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Market research analysts at Technavio have predicted that the global light emitting diode (LED) packaging equipment market will grow steadily at a CAGR of almost 2% by 2020. Features such as energy efficiency, light weight, high power, and small size have induced automobile manufacturers to replace halogen lights with LEDs. Due to the long lifespan, less amount of energy consumption, and the comparatively low light temperature of LED headlamps, automobile manufacturers have started using LEDs in both interior and exterior lighting applications. Technological advances in automobiles and the increase in production capacity of automobile manufacturers will drive the automotive lighting market in the coming years, which in turn will aid in the growth of the LED packaging equipment market.
This market research and analysis considers the emergence of COB (chip on board) technology as one of the major trends that will gain traction in this market during the forecast period. Benefits such as the capability to spread light across a large area, effective thermal management, homogenous luminosity, energy efficiency, and compactness will ensure the increased adoption of the COB LEDs will require the adoption of new and advanced LED packaging processes, which will demand the replacement of older packaging equipment.
The market is characterized by the presence of large and small scale LED packaging equipment manufacturers. The market is dominated by a few major players and vendor competition in the market is moderate. Vendors have the need to comply with constant technological advances and usually compete on the basis of price, reputation, distribution, and global brand presence. The emergence of diversified regional and local vendors will intensify vendor competition in the market in the next four years.
The leading vendors in the market are -
The other prominent vendors in the market are Daitron, DISCO, Nordson ASYMTEK, and SUSS MicroTec.
During 2015, the LED testing segment accounted for about 60% of the total share and dominated the LED packaging equipment market. LED testing is required throughout the LED packaging process, and the testing equipment is used for the inspection and qualification of incoming materials, process monitoring and control, and testing end-of-line product. The estimated increase in the demand for LEDs will subsequently increase the demand for this market segment in the coming years.
This market study estimates that APAC will account for about 88% of the LED packaging equipment market by 2020 and dominate this market throughout the during the forecast period. The exponential rise in demand for consumer electronics coupled with the rollout of long-term evolution (LTE) bandwidths in APAC countries such as India and China, has led to the expansion of LTE base station infrastructure. This will drive the market for display panels that use LEDs as the backlighting source of the screen. Additionally, the presence of major LED display lighting panel manufacturers in this region will also contribute to the growth of the market in the next four years.
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PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
PART 05: Industry landscape
PART 06: Market landscape
PART 07: Market segmentation by process
PART 08: Geographical segmentation
PART 09: Market drivers
PART 10: Impact of drivers
PART 11: Market challenges
PART 12: Impact of drivers and challenges
PART 13: Market trends
PART 14: Vendor landscape
PART 15: Summary of key figures
PART 16: Appendix
PART 17: Explore Technavio
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