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Market research analysts at Technavio predict that the global anti-static packaging market will grow steadily during the next four years and post a CAGR of more than 8% by 2020. This market research analysis identifies the increasing miniaturization of electronic devices as one of the primary growth factors for this market. An increase in the demand for mobility in electronic devices has resulted in the adoption of smaller devices, which in turn, led to the miniaturization of semiconductor ICs. The adoption of advanced technologies such as 3D ICs and micro-electromechanical systems (MEMS) will help in the development of miniaturized and user-friendly electronic devices. These compact electronic devices require smaller and densely-built semiconductors and ICs. Since dense PCBs have more chances of tribocharging, there will be a rising demand for anti-static packaging products.
Focusing on improving the quality of life using technology and efficient services, governments around the globe are increasingly concentrating on the development of smart cities. Smart cities use sensors to monitor and control different aspects such as irrigation systems, bus networks, traffic conditions, and the brightness of public lighting systems. This will increase the demand for anti-static devices and in turn, will drive the demand for anti-static wrapping material.
Due to the presence of various regional and small vendors, the market appears to be fragmented. The presence of most of the anti-static packaging material vendors is limited to certain geographies. The competitive environment in the market is quite intense and vendors have started following M&A strategies to sustain market competition. Major vendors follow M&A to expand their global reach both in the developed countries and the developing regions. Established vendors are currently developing and offering anti-static packaging materials for the rising middle class population in the developing economies and are strengthening their reach by acquiring reputed regional vendors.
The leading vendors in the market are -
The other prominent vendors in the market are DaklaPack, Desco Industries, Dou Yee, GWP, Kao-Chia Plastics, Miller Supply, Polyplus Packaging, TIP Corporation, and Uline.
Due to the high deployment of next-generation wireless networks such as Wi-Fi, WiMAX, 3G/4G, and ultra-wideband, the communication and network infrastructure segment accounted for the major market shares and dominated this industry, during 2015. Since wireless networks use high-performance PCBs for broadcasting networks that require anti-static packaging, the estimated growth of the wireless network infrastructure will propel the market’s growth prospects.
This market study estimates that in terms of geographical regions, APAC will be the major revenue contributors to the market throughout the forecast period. The growth of the market will be mainly driven by the growing demand for smartphones and the development of the communication network infrastructure. The availability of low-cost labor and raw materials have attracted several companies to start manufacturing units for electronic goods that require anti-static packaging. Moreover, the presence of major semiconductor producing countries such as Taiwan, China, Japan, and South Korea that are the production houses for major electronics manufacturers like Samsung Electronics, SK Hynix, and Toshiba will fuel the growth of the market.
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PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
PART 05: Market landscape
PART 06: Market segmentation by end-user
PART 07: Geographical segmentation
PART 08: Key leading countries
PART 09: Market drivers
PART 10: Impact of drivers
PART 11: Market challenges
PART 12: Impact of drivers and challenges
PART 13: Market trends
PART 14: Vendor landscape
PART 15: Appendix
PART 16: Explore Technavio
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