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The molded interconnect device (MID) market share is expected to increase by USD 862.93 million from 2019 to 2024, and the market’s growth momentum will accelerate at a CAGR of 12%.
The market research report provides valuable insights into the post-COVID-19 impact on the market, which will help companies evaluate their business approaches. Furthermore, this report extensively covers market segmentation by market landscape (two-shot molding, LDS, and others) and geography (APAC, North America, Europe, and South America).
The molded interconnect device (MID) market report also offers information on several market vendors, including 2E mechatronic GmbH & Co. KG, Arlington Plating Co., Cicor Technologies Ltd., HARTING Technology Group, JOHNAN Corp., LPKF Laser & Electronics AG, MID Solutions GmbH, Multiple Dimensions AG, S2P smart plastic product, and TactoTek Oy. among others.
2E mechatronic GmbH & Co. KG - The company offers MIDs manufactured by LDS, hot-embossing, and 2-component injection molding processes. Under the unified business segment, the company offers a wide range of products such as DIN connectors, high-precision injection molded housing for ESP, housing for side airbags, capacitive inclination sensors, and MID diodes for the automotive industry, medical technology, industrial electronics, and automation.
What will the Molded Interconnect Device (MID) Market Size be During the Forecast Period?
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Parent Market Analysis
Our research report extensively covers external factors influencing the parent market growth potential in the coming years, which will determine the levels of growth of the market during the forecast period.
Molded Interconnect Device (MID) Market: Key Drivers, Trends, and Challenges
Based on our research output, there has been a negative impact on the market growth during and post-COVID-19 era. The demand for consumer electronic devices is notably driving the market growth, although factors such as may impede the market growth. Our researchers analyzed the data with 2022 as the base year, along with the key drivers, trends, and challenges. A holistic analysis of drivers will help companies refine their marketing strategies to gain a competitive advantage.
Key Molded Interconnect Device (MID) Market Challenge
- The high production cost of MIDs will be a major challenge for the market during the forecast period.
- MIDs were developed in the 1980s; however, their demand did not pick up due to high tooling costs. During recent years, the demand for MIDs has increased owing to the growing emphasis on the miniaturization of electrical devices and machines. However, the global MID market still faces the challenges that it faced during the 1980s.
- Factors such as high tooling cost, high raw material cost, and high-volume manufacturing threshold to attain profitability among the vendors still act as barriers to the growth of the global MID market.
- MIDs do not have a standard manufacturing process defined due to which the production costs are high and vary based on the production techniques employed. In addition, for the vendors to maintain profitability, economies of scale is a critical criterion.
This market analysis report also provides detailed information on other upcoming trends and challenges that will have a far-reaching effect on the market growth. The actionable insights on the trends and challenges will help companies evaluate and develop growth strategies for 2020-2024.
Molded Interconnect Device (MID) Market Value Chain Analysis
Our In-house experts produce extensive information on the value chain and parent market of the molded interconnect device (MID) market, which vendors can leverage to gain a competitive advantage during the forecast period. The Value Chain information provides an end-to-end understanding of product insight and profit and also optimization and evaluation of business strategies. The players across the value chain include selective data and analysis from entire research findings as per the scope of the report.
Which are the Key Regions for Molded Interconnect Device (MID) Market?
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48% of the market’s growth will originate from APAC during the forecast period. China, Japan, India, and South Korea (Republic of Korea) are the key markets for molded interconnect devices (MID) in APAC. Market growth in this region will be faster than the growth of the market in other regions. This market research report entails detailed information on the competitive intelligence, marketing gaps, and regional opportunities in store for vendors, which will assist in creating efficient business plans.
What is the Fastest-Growing Market Landscape Segment in the Molded Interconnect Device (MID) Market?
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The market share growth by the two-shot molding segment will be significant during the forecast period. This report provides an accurate prediction of the contribution of all the segments to the growth of the market size and actionable market insights on the post-COVID-19 impact on each segment.
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Molded Interconnect Device (MID) Market Scope |
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Report Coverage |
Details |
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Page number |
120 |
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Base year |
2019 |
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Forecast period |
2020-2024 |
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Growth momentum & CAGR |
Accelerate at a CAGR of 12% |
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Market growth 2020-2024 |
$ 862.93 million |
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Market structure |
Fragmented |
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YoY growth (%) |
9.90 |
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Regional analysis |
APAC, North America, Europe, and South America |
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Performing market contribution |
APAC at 48% |
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Key countries |
China, US, Japan, Germany, India, and South Korea (Republic of Korea) |
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Competitive landscape |
Leading companies, Competitive Strategies, Consumer engagement scope |
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Key companies profiled |
2E mechatronic GmbH & Co. KG, Arlington Plating Co., Cicor Technologies Ltd., HARTING Technology Group, JOHNAN Corp., LPKF Laser & Electronics AG, MID Solutions GmbH, Multiple Dimensions AG, S2P smart plastic product, and and TactoTek Oy. |
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Market dynamics |
Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for the forecast period |
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Customization purview |
If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized. |
What are the Key Data Covered in this Molded Interconnect Device (MID) Market Report?
- CAGR of the market during the forecast period
- Detailed information on factors that will drive market growth during the next five years
- Precise estimation of the market size and its contribution to the parent market
- Accurate predictions on upcoming trends and changes in consumer behaviour
- The growth of the market industry across APAC, North America, Europe, and South America
- A thorough analysis of the market’s competitive landscape and detailed information on vendors
- Comprehensive analysis of factors that will challenge the growth of market vendors
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