Fan-out Wafer Level Packaging Market by Technology and Geography - Forecast and Analysis 2021-2025

  • Published: Aug 2021
  • Pages: 120
  • SKU: IRTNTR41471
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The fan-out wafer level packaging (FOWLP) market has the potential to grow by USD 1.60 billion during 2021-2025, and the market’s growth momentum will decelerate at a CAGR of 14.29%.

This fan-out wafer level packaging market research report provides valuable insights on the post COVID-19 impact on the market, which will help companies evaluate their business approaches. Furthermore, this report extensively covers market segmentation by technology (high density and standard density) and geography (APAC, North America, Europe, South America, and MEA). The fan-out wafer level packaging market report also offers information on several market vendors, including Amkor Technology Inc., ASE Technology Holding Co. Ltd., Cypress Semiconductor Corp., Infineon Technologies AG, JCET Group Co. Ltd., NXP Semiconductors NV, Renesas Electronics Corp., Samsung Electronics Co. Ltd., Siliconware Precision Industries Co. Ltd., and Taiwan Semiconductor Manufacturing Co. Ltd. among others.

What will the Fan-out Wafer Level Packaging Market Size be in 2021?

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Fan-out Wafer Level Packaging Market: Key Drivers and Trends

Based on our research output, there has been a negative impact on the market growth during and post COVID-19 era. The increased demand for compactly designed electronics is notably driving the fan-out wafer level packaging market growth, although factors such as increased production costs because of warpage may impede market growth. To unlock information on the key market drivers and the COVID-19 pandemic impact on the fan-out wafer level packaging industry get your FREE report sample now.

  • The increased demand for compactly designed electronics will fuel the growth of the fan-out wafer level packaging market size.
  • The integration of HMI technologies, developments in wireless communication technologies, and the development of telecommunication standards are some of the major reasons that are driving the demand for miniaturized semiconductor components.
  • Semiconductor packaging companies are finding new packaging technologies to reduce the overall size of the packaged ICs. This has resulted in an increase in demand for FOWLP technology in applications that require high power (as these packages provide better thermal management) as well as those that demand extreme miniaturization.
  • This technology allows the fabrication and testing at the wafer level, thereby reducing the cost of packaging and testing the solutions and driving the FOWLP market.
  • The growing use of semiconductor ICs in IoT will drive the fan-out wafer level packaging market growth.
  • The demand for IoT devices is primarily driven by the developments in wired and wireless communication technologies, telecommunication standards such as 3G/4G/5G, and government initiatives on implementing energy-efficient systems and solutions.
  • The increasing applications of IoT will give rise to the demand for IoT chipsets that are integrated into IoT devices.
  • The chipsets used in IoT devices include Wi-Fi modules, RF modules, microcontroller units (MCUs), and sensor modules.
  • Due to the rapid proliferation of mobile and IoT devices, the semiconductor packaging industry is facing strong demand for thin-profile semiconductor ICs and modules with a smaller footprint. This will accelerate the demand for FOWLP technology to package IoT chipsets on a smaller footprint. 

This fan-out wafer level packaging market analysis report also provides detailed information on other upcoming trends and challenges that will have a far-reaching effect on the market growth. Get detailed insights on the trends and challenges, which will help companies evaluate and develop growth strategies.

Who are the Major Fan-out Wafer Level Packaging Market Vendors?

The report analyzes the market’s competitive landscape and offers information on several market vendors, including:

 

  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • Cypress Semiconductor Corp.
  • Infineon Technologies AG
  • JCET Group Co. Ltd.
  • NXP Semiconductors NV
  • Renesas Electronics Corp.
  • Samsung Electronics Co. Ltd.
  • Siliconware Precision Industries Co. Ltd.
  • Taiwan Semiconductor Manufacturing Co. Ltd.

 

The FOWLP market is concentrated and the vendors are deploying growth strategies such as launching new and innovative products, cost-effective production cycles, and technological developments to compete in the market. Click here to uncover other successful business strategies deployed by the vendors. 

To make the most of the opportunities and recover from post COVID-19 impact, market vendors should focus more on the growth prospects in the fast-growing segments, while maintaining their positions in the slow-growing segments.

Download a free sample of the fan-out wafer level packaging market forecast report for insights on complete key vendor profiles. The profiles include information on the production, sustainability, and prospects of the leading companies. 

Which are the Key Regions for Fan-out Wafer Level Packaging Market?

Fan-out-Wafer-Level-Packaging-Market-Market-Share-by-Region-2020-2025

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82% of the market’s growth will originate from APAC during the forecast period. Taiwan, South Korea (Republic of Korea), China, and Japan are the key markets for fan-out wafer level packaging in APAC. Market growth in APAC will be faster than the growth of the market in other regions.

