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The global copper clad laminate market size is estimated to grow by USD 4.29 billion between 2023 and 2028 exhibiting a CAGR of 4.63%. The growth rate of the market depends on several factors such as the rising adoption of smartphones, the increasing usage of electronic components in vehicles, and the growing focus on 5G services.
The report includes a comprehensive outlook on the Market, offering forecasts for the industry segmented by Type, which comprises rigid and flexible. Additionally, it categorizes Material into epoxy resin-based, phenolic resin-based, polyimide resin-based, and others and covers Regions, including APAC, North America, Europe, Middle East and Africa, and South America. The report provides market size, historical data spanning from 2018 to 2022, and future projections, all presented in terms of value in USD billion for each of the mentioned segments.
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Our researchers analyzed the data with 2023 as the base year, along with the key drivers, trends, and challenges. A holistic analysis of drivers will help companies refine their marketing strategies to gain a competitive advantage.
Increasing usage of electronic components in vehicles is the key factor driving market growth. The demand for copper clad laminate from the automotive industry is anticipated to grow owing to increasing electronic components in vehicles, like the introduction of advanced driver-assistance systems (ADAS) and infotainment systems in mass mid-segment vehicles. The increasing deployment of automation systems in vehicles is leading to the higher integration of advanced electronic components such as actuators, microcontrollers, and sensors to enable in-vehicle communication.
Moreover, automotive original equipment manufacturers (OEMs) are incorporating smart features in their vehicles, such as automatic transmissions, central locking, gesture recognition, voice recognition, and others. The growth of in-vehicle electronics in automotive will accelerate the demand for copper clad laminate, supporting many electronic components integrated into it. This will propel the growth of the market during the forecast period.
The advent of high-density interconnect technology is the primary trend shaping market growth. The electronic industry is witnessing an increasing need for efficient data transfer along with low power consumption. Consequently, the trend for miniaturization of electronic components is attaining traction in the market, resulting in high circuit density, which leads to a complex interconnection between the components. High-density interconnect (HDI) substrates are made up of high-density circuits, which make it easy for the electronic components to be mounted on the PCB and send and receive signals among themselves.
Moreover, HDI is a crucial technology as it lowers manufacturing costs, eases the PCB design flow, and makes it compatible with new-generation electronic devices. In addition, an increase in the demand for PCB induced by HDI technology will increase the demand for copper-clad laminate since copper-clad laminate is the fundamental building block material used in the fabrication of printed circuit boards. Thus, the advent of HDI technology will drive the growth of the market during the forecast period.
Manufacturing defects of copper-clad laminate is a challenge that affects market growth. Numerous unexpected factors may emerge within the copper foil manufacturing process, leading to several problems. Damage, dents, resin points, wrinkles, bubbles, and other defects could be among these issues. These kinds of problems reduce the copper-clad laminate's performance and negatively impact the printed board's quality when they occur. Ensuring sure the copper-clad laminate satisfies critical requirements, such as water absorption and anti-corrosion qualities, is important.
Furthermore, the final design specifies the exact dimensions that the copper-clad laminate, which is the PCB's foundation material, must meet. Different parameters, such as width, length, diagonal deviation, and warpage, are carefully evaluated. Not meeting these size conditions specifically can lead to the unsuccessful application of copper clad laminate. Hence, manufacturing defects of copper clad laminate may impede market growth during the forecast period.
The rigid segment is estimated to witness significant growth during the forecast period. Rigid copper clad laminate, typically referred to as PCB laminate, is a type of substrate material used in PCBs that has a thin layer of copper lamination on either one or both of the sides of PCB (double copper clad laminate or single copper clad laminate). Manufacturers create multi, double, and single-layer rigid PCBs utilizing substrate materials such as FR-4 (epoxy resin), polytetrafluoroethylene (PTFE), ceramic, and metal core (copper or aluminum).
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The rigid segment was the largest segment and was valued at USD 10.77 billion in 2018. The material known as Flame Retardant-4 (FR-4) is made of a self-extinguishing (flame-resistant) epoxy resin laminate and woven glass fiber fabric. Rigid copper clad laminates are difficult to bend and have a certain hardness and toughness. With the rapid development of the electronics manufacturing industry, the demand for rigid copper clad laminates continues to increase. Hence, these factors will drive the growth of the rigid copper clad laminates segment and the market during the forecast period.
