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The semiconductor photoresist stripping market size is projected to increase by USD 178.62 million, at a CAGR of 6.51% between 2023 and 2028. The growth rate of the market depends on several factors, including advancements in stripping equipment, growing demand for specialty strippers and integration of semiconductor photoresist stripping with industry 4.0 technologies.
The market growth and forecasting report includes key player's detailed analyses of the competitive landscape of the market and information about 20 market companies, including Advanced Energy Industries Inc., Allwin21 Corp., Applied Materials Inc., Brewer Science Inc., Brinnovate, EV Group, Hitachi Ltd., Lam Research Corp., Mattson Technology Inc., Merck KGaA, MT Systems Inc., Nordson Corp., Oxford Instruments plc, Photonics Media, PSK Inc., Samco Inc., Screen Holdings Co. Ltd., TBS Holdings Inc., Trymax Semiconductor Equipment B.V., and Ulvac Inc.. Additionally, Applied Materials Inc. provides a range of semiconductor photoresist stripping solutions, including products like Centris SYM3 Y Etch, Centura Etch, Centura Tetra Z Photomask Etch, among others.
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Advancements in stripping equipment are notably driving market growth. Advanced stripping equipment is designed to achieve higher speeds and throughput rates, enabling IC manufacturers to meet the increasing demand for high-volume production. These systems feature improved automation, faster cycle times, and optimized process recipes, resulting in enhanced manufacturing efficiency and productivity. Such modern equipment often incorporates multi-step and multi-chamber configurations to support complex IC fabrication processes. These systems allow for sequential processing steps such as wet stripping, plasma etching, and cleaning, within a single platform, minimizing wafer handling and cycle time while maximizing process control and uniformity.
Furthermore, equipment manufacturers innovate new stripping chemistries, plasma sources, and wafer handling techniques optimized for compatibility with emerging materials such as high-k dielectrics and metal gate stacks, enabling precise and selective photoresist removal. Thus, advancements in such equipment contribute to the continuous improvement and evolution of IC photoresist stripping processes, driving efficiency, precision, and reliability in IC manufacturing, which will propel the market during the forecast period.
A rising focus on multi-layered devices and 3D structures is an emerging trend shaping market growth. Multi-layered devices and 3D structures, such as FinFET transistors and 3D NAND flash memory, require precise and selective photoresist stripping processes. As manufacturers adopt more complex device architectures to improve performance and functionality, there is a growing need for advanced solutions capable of removing photoresists from intricate IC structures without causing damage or contamination. Multi-layered devices often involve selective stripping processes to remove photoresists from specific regions or layers while preserving underlying materials.
Furthermore, the adoption of advanced packaging techniques, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP), drives the demand for specialized photoresist stripping solutions. These techniques involve the integration of multiple IC dies and components into a single package, requiring precise and uniform photoresist stripping processes to ensure proper alignment, bonding, and interconnection of device layers. Thus, the rising focus on multi-layered devices and 3D structures will boost the growth of the market during the forecast period.
Concerns related to process integration and uniformity of photoresist stripping processes are a significant challenge hindering market growth. Integrating photoresist stripping processes seamlessly into IC manufacturing workflows while ensuring compatibility with other process steps such as lithography, etching, and cleaning, is challenging. Variations in photoresist stripping conditions, equipment performance, and wafer characteristics can lead to wafer-to-wafer variability in stripping results. Inconsistent stripping across wafers can result in yield loss, reduced device performance, and increased manufacturing costs.
Moreover, variations in tool performance, process recipes, and maintenance practices can lead to tool-to-tool variability, impacting overall process uniformity and yield. Furthermore, accurate metrology and characterization techniques are essential for assessing stripping uniformity, residue levels, and material integrity. Challenges related to metrology accuracy, resolution, and throughput require the development of advanced metrology tools and techniques tailored to the needs of photoresist stripping processes, which is expected to hinder the growth of the market during the forecast period.
The market share growth by the positive segment will be significant during the forecast period. Positive photoresist stripping is essential to complete the photolithography process. Once the desired patterns have been transferred onto the IC wafer using photomasks, the unexposed photoresist material needs to be removed to reveal the patterned areas for subsequent processing steps. It serves as a mask during etching processes, where materials are selectively removed from semiconductor wafers to create circuit patterns and features.
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The positive segment was the largest and was valued at USD 322.50 million in 2018. Moreover, proper positive photoresist stripping contributes to improved device yield by reducing defects and enhancing process uniformity. Clean wafer surfaces without residual photoresists improve the quality and reliability of IC devices, leading to higher yields and lower manufacturing costs. Furthermore, positive photoresist stripping processes are monitored and controlled to ensure compliance with quality standards and specifications. Tight process control and monitoring help maintain consistent stripping results across IC wafers and manufacturing batches, ensuring product quality and reliability. Thus, these factors will drive the growth of the positive segment of the market during the forecast period.
