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The die bonder equipment market size is projected to increase by USD 189.1 million at a CAGR of 4.07% between 2023 and 2028. The market size. The growth of the market depends on several factors, including the increasing complexity of semiconductor IC designs, the rising electronics production across the world, and the rising demand for high-quality semiconductor ICs for wireless devices and IoT applications. Die bonder equipment is a type of semiconductor packaging and assembly equipment in which wafers are cut into dies, and the functional dies are separated from the defective ones, which are already marked before this step.
The market growth and forecasting report includes key player's detailed analyses of the competitive landscape of the market and information about 20 market companies, including ASMPT Ltd., BE Semiconductor Industries NV, DIAS Automation HK Ltd., Dr. Tresky AG, ficonTEC Service GmbH, Finetech GmbH and Co. KG, Four Technos Co. Ltd., HYBOND Inc., Indubond, Kulicke and Soffa Industries Inc., MicroAssembly Technologies Ltd., Mycronic AB, Palomar Technologies Inc., Panasonic Holdings Corp., Paroteq GmbH, SHIBAURA MECHATRONICS CORP., SHIBUYA Corp., UniTemp GmbH, WestBond Inc., and Yamaha Motor Co. Ltd.
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The market is experiencing significant growth in the context of sustainability and Industry 4.0 technologies. Semiconductor devices play a crucial role in consumer electronics, and the demand for these devices is escalating due to the integration of advanced technologies such as data analytics, AI, and ML. However, semiconductor chip shortages pose a challenge to cost-effective solutions in this market. Energy efficiency is a key consideration in the market, as maintenance and operating costs are significant factors. Niche markets, including medical devices and aerospace, require customized solutions to meet specific requirements. Historical growth and forecasted growth in the market are driven by the increasing demand for HPC applications and the expansion of 5G networks in the telecommunications sector. Neuromorphic chips are an emerging trend in this market, offering the potential for improved performance and energy efficiency. In conclusion, the market is poised for continued growth in the context of sustainability, semiconductor devices, and Industry 4.0 technologies. Energy efficiency, cost-effective solutions, and customization are essential factors driving market performance. The historical growth and forecasted growth of this market are influenced by the increasing demand for HPC applications, 5G networks, and emerging technologies such as neuromorphic chips.
The increasing complexity of semiconductor IC designs is driving market growth. The IoT (Internet of Things) revolution necessitates high-speed data processing, fueling the need for sophisticated electronic equipment. The automobile industry's transition to autonomous and electric vehicles further boosts demand. Emerging economies, such as India and China, witnessing record smartphone penetration due to low Internet charges, add to the market's sustainability. Adaptability to semiconductor chip shortages and cost-effective solutions, coupled with energy efficiency and maintenance considerations, are crucial factors in the market.
Furthermore, Niche markets, including medical devices, aerospace, and high-end logic applications, require customized solutions. Market performance is influenced by historical growth and forecasted expansion in HPC applications, AI, ML, neuromorphic chips, 5G networks, and telecommunications sector. Advanced packaging technologies, such as eutectic bonding, soft solder bonding, and flip-chip bonding, contribute to miniaturization, hybrid circuits, and TCB. 3D stacked memory, high-lead containing solders, and metal-filled conductive epoxies cater to the needs of various industries. Market growth is expected to continue, with trends like 3D packaging techniques, wireless technologies, automation, and quantum computing shaping the future.
An increase in the number of OSAT vendors is an emerging trend shaping market growth. The market in the APAC region, particularly in China, is experiencing significant growth due to the strong financial backing of OSATs. This valuation enables investments in Research and Development (R&D) and capacity expansion. Governmental support for the semiconductor industry in countries like South Korea, China, and Japan is also driving growth. The easy availability of capital is boosting development, ensuring sustainability and adaptability in the semiconductor devices and consumer electronics industries.
Furthermore, Industry 4.0 technologies, data analytics, and cost-effective solutions are essential in addressing semiconductor chip shortages. Energy efficiency, maintenance, and operating costs are crucial factors in the market's performance. Niche markets, such as medical devices, aerospace, and high-performance computing (HPC) applications, require customized solutions. Advanced packaging technologies, including the eutectic bonding method, soft solder bonding, and flip-chip bonding, are essential for miniaturization, hybrid circuits, and TCB. 3D NAND flash memory, high-end logic applications, and metal-filled conductive epoxies are vital for the development of neuromorphic chips, 5G networks, telecommunications sector, quantum computing, and 3D packaging techniques. Wireless technologies and automation are also key trends in the market.
High demand for polymer adhesive wafer bonding equipment is a significant challenge hindering market growth. The market is subjected to valuation challenges due to the cyclical nature of the semiconductor industry. Sustainability and adaptability are crucial for vendors in this market, given the risks of overcapacity, low demand, and intense price competition. Semiconductor device manufacturers' capital expenditures significantly impact the market's performance. During periods of overcapacity, device manufacturers cut back on investments, leading to underutilization of vendor factories and customer order cancellations or delays.
Furthermore, Key trends shaping the market include advances in consumer electronics, Industry 4.0 technologies, data analytics, and semiconductor chip shortages. Cost-effective solutions, energy efficiency, and maintenance are essential considerations for vendors. Niche markets, such as medical devices, aerospace, and high-performance computing (HPC) applications, offer growth opportunities. Market performance is influenced by historical growth and forecasted expansion in sectors like artificial intelligence (AI), machine learning (ML), neuromorphic chips, 5G networks, telecommunications, quantum computing, 3D packaging techniques, wireless technologies, automation, and advanced packaging technologies. Technologies like eutectic bonding, soft solder bonding, and flip-chip bonding are essential in miniaturization, hybrid circuits, and TCB. Market growth is further driven by the adoption of high-end logic applications, metal-filled conductive epoxies, and high lead-containing solders.
