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Technavio’s market research analyst predicts that the global bonding wire packaging material market will generate a revenue of close to USD 3 billion by the end of 2020. One of the primary growth drivers for this market is the increased need for miniaturization, especially in the semiconductor industry. Bonding wires are an important part of assemblies, and metals like copper, aluminum, gold, and palladium are extensively used to produce bonding wires. In this market, the vendors need to constantly upgrade their offerings with more advanced and compact packaging materials as it will help them to cater to the consumer’s requirements. The demand for bonding wires has increased significantly owing to the growing need for miniaturization to meet the packaging requirements of the semiconductor industry.
An important trend that is spurring market growth is the extensive use of silver as an alternative material. Since the semiconductor industry is under constant pressure to introduce low-cost alternatives to gold without compromising on the quality, the use of silver as a bonding wire has been gaining traction during the forecast period. The silver bonding wire offers the same product quality and does not require significant investments in high-end bonding equipment. Silver wire became a viable option after its use in LED packaging and memory devices. The affordability of silver bonding wire will make it a preferred material in the semiconductor industry during the estimated period.
The PCC segment will dominate the bonding wire packaging material market and will grow at a CAGR of over 2% by the end of the forecast period. The use of PCC as an alternative material has been gaining traction due to the rising gold prices globally. Since these PCC-coated wires are resistant to corrosion and oxidation, they will replace gold wires as a packaging material during the next few years.
The APAC region dominated the global bonding wire packaging material market in 2015 and accounted for approximately 89% of the total market share. The presence of major semiconductor manufacturing giants like Samsung, LG, SK Hynix, MediaTek, Toshiba, and ROHM in this region will lead to the growth of this market in APAC. In addition, factors like recent technological advances and the use of alternative metals for packaging will also play a crucial role in fostering market growth through the end of 2020.
The global bonding wire packaging material market is dominated by the four key suppliers. Most of the suppliers in this market offer very similar products, where the sole distinguishing factor is the type of alloy used. The chances for new players and startups entering and flourishing in this market are very high as the market is trending towards the adoption of flip chips.
Key vendors in this market are -
Other prominent vendors in this market are AMETEK, EMMTECH, Inseto, Palomar Technologies, SHINKAWA, Sumitomo Metal Mining, and Tatsuta Electric Wire & Cable.
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PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
PART 05: Market landscape
PART 06: Market segmentation by material type
PART 07: Geographical segmentation
PART 08: Key leading countries
PART 09: Summary of key figures
PART 10: Market drivers
PART 11: Impact of drivers
PART 12: Market challenges
PART 13: Impact of drivers and challenges
PART 14: Market trends
PART 15: Vendor landscape
PART 16: Appendix
PART 17: Explore Technavio
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