Semiconductor photoresist stripping is a critical step in the integrated circuit (IC) manufacturing process, playing a crucial role in ensuring the quality, reliability, and functionality of IC devices. Additionally, ICs are subject to strict performance specifications, including parameters such as yield, reliability, and electrical characteristics. Moreover, manufacturers seek cost-effective solutions that maximize production throughput and minimize operational expenses. Efficient photoresist stripping processes contribute to overall manufacturing efficiency by reducing cycle times, minimizing material waste, and optimizing resource utilization for IC manufacturing. Thus, the demand for semiconductor photoresist stripping for IC manufacturing is driven by the need for high-performance, cost-effective, and environmentally sustainable solutions that support the production of advanced integrated circuits with complex designs and stringent performance requirements. Thus, these factors will boost the growth of the IC manufacturing segment of the market during the forecast period.
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North America is estimated to contribute 48% to the growth of the global market during the forecast period. Technavio's analysts have provided extensive insight into the market forecast, detailing the regional market trends and drivers influencing the market's trajectory throughout the forecast period. North America is home to a significant number of manufacturing facilities, particularly in the US. The region's robust semiconductor industry, driven by demand from various sectors, such as electronics, automotive, and telecommunications, contributes to the growth of the regional market. Continuous advancements in IC technology, including the development of smaller feature sizes, higher circuit densities, and advanced materials, drive the demand for more sophisticated solutions. Furthermore, government initiatives, grants, and incentives aimed at promoting innovation, manufacturing competitiveness, and technology adoption in the semiconductor industry contribute to regional market growth.
For instance, in August 2023 On February 28, 2023, the US Department of Commerce announced the first round of manufacturing incentives related to the CHIPS and Science Act (CHIPS Act). The CHIPS Act, passed by Congress in August 2022, provides USD 39 billion in federal funding for companies across the semiconductor value chain. Furthermore, collaboration between semiconductor manufacturers, equipment suppliers, and research institutions in North America accelerates the development and adoption of advanced solutions. Thus, these factors will boost the growth of the regional market during the forecast period.
The market forecasting report includes the adoption lifecycle of the market research and growth, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. Furthermore, the report also includes key purchase criteria and drivers of price sensitivity to help companies evaluate and develop their market growth and trends strategies.
Global Market Customer Landscape
Companies are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.
Brinnovate - The company offers semiconductor photoresist stripping such as JST wet benches that are suitable for wafer level and panel level wet processing.
Market analysis and report of qualitative and quantitative analysis of companies has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize companies as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize companies as dominant, leading, strong, tentative, and weak.
The market research report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2018 to 2028.
The Semiconductor Photoresist Stripping Market plays a crucial role in delivering high-quality semiconductor devices that power a wide range of electronic products. From smartphones, tablets, and laptops to automotive electronics and IoT (Internet of Things) devices, the demand for high-performance electronic devices continues to grow. Key players in the market, including Infineon Technologies AG, NXP Semiconductors N.V., and STMicroelectronics N.V., contribute significantly to the production of semiconductor devices for various applications, including consumer electronics and energy-efficient lighting solutions. The market is influenced by ongoing research and development activities, particularly in areas like renewable energy sources, LED lighting, and solar cells.
Moreover, as the industry focuses on meeting environmental regulations and embracing the future of semiconductor technologies, innovations in automation technologies, advancements in the automobile sector, and the emergence of MEMS (Micro-Electro-Mechanical Systems) and NEMS (Nano-Electro-Mechanical Systems) play pivotal roles. The market is closely tied to developments in nanotechnology, with companies like Intel leading the way. The adoption of automation technology, varied manufacturing models such as foundries, fabless models, and IDMs (Integrated Device Manufacturers) shapes the trajectory of the market, positioning it as a key player in the semiconductor industry.
Semiconductor Photoresist Stripping Market Scope |
|
Report Coverage |
Details |
Page number |
156 |
Base year |
2023 |
Historic period |
2018 2022 |
Forecast period |
2024-2028 |
Growth momentum & CAGR |
Accelerate at a CAGR of 6.51% |
Market Growth 2024-2028 |
USD 178.62 million |
Market structure |
Fragmented |
YoY growth 2023-2024(%) |
6.27 |
Regional analysis |
North America, Europe, APAC, South America, and Middle East and Africa |
Performing market contribution |
North America at 48% |
Key countries |
US, Canada, China, Germany, and France |
Competitive landscape |
Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks |
Key companies profiled |
Advanced Energy Industries Inc., Allwin21 Corp., Applied Materials Inc., Brewer Science Inc., Brinnovate, EV Group, Hitachi Ltd., Lam Research Corp., Mattson Technology Inc., Merck KGaA, MT Systems Inc., Nordson Corp., Oxford Instruments plc, Photonics Media, PSK Inc., Samco Inc., Screen Holdings Co. Ltd., TBS Holdings Inc., Trymax Semiconductor Equipment B.V., and Ulvac Inc. |
Market dynamics |
Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for the forecast period. |
Customization purview |
If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized. |
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1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Type
7 Market Segmentation by Application
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
13 Appendix
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