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Semiconductor Packaging and Assembly Equipment Market by Type and Geography - Forecast and Analysis 2021-2025

  • Published: Sep 2021
  • Pages: 120
  • SKU: IRTNTR70949
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The semiconductor packaging and assembly equipment market has the potential to grow by USD 1.91 billion during 2021-2025, and the market’s growth momentum will accelerate at a CAGR of 8.47%.

This semiconductor packaging and assembly equipment market research report provides valuable insights on the post COVID-19 impact on the market, which will help companies evaluate their business approaches. Furthermore, this report extensively covers market segmentation by type (wafer-level packaging and assembly equipment and die-level packaging and assembly equipment) and geography (APAC, North America, Europe, South America, and MEA). The semiconductor packaging and assembly equipment market report also offers information on several market vendors, including Amkor Technology Inc., Applied Materials Inc., ASM Pacific Technology Ltd., ChipMOS TECHNOLOGIES Inc., EV Group, JCET Group Co. Ltd., Kulicke and Soffa Industries Inc., Powertech Technology Inc., Tokyo Electron Ltd., and Tokyo Seimitsu Co. Ltd. among others.

What will the Semiconductor Packaging and Assembly Equipment Market Size be in 2021?

Semiconductor-Packaging-And-Assembly-Equipment-Market-Market-Size-2020-2025

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Semiconductor Packaging and Assembly Equipment Market: Key Drivers and Trends

The development of 3D chip packaging is notably driving the semiconductor packaging and assembly equipment market growth, although factors such as increasing complexity of semiconductor IC designs may impede market growth. Our research analysts have studied the historical data and deduced the key market drivers and the COVID-19 pandemic impact on the semiconductor packaging and assembly equipment industry. The holistic analysis of the drivers will help in predicting end goals and refining marketing strategies to gain a competitive edge.

This semiconductor packaging and assembly equipment market analysis report also provides detailed information on other upcoming trends and challenges that will have a far-reaching effect on the market growth. The actionable insights on the trends and challenges will help companies evaluate and develop growth strategies for 2021-2025.

Who are the Major Semiconductor Packaging and Assembly Equipment Market Vendors?

The report analyzes the market’s competitive landscape and offers information on several market vendors, including:

 

  • Amkor Technology Inc.
  • Applied Materials Inc.
  • ASM Pacific Technology Ltd.
  • ChipMOS TECHNOLOGIES Inc.
  • EV Group
  • JCET Group Co. Ltd.
  • Kulicke and Soffa Industries Inc.
  • Powertech Technology Inc.
  • Tokyo Electron Ltd.
  • Tokyo Seimitsu Co. Ltd.

 

The vendor landscape of the semiconductor packaging and assembly equipment market entails successful business strategies deployed by the vendors. The semiconductor packaging and assembly equipment market is fragmented and the vendors are deploying various organic and inorganic growth strategies to compete in the market. 

To make the most of the opportunities and recover from post COVID-19 impact, market vendors should focus more on the growth prospects in the fast-growing segments, while maintaining their positions in the slow-growing segments.

Download a free sample of the semiconductor packaging and assembly equipment market forecast report for insights on complete key vendor profiles. The profiles include information on the production, sustainability, and prospects of the leading companies. 

Which are the Key Regions for Semiconductor Packaging and Assembly Equipment Market?

Semiconductor-Packaging-And-Assembly-Equipment-Market-Market-Share-by-Region-2020-2025

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89% of the market’s growth will originate from APAC during the forecast period. Taiwan, China, South Korea (Republic of Korea), and Japan are the key markets for semiconductor packaging and assembly equipment in APAC. 

The report offers an up-to-date analysis of the geographical composition of the market. APAC has been recording a significant growth rate and is expected to offer several growth opportunities to market vendors during the forecast period. The increase in the number of fabless semiconductor companies will facilitate the semiconductor packaging and assembly equipment market growth in APAC over the forecast period. The report offers an up-to-date analysis of the geographical composition of the market, competitive intelligence, and regional opportunities in store for vendors.

What are the Revenue-generating Type Segments in the Semiconductor Packaging and Assembly Equipment Market?

Semiconductor-Packaging-And-Assembly-Equipment-Market-Market-Share-by-Type-2020-2025

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The semiconductor packaging and assembly equipment market share growth by the wafer-level packaging and assembly equipment segment has been significant. This report provides insights on the impact of the unprecedented outbreak of COVID-19 on market segments. Through these insights, you can safely deduce transformation patterns in consumer behavior, which is crucial to gauge segment-wise revenue growth during 2021-2025 and embrace technologies to improve business efficiency.

This report provides an accurate prediction of the contribution of all the segments to the growth of the semiconductor packaging and assembly equipment market size. Furthermore, our analysts have indicated actionable market insights on post COVID-19 impact on each segment, which is crucial to predict change in consumer demand.

 

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What are the Key Factors Covered in this Semiconductor Packaging and Assembly Equipment Market Report?

