Five forces analysis

Quantitative

  • Market size and forecast
  • Market segmentation
  • Geographical insights
  • Competitive landscape
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