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The dicing equipment market share is expected to increase by USD 225.77 million from 2021 to 2026, and the market's growth momentum will accelerate at a CAGR of 4.35%.
This dicing equipment market research report provides valuable insights on the post COVID-19 impact on the market, which will help companies evaluate their business approaches. Furthermore, this report extensively covers dicing equipment market segmentation by end-user (pureplay foundries and integrated device manufacturers) and geography (APAC, North America, Europe, South America, and Middle East and Africa). The dicing equipment market report also offers information on several market vendors, including Advanced Dicing Technologies, ASM Pacific Technology, DISCO Corp., Dynatex International, EV Group, KLA Corp., Neon Tech Co. Ltd., Nippon Pulse Motor Co. Ltd., Panasonic Corp., Plasma Therm, Suzhou Delong Laser Co. Ltd., and Tokyo Seimitsu Co. Ltd. among others.
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The growing investment in fabrication facilities is notably driving the dicing equipment market growth, although factors such as complexity of patterns and functional defects in manufacturing processes may impede market growth. Our research analysts have studied the historical data and deduced the key market drivers and the COVID-19 pandemic impact on the dicing equipment industry. The holistic analysis of the drivers will help in deducing end goals and refining marketing strategies to gain a competitive edge.
Key Dicing Equipment Market Driver
The growing investment in fabrication facilities is one of the key drivers supporting the dicing equipment market growth. The rising demand for 3D NAND has created an opportunity for supply chain members such as chip makers, equipment manufacturers, and material suppliers. For instance, in July 2021, Macronix International Co announced its plan to allocate NT$41.5 billion to expand the 12-inch wafer capacity for advanced 3D NAND and NOR flash memory chips. Similarly, in December 2020, Kioxia announced its plan to expand its Kitakami production site with a new production facility called K2. In June 2020, Also, Samsung Electronics announced its plan to expand its NAND flash production capacity in Pyeongtaek, Korea. Thus, the growing investments by manufacturers in 3D NAND flash production facilities will increase the production of 3D NAND. This is expected to bring down the cost of 3D NAND memory and positively drive the demand for memory devices as OEMs are increasingly focusing on releasing consumer electronic products with high memory capacity.
Key Dicing Equipment Market Trend
Growing demand for IoT-connected devices is another factor supporting the dicing equipment market growth. The rise in the adoption of connected cars, connected homes, connected health, and smart cities has resulted in an increase in the data generated by these devices. These IoT-enabled devices have led to an exponential increase in data center network traffic over the years by transferring more data to data centers. All these factors have increased the need for effective data storage and, therefore, have compelled enterprises to invest in storage systems and semiconductors to manage and analyze the data effectively to derive business intelligence insights. Demand in the semiconductor industry is always driven by the introduction of new technologies, further boosting the power of IoT devices. Thus, the rise in the demand for IoT devices will create demand for semiconductors, which, in turn, will fuel the dicing equipment market growth during the forecast period.
Key Dicing Equipment Market Challenge
The complexity of patterns and functional defects in manufacturing processes is one of the factors hindering the dicing equipment market growth. Production flaws cause supply delays and might result in extra losses in the form of order cancelation and client shifting to other suppliers. Pattern complexity rises as a result of many patterns on a semiconductor at a very small size. This necessitates great precision in order to convey precise data to the chip. With the demand for size reduction and the high density of semiconductor devices, the complexity of wafers has risen, resulting in a drop in lithography wavelength. As node sizes drop, photomasks and wafers get more complicated, necessitating the purchase of new semiconductor production equipment. All these factors are inhibiting the growth of the dicing equipment market.
This dicing equipment market analysis report also provides detailed information on other upcoming trends and challenges that will have a far-reaching effect on the market growth. The actionable insights on the trends and challenges will help companies evaluate and develop growth strategies for 2022-2026.
Technavio categorizes the global dicing equipment market as a part of the global semiconductor equipment market. Our research report has extensively covered external factors influencing the parent market growth potential in the coming years, which will determine the levels of growth of the dicing equipment market during the forecast period.