  • CAGR of the market during the forecast period 2021-2025
  • Detailed information on factors that will drive semiconductor packaging and assembly equipment market growth during the next five years
  • Precise estimation of the semiconductor packaging and assembly equipment market size and its contribution to the parent market
  • Accurate predictions on upcoming trends and changes in consumer behavior
  • The growth of the semiconductor packaging and assembly equipment market across APAC, North America, Europe, South America, and MEA 
  • A thorough analysis of the market’s competitive landscape and detailed information on vendors
  • Comprehensive details of factors that will challenge the growth of semiconductor packaging and assembly equipment market vendors

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Semiconductor Packaging And Assembly Equipment Market Scope

Report Coverage

Details

Page number

120

Base year

2020

Forecast period

2021-2025

Growth momentum & CAGR

Accelerate at a CAGR of 8.47%

Market growth 2021-2025

$ 1.91 billion

Market structure

Fragmented

YoY growth (%)

7.65

Regional analysis

APAC, North America, Europe, South America, and MEA

Performing market contribution

APAC at 89%

Key consumer countries

Taiwan, China, South Korea (Republic of Korea), Japan, and US

Competitive landscape

Leading companies, competitive strategies, consumer engagement scope

Companies profiled

Amkor Technology Inc., Applied Materials Inc., ASM Pacific Technology Ltd., ChipMOS TECHNOLOGIES Inc., EV Group, JCET Group Co. Ltd., Kulicke and Soffa Industries Inc., Powertech Technology Inc., Tokyo Electron Ltd., and Tokyo Seimitsu Co. Ltd.

Market Dynamics

Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID 19 impact and future consumer dynamics, market condition analysis for forecast period,

Customization purview

If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.

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Executive Summary

    Market Landscape

    • Market ecosystem
    • Value chain analysis

    Market Sizing

    • Market definition
    • Market segment analysis
    • Market size 2020
    • Market outlook: Forecast for 2020 - 2025

    Five Forces Analysis

    • Bargaining power of buyers
    • Bargaining power of suppliers
    • Threat of new entrants
    • Threat of substitutes
    • Threat of rivalry
    • Market condition

    Market Segmentation by Type

    • Market segments
    • Comparison by Type
    • Wafer-level packaging and assembly equipment - Market size and forecast 2020-2025
    • Die-level packaging and assembly equipment - Market size and forecast 2020-2025
    • Market opportunity by Type

    Customer landscape

      Geographic Landscape

      • Geographic segmentation
      • Geographic comparison
      • APAC - Market size and forecast 2020-2025
      • North America - Market size and forecast 2020-2025
      • Europe - Market size and forecast 2020-2025
      • South America - Market size and forecast 2020-2025
      • MEA - Market size and forecast 2020-2025
      • Key leading countries
      • Market opportunity by geography
      • Market drivers
      • Market challenges
      • Market trends

      Vendor Landscape

      • Overview
      • Landscape disruption

      Vendor Analysis

      • Vendors covered
      • Market positioning of vendors
      • Amkor Technology Inc.
      • Applied Materials Inc.
      • ASM Pacific Technology Ltd.
      • ChipMOS TECHNOLOGIES Inc.
      • EV Group
      • JCET Group Co. Ltd.
      • Kulicke and Soffa Industries Inc.
      • Powertech Technology Inc.
      • Tokyo Electron Ltd.
      • Tokyo Seimitsu Co. Ltd.

      Appendix

      • Scope of the report
      • Currency conversion rates for US$
      • Research methodology
      • List of abbreviations

      Research Framework

      Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

      TechnavioINFORMATION SOURCES

      Primary sources

      • Manufacturers and suppliers
      • Channel partners
      • Industry experts
      • Strategic decision makers

      Secondary sources

      • Industry journals and periodicals
      • Government data
      • Financial reports of key industry players
      • Historical data
      • Press releases
      Technavio

      TechnavioDATA ANALYSIS

      Data Synthesis

      • Collation of data
      • Estimation of key figures
      • Analysis of derived insights

      Data Validation

      • Triangulation with data models
      • Reference against proprietary databases
      • Corroboration with industry experts
      Technavio

      TechnavioREPORT WRITING

      Qualitative

      • Market drivers
      • Market challenges
      • Market trends
      • Five forces analysis

      Quantitative

      • Market size and forecast
      • Market segmentation
      • Geographical insights
      • Competitive landscape
      Interested in this report?
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      The semiconductor packaging and assembly equipment market growth will increase by $1907.18 million during 2020-2025.
      The semiconductor packaging and assembly equipment market is expected to grow at a CAGR of 8.47% during 2020-2025.
      Technavio has segmented the semiconductor packaging and assembly equipment market by type (Wafer-level packaging and assembly equipment and Die-level packaging and assembly equipment) and geographic (APAC, North America, Europe, South America, and MEA).
      Amkor Technology Inc., Applied Materials Inc., ASM Pacific Technology Ltd., ChipMOS TECHNOLOGIES Inc., EV Group, JCET Group Co. Ltd., Kulicke and Soffa Industries Inc., Powertech Technology Inc., Tokyo Electron Ltd., Tokyo Seimitsu Co. Ltd. are a few of the key vendors in the semiconductor packaging and assembly equipment market.
      APAC will register the highest growth rate of 88.63% among the other regions. Therefore, the semiconductor packaging and assembly equipment market in APAC is expected to garner significant business opportunities for the vendors during the forecast period.
      • Taiwan
      • China
      • South Korea (Republic of Korea)
      • Japan
      • US
      The key factors driving the semiconductor packaging and assembly equipment market growth are:
      • Development of 3D chip packaging
      The semiconductor packaging and assembly equipment market vendors should focus on grabbing business opportunities from the wafer-level packaging and assembly equipment segment as it accounted for the largest market share in the base year.
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