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The Chemical Mechanical Planarization Equipment Market size is forecast to increase by USD 702.42 million. The market is estimated to grow at a CAGR of 5.25% between 2023 and 2028. The growth rate of the market depends on several factors, including the rising adoption in the semiconductor industry, increasing demand for consumer electronics and electric vehicles, and technological advancements in CMP equipment.
This usually refers to chemical mechanical planarization equipment. It is used in semiconductor manufacturing and is essential for removing excess material from silicon wafers, ensuring a smooth and flat surface necessary for subsequent processing steps.
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The rising adoption of these in the industry is the key factor driving market growth. This is due to technological advancements, increased demand for advanced devices, and substantial investments in research and development. For instance, planarization Requirements whereas semiconductor devices become more complex with smaller feature sizes and three-dimensional structures, the need for precise planarization increases. This is a crucial process for achieving the required flatness and uniformity on semiconductor wafers.
Furthermore, the combined impact of these factors shows the important role in semiconductor manufacturing, supporting the industry's evolution toward smaller, more powerful, and sophisticated semiconductor devices. Therefore, it is positively impacting the chemical mechanical planarization equipment market. Hence, the rising adoption of CMP in the industry will drive the growth of the global market during the forecast period.
The increasing popularity of CMP in IC fabrication is the primary trend shaping market growth. This can be attributed to several factors such as reflecting the crucial role CMP plays in achieving the precision and quality required for modern semiconductor devices. For example, planarization of Multiple Layers where IC designs become more complex with multiple layers of materials, CMP is essential for planarizing each layer. It helps in achieving a smooth and even surface, ensuring proper functionality of the ICs.
Furthermore, as 3D IC integration becomes more prevalent, It plays a crucial role in planarizing and smoothing the surfaces of stacked layers. This is essential for maintaining the integrity of the vertically integrated components in 3D ICs. Therefore, it is positively impacting the market. Hence, the increasing popularity of CMP in IC fabrication will drive the growth of the global during the forecast period.
The cyclic nature of the industry is a challenge that affects market growth. The industry is a highly volatile market with huge margins of growth, which is followed by industry retrenchments. Factors such as excess production capacity, obsolescence of the technology used in the products, availability of new and upgraded products, and rapid price erosion of ICs affect the Chemical Mechanical Planarization Equipment Market drastically.
In addition, the cyclic nature of the global Chemical Mechanical Polishing Equipment market is also attributed to the bullwhip effect. The fluctuations in demand in end-user industries result in high supply and demand fluctuations in the supply chain. Therefore, it is positively impacting the market. Hence, such factors will hamper the growth of the global market during the forecast period.
The market share growth by the foundries segment will be significant during the forecast period. CMP tools are an integral part of semiconductor foundries, facilitating the production of high-performance and densely packed ICs. Its applications extend across various stages of the semiconductor manufacturing process, contributing to the creation of complex and advanced electronic devices.
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The foundries segment showed a gradual increase in the market share of USD 1.37 billion in 2018. One key application of this equipment in foundries is the planarization of semiconductor wafers, in which this equipment is primarily used for wafer cleaning and planarizing the surfaces of semiconductor wafers. In addition, during the fabrication process, multiple layers of materials, such as semiconductor materials, metals, and other films, are deposited on the wafer. This equipment helps to remove excess material and achieve a flat, smooth surface for subsequent processing steps. Hence, the rising use of this equipment in foundries will drive the growth of the foundries segment of the global market during the forecast period.
The 300mm type segment of the Chemical Mechanical Polishing Equipment is expected to grow at a significant rate. The term 300 mm in the context of CMP equipment refers to the size of the semiconductor wafers that the equipment is designed to process. A 300 mm wafer has a diameter of approximately 12 inches.
Furthermore, the term 300 mm in the context of CMP equipment refers to the size of the semiconductor wafers that the equipment is designed to process. A 300 mm wafer has a diameter of approximately 12 inches. This size is larger than the previous standard of 200 mm (8 inches) and offers several advantages, including increased manufacturing efficiency and higher chip yield per wafer. As a result, the 300mm is a major type segment, which in turn will drive the growth of the global sector during the forecast period.
The Chemical Mechanical Planarization (CMP) equipment market plays a crucial role in the semiconductor industry, particularly in microchip manufacturing. CMP technology is essential for achieving precise and uniform wafer polishing, a critical step in the wafer processing phase of semiconductor production.
As demand for smaller, faster, and more powerful microchips continues to grow, the need for advanced CMP equipment becomes increasingly important. These specialized tools enable the CMP process, which involves simultaneously applying chemical slurry and mechanical pressure to smooth and level the surface of semiconductor wafers.