The structure and performance of epoxy resin, a primary raw material for copper-clad laminate used as a printed circuit board substrate, are vital factors that affect the performance of the finished product. Also, the performance of copper clad laminate is progressively enhancing due to the ongoing advancements in epoxy resin. Furthermore, copper clad laminate mechanical properties of copper clad laminate enable it to function as a supporting component in electronic goods. Thus, such factors will drive the growth of the segment and market during the forecast period.
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APAC is estimated to contribute 54% to the growth of the global market during the forecast period. Technavio’s analysts have elaborately explained the regional trends and drivers that shape the market during the forecast period. The copper clad laminate market in APAC is anticipated to grow due to China, Taiwan, South Korea, and Japan being the significant revenue contributors and the largest markets for copper-clad laminates. A primary factor driving the growth of the market is the rising demand for electronics in the automotive, aerospace, and electronic and electrical industries from developing countries, such as China and India.
In addition, countries in APAC, such as India, China, South Korea, and Japan, are continuously increasing their defense budgets to strengthen their national security. Hence, the growing demand for PCBs from military forces of different countries in APAC is anticipated to influence the growth of copper clad laminate. Moreover, major copper clad laminate manufacturers, such as Shengyi Technology, Nan Ya Plastic, Doosan and DuPont, have a strong presence in APAC. Thus, such factors will further drive market growth in the region during the forecast period.
Companies are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.
The research report also includes detailed analyses of the competitive landscape of the market and information about 15 market companies, including:
Chang Chun Group, Comet Impreglam LLP, Current Inc., D K Enterprise, D. D. Enterprises., Doosan Corp., DuPont de Nemours Inc., Elite Material Co. Ltd., Isola Group BV, ITEQ CORP., Kingboard Laminates Holdings Ltd., Nan Ya Plastic Corp., RISHO KOGYO CO. LTD., Shengyi Technology Co Ltd, Sumitomo Bakelite Co. Ltd., TAIFLEX Scientific Co. Ltd, Taiwan Union Technology Corp., Ube Corp., and Zhejiang Wazam New Materials Co Ltd
Qualitative and quantitative analysis of companies has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize companies as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize companies as dominant, leading, strong, tentative, and weak.
The market research report encompasses the entire market adoption cycle, ranging from the initial innovator phase to the subsequent laggard stage. It emphasizes adoption rates across various regions, determined by penetration levels. Additionally, the report outlines essential purchasing factors and factors influencing price sensitivity. This aids companies in assessing and formulating effective growth strategies.
Global Copper Clad Laminate Market Customer Landscape
The copper clad laminate market report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2018 to 2028.
Copper Clad Laminate Market Scope |
|
Report Coverage |
Details |
Page number |
168 |
Base year |
2023 |
Historic period |
2018-2022 |
Forecast period |
2024-2028 |
Growth momentum & CAGR |
Accelerate at a CAGR of 4.63% |
Market Growth 2024-2028 |
USD 4.29 billion |
Market structure |
Fragmented |
YoY growth 2023-2024(%) |
4.26 |
Regional analysis |
APAC, North America, Europe, Middle East and Africa, and South America |
Performing market contribution |
APAC at 54% |
Key countries |
US, China, Taiwan, South Korea, and Japan |
Competitive landscape |
Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks |
Key companies profiled |
AGC Inc., Chang Chun Group, Comet Impreglam LLP, Current Inc., D K Enterprise, D. D. Enterprises., Doosan Corp., DuPont de Nemours Inc., Elite Material Co. Ltd., Isola Group BV, ITEQ CORP., Kingboard Laminates Holdings Ltd., Nan Ya Plastic Corp., RISHO KOGYO CO. LTD., Shengyi Technology Co Ltd, Sumitomo Bakelite Co. Ltd., TAIFLEX Scientific Co. Ltd, Taiwan Union Technology Corp., Ube Corp., and Zhejiang Wazam New Materials Co Ltd |
Market dynamics |
Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, and market condition analysis for the forecast period. |
Customization purview |
If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized. |
We can help! Our analysts can customize this market research report to meet your requirements.
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Type
7 Market Segmentation by Material
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
13 Appendix
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