The report analyzes the market's competitive landscape and offers information on several market vendors, including:
This statistical study of the dicing equipment market encompasses successful business strategies deployed by the key vendors. The dicing equipment market is concentrated and the vendors are deploying growth strategies such as developing innovative products and are constantly increasing their R and D investments to compete in the market.
To make the most of the opportunities and recover from post COVID-19 impact, market vendors should focus more on the growth prospects in the fast-growing segments, while maintaining their positions in the slow-growing segments.
The dicing equipment market forecast report offers in-depth insights into key vendor profiles. The profiles include information on the production, sustainability, and prospects of the leading companies.
Our report provides extensive information on the value chain analysis for the dicing equipment market, which vendors can leverage to gain a competitive advantage during the forecast period. The end-to-end understanding of the value chain is essential in profit margin optimization and evaluation of business strategies. The data available in our value chain analysis segment can help vendors drive costs and enhance customer services during the forecast period.
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83% of the market's growth will originate from APAC during the forecast period. Taiwan, South Korea, Japan, and China are the key markets for dicing equipment market in APAC. Market growth in this region will be faster than the growth of the market in regions.
The increased demand for secure access and identity solutions in telecommunications will facilitate the dicing equipment market growth in APAC over the forecast period. This market research report entails detailed information on the competitive intelligence, marketing gaps, and regional opportunities in store for vendors, which will assist in creating efficient business plans.
COVID Impact and Recovery Analysis
The worldwide semiconductor scarcity caused by the COVID-19 pandemic has spurred players to focus on growing manufacturing capacity. However, due to the obvious incorporation of microelectronics in consumer electronics, the dicing equipment industry is gaining pace. This factor is expected to drive market growth during the forecast period.
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The dicing equipment market share growth by the pureplay foundries segment will be significant during the forecast period. The pure-play foundry industry is expected to develop rapidly due to rising demand for application processors and other telecom equipment sales in 5G handsets. Furthermore, foundries are increasingly focused on the adoption of automation, machine learning, and analytics. The benefits of these technologies, such as streamlining the production process and improving yield without sacrificing quality, are fueling the demand for ICs. With increased production capacity and lower prices, suppliers are projected to take on larger production contracts, resulting in considerably greater supply and filling shortfall gaps in numerous industries. Factors such as these are fueling the demand for ICs, which, in turn, is driving the pure-play foundries market.
This report provides an accurate prediction of the contribution of all the segments to the growth of the dicing equipment market size and actionable market insights on post COVID-19 impact on each segment.
Dicing Equipment Market Scope |
|
Report Coverage |
Details |
Page number |
120 |
Base year |
2021 |
Forecast period |
2022-2026 |
Growth momentum & CAGR |
Accelerate at a CAGR of 4.35% |
Market growth 2022-2026 |
$ 225.77 million |
Market structure |
Concentrated |
YoY growth (%) |
3.83 |
Regional analysis |
APAC, North America, Europe, South America, and Middle East and Africa |
Performing market contribution |
APAC at 83% |
Key consumer countries |
US, Taiwan, South Korea, Japan, and China |
Competitive landscape |
Leading companies, Competitive strategies, Consumer engagement scope |
Key companies profiled |
Advanced Dicing Technologies, ASM Pacific Technology, DISCO Corp., Dynatex International, EV Group, KLA Corp., Neon Tech Co. Ltd., Nippon Pulse Motor Co. Ltd., Panasonic Corp., Plasma Therm, Suzhou Delong Laser Co. Ltd., and Tokyo Seimitsu Co. Ltd. |
Market dynamics |
Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for the forecast period |
Customization purview |
If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized. |
We can help! Our analysts can customize this report to meet your requirements. Get in touch
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Five Forces Analysis
5 Market Segmentation by End-user
6 Customer Landscape
7 Geographic Landscape
8 Drivers, Challenges, and Trends
9 Vendor Landscape
10 Vendor Analysis
11 Appendix
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