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The semiconductor chip packaging market size is forecast to increase by USD 487.11 billion between 2023 and 2027. The Report covers Semiconductor Chip Packaging Market industry forecast and is segmented into Packaging (3dic tsv stacks, 2.5d interposers, flip-chip wafer bumping, fo wlp/sip, and others), End-user (osats and idms), and Geography (APAC, North America, Europe, South America, and Middle East and Africa). The market size, historical market size (2017-2021), and forecasts are provided on the basis of value (USD billion) for all the above segments.
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The market size for Semiconductor Chip Packaging Market is projected to experience a CAGR of 28.15% between 2023 to 2027 with a Year over Year (YoY) growth of 27.33%.
The APAC semiconductor chip packaging market encountered significant challenges in 2020 due to the COVID-19 outbreak. Lockdowns disrupted semiconductor manufacturing, and reduced consumer demand for electronics. However, by the first half of 2021, widespread vaccination programs enabled manufacturing to resume in late 2020. The launch of 5G in India drove demand for packaging and semiconductor chip technologies, benefiting the market. The Indian government's support for domestic electronic product manufacturing also increased the demand for chip packaging services. Market consolidation and acquisitions by major players like ASE and Amkor are further expected to boost the regional semiconductor industry. Overall, the APAC semiconductor chip packaging market is projected to grow in the forecasted period.
Rising integration of ICs in automobiles is a key driver boosting the market growth. The growing use of integrated circuits (ICs) in automobiles is fueling the demand for epitaxy wafers, which, in turn, is boosting the global semiconductor chip packaging market. The production of these wafers necessitates rigorous inspection and measurement, leading to an increased need for semiconductor inspection and metrology systems.
Stringent vehicle safety regulations worldwide are compelling automotive OEMs to incorporate advanced electronics for enhanced driver safety. This includes systems like airbags, ABS, ESC, TCS, and TPMS, mandated by agencies such as the NHTSA in the US. As a result, automotive OEMs are integrating safety systems like forward collision warning, lane departure warning, smart cameras, and autonomous braking systems, which involve a significant number of semiconductor ICs, such as MCUs, MPUs, memory devices, and power management ICs. Consequently, the adoption of semiconductor ICs is driving the global semiconductor chip packaging market.
3DIC TSV Stacks Segment Is The Fastest Growing Segment
The 3DIC TSV Stacks segment was valued at USD 67.78 billion in 2017 and continued to grow until 2021. 3D TSV technology is becoming an important solution platform for high-end memory applications, heterogeneous interconnection with CIS, MEMS, sensors, RF filters, and power applications. In the future, this technology will be used for applications such as photonics and the integration of LED functionality. The 3DIC TSV stack technology segment is expected to be the leading technology during the forecast period, growing at the fastest rate from 2023 to 2027. Based on these factors, the demand for 3DIC TSV stack technology is likely to increase, which can be expected to drive the growth of the featured market during the forecast period going forward.
Semiconductor Chip Packaging Market - Revenue Share by 3DIC TSV Stacks Segment, 2017-2027
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APAC Holds a Prominent Position in the Semiconductor Chip Packaging Market
APAC is estimated to contribute 78% to the growth of the global market during the forecast period.The APAC semiconductor chip packaging market is flourishing thanks to the presence of numerous semiconductor manufacturing units. Leading foundries like Taiwan Semiconductor Manufacturing, United Microelectronics, Samsung, and Semiconductor Manufacturing International are heavily investing in the region, expanding their production capabilities.
The growing demand for electronic devices in countries such as China, Japan, South Korea, and Taiwan is a significant driver of market growth. The adoption of advanced packaging techniques and the proliferation of 5G technology also play a role. Additionally, the region's competitive advantage lies in abundant raw materials and cost-effective establishment and labor expenses, attracting companies to set up manufacturing units. China and Japan are leading the market, particularly in the smartphone sector.
Semiconductor Chip Packaging Market Size, By Region, Global, 2017-2027
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The Semiconductor Chip Packaging Market is fragmented in nature. Some significant players include 3M Co., Amkor Technology Inc., Applied Materials Inc., ASE Technology Holding Co. Ltd., ASM Pacific Technology Ltd.
The research report also includes detailed analyses of the competitive landscape of the market and information about 15 market companies, including:
ChipMOS TECHNOLOGIES Inc., GlobalFoundaries US Inc., Greatek Electronics Inc., Jiangsu Changdian Technology Co. Ltd., Kulicke and Soffa Industries Inc., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., SkyWater Technology Inc., SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Veeco Instruments Inc.
The semiconductor chip packaging market report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2017 - 2021.
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Semiconductor Chip Packaging Market Scope |
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Report Coverage |
Details |
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Page number |
174 |
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Base year |
2022 |
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Historic period |
2017 - 2021 |
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Forecast period |
2023-2027 |
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Growth momentum & CAGR |
Accelerate at a CAGR of 28.15% |
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Market growth 2023-2027 |
USD 487.11 billion |
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Market structure |
Fragmented |
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YoY growth 2022-2023(%) |
27.33 |
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Regional analysis |
APAC, North America, Europe, South America, and Middle East and Africa |
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Performing market contribution |
APAC at 78% |
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Key countries |
US, China, Taiwan, Japan, and South Korea |
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Competitive landscape |
Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks |
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Key companies profiled |
3M Co., Amkor Technology Inc., Applied Materials Inc., ASE Technology Holding Co. Ltd., ASM Pacific Technology Ltd., ChipMOS TECHNOLOGIES Inc., GlobalFoundaries US Inc., Greatek Electronics Inc., Jiangsu Changdian Technology Co. Ltd., Kulicke and Soffa Industries Inc., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., SkyWater Technology Inc., SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Veeco Instruments Inc. |
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Market dynamics |
Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID 19 impact and recovery analysis and future consumer dynamics, Market condition analysis for forecast period |
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Customization purview |
If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized. |
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1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Packaging
7 Market Segmentation by End-user
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
13 Appendix
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