Global Bonding Wire Packaging Material Market 2016-2020
- Published: Jun 2016
- Pages: 58
- SKU: IRTNTR9278
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This market research report presents a detailed segmentation of the global bonding wire packaging material market by material type (gold, palladium-coated copper (PCC), copper, and silver) and by geography (APAC, Europe, North America, and ROW). The leading vendors in this market are TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, and MK Electron.
Overview of the global bonding wire packaging material market
Technavio’s market research analyst predicts that the global bonding wire packaging material market will generate a revenue of close to USD 3 billion by the end of 2020. One of the primary growth drivers for this market is the increased need for miniaturization, especially in the semiconductor industry. Bonding wires are an important part of assemblies, and metals like copper, aluminum, gold, and palladium are extensively used to produce bonding wires. In this market, the vendors need to constantly upgrade their offerings with more advanced and compact packaging materials as it will help them to cater to the consumer’s requirements. The demand for bonding wires has increased significantly owing to the growing need for miniaturization to meet the packaging requirements of the semiconductor industry.
An important trend that is spurring market growth is the extensive use of silver as an alternative material. Since the semiconductor industry is under constant pressure to introduce low-cost alternatives to gold without compromising on the quality, the use of silver as a bonding wire has been gaining traction during the forecast period. The silver bonding wire offers the same product quality and does not require significant investments in high-end bonding equipment. Silver wire became a viable option after its use in LED packaging and memory devices. The affordability of silver bonding wire will make it a preferred material in the semiconductor industry during the estimated period.
Segmentation by material type and analysis of the bonding wire packaging material market
- Gold
- Palladium-coated copper (PCC)
- Copper
- Silver
The PCC segment will dominate the bonding wire packaging material market and will grow at a CAGR of over 2% by the end of the forecast period. The use of PCC as an alternative material has been gaining traction due to the rising gold prices globally. Since these PCC-coated wires are resistant to corrosion and oxidation, they will replace gold wires as a packaging material during the next few years.
Geographical segmentation of the bonding wire packaging material market
- APAC
- Europe
- North America
- ROW
The APAC region dominated the global bonding wire packaging material market in 2015 and accounted for approximately 89% of the total market share. The presence of major semiconductor manufacturing giants like Samsung, LG, SK Hynix, MediaTek, Toshiba, and ROHM in this region will lead to the growth of this market in APAC. In addition, factors like recent technological advances and the use of alternative metals for packaging will also play a crucial role in fostering market growth through the end of 2020.
Competitive landscape and key vendors
The global bonding wire packaging material market is dominated by the four key suppliers. Most of the suppliers in this market offer very similar products, where the sole distinguishing factor is the type of alloy used. The chances for new players and startups entering and flourishing in this market are very high as the market is trending towards the adoption of flip chips.
Key vendors in this market are -
- TANAKA Precious Metals
- Heraeus Deutschland
- California Fine Wire
- MK Electron
Other prominent vendors in this market are AMETEK, EMMTECH, Inseto, Palomar Technologies, SHINKAWA, Sumitomo Metal Mining, and Tatsuta Electric Wire & Cable.
Key questions answered in the report include
- What will the market size and the growth rate be in 2020?
- What are the key factors driving the global bonding wire packaging material market?
- What are the key market trends impacting the growth of the global bonding wire packaging material market?
- What are the challenges to market growth?
- Who are the key vendors in the global bonding wire packaging material market?
- What are the market opportunities and threats faced by the vendors in the global bonding wire packaging material market?
- Trending factors influencing the market shares of APAC, Europe, North America, and ROW.
- What are the key outcomes of the five forces analysis of the global bonding wire packaging material market?
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Table of Content
PART 01: Executive summary
- Highlights
PART 02: Scope of the report
- Definition
- Source year and forecast period
- Market coverage
- Market size computation
- Market segmentation
- Geographical coverage
- Vendor segmentation
- Common currency conversion rates
- Top vendor offerings
PART 03: Market research methodology
- Research methodology
- Economic indicators
PART 04: Introduction
- Key market highlights
PART 05: Market landscape
- Global semiconductor market overview
- Wafer-level manufacturing equipment categories
- Market overview
- Market size and forecast
- Five forces analysis
PART 06: Market segmentation by material type
- Global bonding wire packaging material market by material type 2015
- Global bonding wire packaging material market by material type 2020
- Global bonding wire packaging material market by gold
- Global bonding wire packaging material market by PCC
- Global bonding wire packaging material market by copper
- Global bonding wire packaging material market by silver
PART 07: Geographical segmentation
- Global bonding wire packaging material market by geography 2015
- Global bonding wire packaging material market by geography 2020
- APAC
- North America
- Europe
- ROW
PART 08: Key leading countries
- Key leading countries in global bonding wire packaging material market
PART 09: Summary of key figures
PART 10: Market drivers
- Growing transition to copper wire
- Rising need for miniaturized semiconductor devices
PART 11: Impact of drivers
PART 12: Market challenges
- Limitations of copper wire
- Migration to flip chip packaging technology
PART 13: Impact of drivers and challenges
PART 14: Market trends
- Silver bonding wire as upcoming alternative
- Migration to smaller diameter wires
PART 15: Vendor landscape
- Competitive scenario
- Other prominent vendors
PART 16: Appendix
- List of abbreviations
PART 17: Explore Technavio
Research Framework
Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.
INFORMATION SOURCES
Primary sources
- Manufacturers and suppliers
- Channel partners
- Industry experts
- Strategic decision makers
Secondary sources
- Industry journals and periodicals
- Government data
- Financial reports of key industry players
- Historical data
- Press releases

DATA ANALYSIS
Data Synthesis
- Collation of data
- Estimation of key figures
- Analysis of derived insights
Data Validation
- Triangulation with data models
- Reference against proprietary databases
- Corroboration with industry experts

REPORT WRITING
Qualitative
- Market drivers
- Market challenges
- Market trends
- Five forces analysis
Quantitative
- Market size and forecast
- Market segmentation
- Geographical insights
- Competitive landscape
Key Questions Answered
- What are the key global market and the regional market share?
- What are the revenue-generating key market segments?
- What are the key factors driving and challenging this market’s growth?
- Who are the key market vendors and their growth strategies?
- What are the latest trends influencing the growth of this market?
- What are the variables influencing the market growth in the primary regions?
- What are the factors influencing the growth of the parent market?
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