Key players in the semiconductor equipment industry continuously invest in research and development to enhance CMP technology and improve semiconductor manufacturing tools. Market players rely on market research and growth analysis to stay ahead of market forecasting, ensuring they meet the evolving demands of the semiconductor market for efficient and reliable CMP equipment.
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APAC is estimated to contribute 39% to the growth of the global market during the forecast period. Technavio’s analysts have elaborately explained the regional industry trends and drivers that shape the market during the forecast period. China, Taiwan, South Korea, and Japan are the key contributors to the market in the region. A key factor for market growth in the region is the increasing investments by the Chinese government to raise the domestic production of ICs in the country instead of depending on imports from other firms. The Chinese government has laid out several plans and strategies that are focused on improving the domestic semiconductor manufacturing industry in the country.
In addition, the presence of a majority of prominent semiconductor foundries is driving the growth of the market in APAC. The region is the largest consumer of semiconductor devices and contributes a significant share of the total revenue of the industry due to the presence of dominant players in the consumer electronics and mobile devices industries. Hence, such factors will drive the Chemical Mechanical Polishing Equipment growth in the region during the forecast period.
This report includes the adoption lifecycle of the market, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. Furthermore, the report also includes key purchase criteria and drivers of price sensitivity to help companies evaluate and develop their growth strategies.
Global CMP Equipment Market Customer Landscape
Companies are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.
Alpsitec - The company offers CMP equipment such as Pcox 200s and Pcox20X, which are small, easy to use, and robust.
Amtech Systems Inc. - The company offers CMP equipment under the brand Entrepix.
Applied Materials Inc. - The company offers CMP equipment such as Mirra CMP 200mm, Opta CMP, Reflexion LK CMP, and others.
The research report also includes detailed analyses of the competitive landscape of the market and information about 20 market companies, including:
Qualitative and quantitative analysis of companies has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize companies as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize companies as dominant, leading, strong, tentative, and weak. As new entrants enter the market, competition intensifies, requiring accurate market data for informed decision-making. Effective distribution channels and competitive pricing strategies are essential to capture market share and overcome challenges in this dynamic industry.
In the Chemical Mechanical Planarization Equipment Market, services play a crucial role in facilitating developments and ensuring the planarization process is efficient. Achieving optimal planarity on wafer surfaces requires advanced equipment, such as CMP pads and precise forces control. Market players like Ebara Corporation are at the forefront of providing cutting-edge solutions for abrasion and etching in the semiconductor industry. With the rising market value and increasing demand for CMP consumables like CMP slurries, industry experts predict a surge in collaborations and innovation. Techcet's research findings provide valuable insights into the CMP slurry market, guiding manufacturers and suppliers in navigating the complexities of global semiconductor production.
In this market, optics play a crucial role in ensuring precision during the manufacturing process. Manufacturers must maintain order in their operations to maximize efficiency and productivity. The market shows great potential for growth due to the increasing demand for semiconductor devices. Through the combination of innovative technologies and expertise in the field, These equipment providers can address the rising volume of production requirements. However, they must navigate the complexity of semiconductor manufacturing processes and adhere to industry market definition standards.
This market analysis and report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2018-2028
CMP Equipment Market Scope |
|
Report Coverage |
Details |
Page number |
158 |
Base year |
2023 |
Historic period |
2018 - 2022 |
Forecast period |
2024-2028 |
Growth momentum & CAGR |
Accelerate at a CAGR of 5.25% |
Market growth 2024-2028 |
USD 702.42 million |
Market structure |
Fragmented |
YoY growth 2023-2024(%) |
4.84 |
Regional analysis |
APAC, North America, Europe, South America, and Middle East and Africa |
Performing market contribution |
APAC at 39% |
Key countries |
US, China, Japan, UK, and Germany |
Competitive landscape |
Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks |
Key companies profiled |
Alpsitec, Amtech Systems Inc., Applied Materials Inc., Axus Technology, DuPont de Nemours Inc., Ebara Corp., Entegris Inc., FLP Microfinishing GmbH, Hitachi Ltd., Kakou USA LLC., Kemet International Ltd., Logitech International SA, Okamoto Machine Tool Works Ltd., Stahli USA, Tokyo Seimitsu Co. Ltd., BASF SE, Lapmaster Wolters, Samsung Electronics Co. Ltd., Fraunhofer Gesellschaft, Revasum Inc. |
Market dynamics |
Parent market analysis, Market Growth and Trends, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for the forecast period. |
Customization purview |
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1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Application
7 Market Segmentation by Type
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
13 Appendix
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