The presence of many foundries and OSAT companies in the region, which are the major customers of integrated device manufacturers (IDMs) and fabless companies will facilitate the fan-out wafer level packaging market growth in APAC over the forecast period. To garner further competitive intelligence and regional opportunities in store for vendors, view our sample report.

What are the Revenue-generating Technology Segments in the Fan-out Wafer Level Packaging Market?

Fan-out-Wafer-Level-Packaging-Market-Market-Share-by-Technology-2020-2025

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The fan-out wafer level packaging market share growth by the standard density segment will be significant during the forecast period. The rapid technological advancements in the semiconductor industry and the development of efficient analog ICs delivering optimized performance drive the growth of the market in the standard density segment.

Fetch actionable market insights on post COVID-19 impact on each segment. This report provides an accurate prediction of the contribution of all the segments to the growth of the FOWLP market size.

 

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What are the Key Factors Covered in this Fan-out Wafer Level Packaging Market Report?

  • CAGR of the market during the forecast period 2021-2025
  • Detailed information on factors that will drive FOWLP market growth during the next five years
  • Precise estimation of the fan-out wafer level packaging market size and its contribution to the parent market
  • Accurate predictions on upcoming trends and changes in consumer behavior
  • The growth of the fan-out wafer level packaging industry across APAC, North America, Europe, South America, and MEA
  • A thorough analysis of the market’s competitive landscape and detailed information on vendors
  • Comprehensive details of factors that will challenge the growth of fan-out wafer level packaging market vendors

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Fan-out Wafer Level Packaging Market Scope

Report Coverage

Details

Page number

120

Base year

2020

Forecast period

2021-2025

Growth momentum & CAGR

Decelerate at a CAGR of 14.29%

Market growth 2021-2025

$ 1.60 billion

Market structure

Concentrated

YoY growth (%)

19.33

Regional analysis

APAC, North America, Europe, South America, and MEA

Performing market contribution

APAC at 82%

Key consumer countries

Taiwan, South Korea (Republic of Korea), China, Japan, and US

Competitive landscape

Leading companies, competitive strategies, consumer engagement scope

Companies profiled

Amkor Technology Inc., ASE Technology Holding Co. Ltd., Cypress Semiconductor Corp., Infineon Technologies AG, JCET Group Co. Ltd., NXP Semiconductors NV, Renesas Electronics Corp., Samsung Electronics Co. Ltd., Siliconware Precision Industries Co. Ltd., and Taiwan Semiconductor Manufacturing Co. Ltd.

Market Dynamics

Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID 19 impact and future consumer dynamics, market condition analysis for forecast period,

Customization purview

If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.

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Research Framework

Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. The analysts have presented the various facets of the market with a particular focus on identifying the key industry influencers. The data thus presented is comprehensive, reliable, and the result of extensive research, both primary and secondary.

TechnavioINFORMATION SOURCES

Primary sources

  • Manufacturers and suppliers
  • Channel partners
  • Industry experts
  • Strategic decision makers

Secondary sources

  • Industry journals and periodicals
  • Government data
  • Financial reports of key industry players
  • Historical data
  • Press releases
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TechnavioDATA ANALYSIS

Data Synthesis

  • Collation of data
  • Estimation of key figures
  • Analysis of derived insights

Data Validation

  • Triangulation with data models
  • Reference against proprietary databases
  • Corroboration with industry experts
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TechnavioREPORT WRITING

Qualitative

  • Market drivers
  • Market challenges
  • Market trends
  • Five forces analysis

Quantitative

  • Market size and forecast
  • Market segmentation
  • Geographical insights
  • Competitive landscape
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The fan-out wafer level packaging market growth will increase by $1946.27 million during 2019-2024.
The fan-out wafer level packaging market is expected to grow at a CAGR of 15.68% during 2019-2024.
Technavio has segmented the fan-out wafer level packaging market by technology (High density and Standard density) and geographic (APAC, North America, Europe, South America, and MEA).
Amkor Technology Inc., ASE Technology Holding Co. Ltd., Cypress Semiconductor Corp., Infineon Technologies AG, JCET Group Co. Ltd., NXP Semiconductors NV, Renesas Electronics Corp., Samsung Electronics Co. Ltd., Siliconware Precision Industries Co. Ltd., Taiwan Semiconductor Manufacturing Co. Ltd. are a few of the key vendors in the fan-out wafer level packaging market.
APAC will register the highest growth rate of 81.94% among the other regions. Therefore, the fan-out wafer level packaging market in APAC is expected to garner significant business opportunities for the vendors during the forecast period.
  • Taiwan
  • US
  • South Korea (Republic of Korea)
  • China
  • Japan
  • Germany
The key factors driving the fan-out wafer level packaging market growth are:
  • Increased demand for compactly designed electronics
The fan-out wafer level packaging market vendors should focus on grabbing business opportunities from the high density segment as it accounted for the largest market share in the base year.
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