The market is driven by the semiconductor industry's expansion and the increasing costs of advanced packaging technologies. Valuation in this market is influenced by sustainability and adaptability to emerging trends. Consumer electronics and Industry 4.0 technologies are significant niche markets. Semiconductor chip shortages necessitate cost-effective solutions and energy efficiency.
The market share growth by the OSATs segment will be significant during the forecast period. OSATs are dedicated packaging, assembly, and testing players, and their growth is driven by two major factors such as the overall expansion in the semiconductor industry and rising costs of packaging, assembly, and testing equipment.
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The OSATs segment was valued at USD 428.70 million in 2018. The semiconductor packaging and assembly industry has seen advancements in new technologies like FOWLP, 2.5D, 3D, and TSV, which have led to an increase in outsourcing of back-end processes. Although these technologies may result in high costs currently because they are not fully mature, there is ongoing research and development (R&D) to make them suitable for large-scale applications. Amkor Technology, a major OSAT, has announced expansion plans through strategic collaborations to streamline semiconductor package verification. The adoption of these new technologies in the packaging sector of the semiconductor industry creates a demand for new die bonder equipment, driving market expansion during the forecast period.
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APAC is estimated to contribute 80% to the growth of the global market during the forecast period. Technavio's analysts have provided extensive insight into the market forecast, detailing the regional trends and drivers influencing the market's trajectory throughout the forecast period.
The APAC market which includes gold-silicon solders and semiconductor components like GaAs chips, solder preforms, and eutectic gold-tin, is driven by the manufacturing sectors in China, India, Japan, and South Korea. RoHS and REACH legislation influence the market. Automation is adopted for discrete power devices and Copper clips to address challenges from outdated technology and labor-intensive processes. The region faces challenges such as the slowdown of industrial production in China and the increasing use of LED, Epoxy Adhesive bonding, SFE, and silver-filled epoxies in industries like optoelectronics, healthcare, OEMs, and consumer electronics (smartphones, wearables, white goods, MEMS, MOEMS). Technologies like Wedge bonding, Flip chip bonding, and 3880 Die Bonder equipment from companies like Palomar Technologies and ASM are utilized for bonding SiC, GaN, and other advanced semiconductors in various applications. The Joint Research Center and 3880-II die-bonder are also significant in this context.
The market forecasting report includes the adoption lifecycle of the market research and growth, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. Furthermore, the report also includes key purchase criteria and drivers of price sensitivity to help companies evaluate and develop their market growth and trends strategies.
Global Market Customer Landscape
Companies are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.
ASMPT Ltd. - The company offers die bonder equipment such as ad211 plus, ad280 plus, and ad50 lite.
Market analysis and report of qualitative and quantitative analysis of companies has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize companies as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize companies as dominant, leading, strong, tentative, and weak.
The market research report provides comprehensive data (region wise segment analysis), with forecasts and estimates in "USD Million" for the period 2024-2028, as well as historical data from 2018 - 2022 for the following segments.
The semiconductor industry relies heavily on the use of die bonder equipment for the assembly and packaging of integrated circuits. This essential technology facilitates the connection of semiconductor dies to various substrates, enabling the creation of complex electronic devices. The demand for die bonder equipment is significant due to the increasing production of semiconductors in the electronics industry. The market for die bonder equipment is driven by several factors, including the growing need for miniaturization in electronic devices, the rising adoption of advanced semiconductor technologies, and the increasing demand for high-performance computing and telecommunications infrastructure.
Additionally, the semiconductor industry's continuous pursuit of higher yields and productivity further fuels the demand for advanced die bonder equipment. The market is a dynamic and competitive landscape, with several key players offering innovative solutions to meet the evolving needs of the semiconductor industry. Companies invest heavily in research and development to introduce new technologies and improve the efficiency and reliability of their equipment. Some of the leading players in the market include Chipbond Technology Corporation, Nitto Denko Corporation, and ASM Pacific Technology Limited.
Market Scope |
|
Report Coverage |
Details |
Page number |
163 |
Base year |
2023 |
Historic period |
2018 - 2022 |
Forecast period |
2024-2028 |
Growth momentum & CAGR |
Accelerate at a CAGR of 4.07% |
Market growth 2024-2028 |
USD 189.1 million |
Market structure |
Fragmented |
YoY growth 2023-2024(%) |
3.85 |
Regional analysis |
APAC, North America, Europe, South America, and Middle East and Africa |
Performing market contribution |
APAC at 80% |
Key countries |
Taiwan, China, South Korea, US, and Canada |
Competitive landscape |
Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks |
Key companies profiled |
ASMPT Ltd., BE Semiconductor Industries NV, DIAS Automation HK Ltd., Dr. Tresky AG, ficonTEC Service GmbH, Finetech GmbH and Co. KG, Four Technos Co. Ltd., HYBOND Inc., Indubond, Kulicke and Soffa Industries Inc., MicroAssembly Technologies Ltd., Mycronic AB, Palomar Technologies Inc., Panasonic Holdings Corp., Paroteq GmbH, SHIBAURA MECHATRONICS CORP., SHIBUYA Corp., UniTemp GmbH, WestBond Inc., and Yamaha Motor Co. Ltd. |
Market dynamics |
Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID 19 impact and recovery analysis and future consumer dynamics, Market condition analysis for forecast period |
Customization purview |
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1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by End-user
7 Market Segmentation by Type
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
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